CC3000YFVR

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Sample & Buy T echnical Documents Tools & Software Support & Community CC3000 www.ti.com SWRS126 –NOVEMBER 2012 TI SimpleLink™ CC3000 Module – Wi-Fi 802.11b/g Network Processor 1FEATURES • Operating temperature: –20°C to 70°C

Based on TI's seventh generation of proven 234• Wireless network processor Wi-Fi solutions– IEEE 802.11 b/g
Complete platform solution including user and– Embedded IPv4 TCP/IP stack porting guides, API guide, sample• Best-in-class radio performanceWi-Fi™ applications, and support community – TX power: +18.0 dBm at 11 Mbps, CCK – RX sensitivity: –88 dBm, 8% PER, 11 Mbps APPLICATIONS
Works with low MIPS and low-cost MCUs with • Home automation compact memory footprint • Home security
FCC, IC, and CE certified with a chip antenna • Connected appliances
HW design files and design guide available • Smart energyfrom TI • M2M communication• Integrated crystal and power management
Small form factor: 16.3 mm × 13.5 mm × 2 mm

DESCRIPTION

The TI CC3000 module is a self-contained wireless network processor that simplifies the implementation of Internet connectivity (seeFigure 1). TI's SimpleLink™ Wi-Fi solution minimizes the software requirements of the host microcontroller (MCU) and is thus the ideal solution for embedded applications using any low-cost and low- power MCU. The TI CC3000 module reduces development time, lowers manufacturing costs, saves board space, eases certification, and minimizes the RF expertise required. This complete platform solution includes software drivers, sample applications, API guide, user documentation, and a world-class support community. For more information on TI’s wireless platform solutions for Wi-Fi, go to TI's Wireless Connectivity wiki (www.ti.com/connectivitywiki). Figure 1. Wi-Fi Solution for TI SimpleLink CC3000 Module Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2SimpleLink, Smart Config are trademarks of Texas Instruments. 3Wi-Fi is a trademark of Wi-Fi Alliance. 4All other trademarks are the property of their respective owners. necessarily include testing of all parameters.

SWRS126 –NOVEMBER 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

FEATURES

802.11b/g integrated radio, modem, and MAC supporting WLAN communication as a BSS station with CCK and OFDM rates from 1 to 54 Mbps in the 2.4-GHz ISM band
Auto-calibrated radio with a single-ended 50-Ω interface enables easy connection to the antenna without requiring expertise in radio circuit design.
Advanced connection manager with seven user-configurable profiles stored in an NVMEM allows automatic fast connection to an access point without user or host intervention.
Supports all Wi-Fi security modes for personal networks: WEP, WPA, and WPA2 with on-chip security accelerators
Smart Config™ WLAN provisioning tools allow customers to connect a headless device to a WLAN network using a smart phone, tablet, or PC. Network Stack
Integrated IPv4 TCP/IP stack with BSD socket APIs enables simple internet connectivity with any microcontroller, microprocessor, or ASIC.
Supports four simultaneous TCP or UDP sockets
Built-in network protocols: ARP, ICMP, DHCP client, and DNS client enable easy connection to the local network and to the Internet. Host Interface and Driver
Interfaces over 4-wire serial peripheral interface (SPI) with any microcontroller, or processor at clock speed up to16 MHz
Low footprint driver provided for TI MCUs and easily ported to any processor or ASIC
Simple APIs enable easy integration with any single-threaded or multi-threaded application. System
Works from a single, preregulated power supply or connects directly to a battery
Separated I/O voltage rail allows flexible integration with host processors
Ultra-low leakage shut-down mode with current <5 µA
Integrated clock sources EEPROM
Integrated EEPROM stores firmware patch, network configuration, and MAC address.
Programmable through an I2C interface or over APIs from the host, allowing over-the-air firmware upgrades
Can store 5 KB of user data accessible to the host application, enhancing the MCU NVM

2 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated

Product Folder Links:CC3000 Not Recommended For New Designs

13.5000 16.3000 0.5000 0.7000 1.2000 0.3000 1.9000 1.9000 2.1000 1.7000 1.9000 2.4000 1.9000 2.1000 1.2000 1.20000.7000 1.9000 Unit: mm 36 29 4643 4037 38 41 4239 4544 181 PIN-1 SWRS126-002 CC3000 www.ti.com SWRS126 –NOVEMBER 2012

