CC3301 TI | Alldatasheet

Document overview

  • Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
  • PDF pages: 10

Technical content

CC330x SimpleLink™ Wi-Fi® 6 and Bluetooth® Low Energy Transceiver

1 Features

  • Highly optimized Wi-Fi® 6 and Bluetooth® Low Energy 5.2 system for low-cost industrial embedded applications
  • Designed to integrate with any MPU or MCU host capable of running a TCP/IP stack
  • Wi-Fi 6 – MAC, baseband, and RF transceiver with support for IEEE 802.11 b/g/n/ax – TWT and OFDMA for improved efficiency – Hardware-based encryption and decryption using supporting WPA2 and WPA3 – Excellent interoperability
  • Bluetooth Low Energy 5.2 – Bluetooth 5.2 supporting long-range and high- speed PHYs (up to 2 Mbps) – Host controller interface (HCI) transport for Bluetooth with option for shared SDIO or UART
  • Integrated 2.4-GHz PA for complete wireless solution with up to +20-dBm output power, enabling great Wi-Fi performance and longer BLE range
  • Operating temperature: -40°C to +105°C
  • Application throughput up to 50 Mbps
  • Support for 4-bit SDIO or SPI host interfaces
  • Enhanced Security – Secured host interface – Firmware authentication – Anti-rollback protection
  • Advanced Features – Multirole support (STA and AP) to connect directly with other Wi-Fi devices on different RF channels (Wi-Fi networks) – Optional antenna diversity or selection – 3-wire or 1-wire PTA for external coexistence with additional 2.4-GHz radios (for example, Thread or Zigbee)
  • Power Management – VMAIN, VIO, Vpp: 1.8 V – VPA: 2.1 V to 4.2 V
  • Clock Sources – 40-MHz XTAL fast clock – Internal LFOSC or external 32.768-kHz slow clock
  • Small Package Size – Easy to design with 40-pin, 5-mm x 5-mm quad flat noleaded (QFN) package, 0.4-mm pitch

2 Applications

  • Grid Infrastructure – Electricity Meter – String Inverter – Micro Inverter – Energy Storage Power Conversion System (PCS)
  • Building and Home Automation – HVAC Controller – HVAC Gateway – Thermostat – Building Security Gateway – Garage door system – IP network camera/ Video doorbell – Wireless security camera
  • Appliances – Refrigerator & freezer – Oven – Washer & dryer – Residential water heater & heating system – Air purifier & humidifier – Coffee machine – Air conditioner indoor unit – Vacuum robot – Robotic lawn mower
  • Medical – Infusion pump – Electronic hospital bed & bed control – Multiparameter patient monitor – Blood glucose monitor – Blood pressure monitor – CPAP machine – Telehealth systems – MRI – Ultrasound scanner – Ultrasound smart probe – Electric toothbrush
  • Retail Automation and Payment ADVANCE INFORMATION CC3301, CC3300 SWRS310 – MARCH 2023 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. ADVANCE INFORMATION for preproduction products; subject to change without notice.

3 Description

CC330x is a highly integrated single-chip WLAN and Bluetooth Low Energy device. The device is the 10th- generation connectivity combo chip from Texas Instruments. As such, the CC330x is based upon proven technology and complements the TI integrated devices for connectivity portfolio. This device is ideal for use in cost-sensitive embedded applications with a Linux or RTOS host running TCP/IP, where the peak throughput requirement is 50 Mbps maximum at the IP layer. CC330x brings the efficiency of Wi-Fi 6 to embedded device applications with a small PCB footprint and highly optimized bill of materials. Device Information PART NUMBER WLAN 2.4-GHz SISO Bluetooth Low Energy CC3300ENJARSBR ✔ CC3301ENJARSBR ✔ ✔ CC3301, CC3300 SWRS310 – MARCH 2023 www.ti.com ADVANCE INFORMATION

2 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated

Product Folder Links: CC3301 CC3300

4 System Diagram

Figure 4-1 shows a basic system diagram for the CC3301. CC3301 Wi-Fi and BLE Combo Transceiver System Power Clock User OTP Packet RAM Execution, Data RAM Wi-Fi and BLE Core Wi-Fi MAC, Modem BLE MAC, Modem 2.4GHz Wi-Fi, BLE RF ELPCryptoDMA Interfaces SDIO, SPI UART Coexistence Antenna Diversity SDIO / SPI UART Coexistence Power Clock nReset 2.4-GHz Antenna Figure 4-1. CC3301 High-Level System Diagram www.ti.com CC3301, CC3300 SWRS310 – MARCH 2023 ADVANCE INFORMATION Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: CC3301 CC3300

5 Mechanical, Packaging, and Orderable Information....5

Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version. DATE REVISION NOTES March 2022 * Initial Release CC3301, CC3300 SWRS310 – MARCH 2023 www.ti.com ADVANCE INFORMATION

4 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated

Product Folder Links: CC3301 CC3300

5 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. www.ti.com CC3301, CC3300 SWRS310 – MARCH 2023 ADVANCE INFORMATION Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: CC3301 CC3300

www.ti.com PACKAGE OUTLINE C 5.15 4.85 5.15 4.85 0.8 0.7 0.05 0.00 2X 3.6 36X 0.4 2X 3.6 40X 0.5 0.3 40X 0.25 0.15 3.5 0.1 (0.2) TYP WQFN - 0.8 mm max heightRSB0040B PLASTIC QUAD FLATPACK - NO LEAD 4219094/A 11/2018 0.08 C

0.1 C A B

0.05 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. PIN 1 INDEX AREA SEATING PLANE PIN 1 ID SYMMEXPOSED THERMAL PAD SYMM 11 20 3140 SCALE 3.000 AB CC3301, CC3300 SWRS310 – MARCH 2023 www.ti.com ADVANCE INFORMATION

6 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated

Product Folder Links: CC3301 CC3300

www.ti.com EXAMPLE BOARD LAYOUT 36X (0.4) (R0.05) TYP

0.05 MAX

0.05 MIN

40X (0.6) 40X (0.2) (4.8) (4.8) ( 3.5) ( 0.2) TYP VIA (0.6) TYP (0.9) TYP (0.6) TYP (0.9) TYP WQFN - 0.8 mm max heightRSB0040B PLASTIC QUAD FLATPACK - NO LEAD 4219094/A 11/2018 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. SYMM SYMM EXPOSED METAL SHOWN LAND PATTERN EXAMPLE SCALE: 20X SEE SOLDER MASK DETAIL 11 20 3140 METAL EDGE SOLDER MASK OPENING EXPOSED METAL METAL UNDER SOLDER MASK SOLDER MASK OPENING EXPOSED METAL NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS www.ti.com CC3301, CC3300 SWRS310 – MARCH 2023 ADVANCE INFORMATION Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 7 Product Folder Links: CC3301 CC3300

www.ti.com EXAMPLE STENCIL DESIGN 40X (0.6) 40X (0.2) 36X (0.4) (4.8) (4.8) 9X (1) (R0.05) TYP (1.2) TYP (1.2) TYP WQFN - 0.8 mm max heightRSB0040B PLASTIC QUAD FLATPACK - NO LEAD 4219094/A 11/2018 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. SOLDER PASTE EXAMPLE BASED ON 0.125 MM THICK STENCIL SCALE: 20X EXPOSED PAD 41 73% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SYMM SYMM 11 20 3140 METAL TYP CC3301, CC3300 SWRS310 – MARCH 2023 www.ti.com ADVANCE INFORMATION

8 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated

Product Folder Links: CC3301 CC3300

www.ti.com 2-Mar-2023 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead finish/ Ball material (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples XCC3300ENJARSBR PREVIEW WQFN RSB 40 3000 TBD Call TI Call TI -40 to 105 XCC3301ENJARSBR PREVIEW WQFN RSB 40 3000 TBD Call TI Call TI -40 to 105 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1

IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, regulatory or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources. TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products. TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2023, Texas Instruments Incorporated