PACKAGE INFORMATION

For the PCB layout of your applications, TI recommends the footprint shown inFigure 2. Figure 2. CC3000 Module Footprint and Pinouts Table 1describes the CC3000 module pins. Table 1. CC3000 Module Pins Description

1 GND GND — — — Ground

2 Reserved_1 — — — 1.8 V Reserved. Connect to test point.

3 NC — — — — Not connected

4 Reserved_2 — — — 1.8 V Reserved. Connect to test point.

5 WL_EN2 (1) I Hi-Z — — Mode setting

6 WL_RS232_TX (2) O Hi-Z Force 1 1.8 V RS232 test-mode signal (1.8-V logic).

7 WL_EN1 I Hi-Z — — Mode setting

8 WL_RS232_RX (2) I Hi-Z PU 1.8 V RS232 test-mode signal (1.8-V logic).

9 GND GND — — — Ground

10 GND GND — — — Ground

11 GND GND — — — Ground

12 SPI_CS I Hi-Z PU VIO_HOST Host interface SPI chip-select (CS)

13 SPI_DOUT O Hi-Z PU VIO_HOST Host interface SPI data out

14 SPI_IRQ O Hi-Z Force 1 VIO_HOST Host interface SPI interrupt

(1) Connect WL_EN1 to WL_EL2 for proper operation of the module. (2) Leave unconnected in function module.

Table 1. CC3000 Module Pins Description (continued)

15 SPI_DIN I Hi-Z PU VIO_HOST Host interface SPI data in

16 GND GND — — — Ground

17 SPI_CLK I Hi-Z PD VIO_HOST Host interface SPI clock

18 GND GND — — — Ground

20 GND GND — — — Ground

21 EXT_32K — — — — Not used. Connect to ground.

22 GND GND — — — Ground

23 VIO_HOST Power — — VIO_HOST VIO host supply voltage

24 Reserved 3 — — — — Reserved. Connect to test point.

25 GND GND — — — Ground

26 VBAT_SW_EN I — — VIO_HOST Module enable. Connect to host GPIO.

31 GND GND — — — Ground

32 GND GND — — — Ground

33 GND GND — — — Ground

34 GND GND — — — Ground

35 RF_ANT RF — — — WLAN antenna port, 50-Ω single

36 GND GND — — — Ground

37 GND GND — — — Ground

38 GND GND — — — Ground

39 GND GND — — — Ground

40 GND GND — — — Ground

41 GND GND — — — Ground

42 GND GND — — — Ground

43 GND GND — — — Ground

44 GND GND — — — Ground

45 GND GND — — — Ground

46 GND GND — — — Ground

(3) Connect SDA_EEPROM and SDA_CC3000 through a 0-Ω resistor. (4) Connect SLC_EEPROM and SLC_CC3000 through a 0-Ω resistor.

4 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated

cause damage. ESD damage can range from subtle performance degradation to complete device failure. not to meet their published specifications. Table 2describes the ESD performance. Table 2. ESD Performance

1000 V 500 V

SWRS126 –NOVEMBER 2012 www.ti.com Power Consumption Parameters Test Conditions Typ Max Unit VBAT = 3.6 V Tamb = +25°C 802.11b TX current Po = 18 dBm, 11 Mbps 260 275 mA L = 2048 bytes tdelay (idle) = 40 µs VBAT = 3.6 V Tamb = +25°C 802.11g TX current Po = 14 dBm, 54 Mbps 190 207 mA L = 2048 tdelay (idle) = 40 µs 802.11bg RX current VBAT = 3.6 V 92 103 mA VBAT = 3.6 VShut-down mode 5 µAVBAT_SW_EN = 0 V WLAN Transmitter RF Characteristics (TA = +25°C, VBAT = 3.6 V) Characteristics Condition Min Typ Max Unit (Mbps) 1 18.3 2 18.2 11 18.1 6 17.0Maximum RMS output power 9 17.0 dBm 18 17.0 36 15.5 54 14.0 In-band power ±1variation Transmit center ±20 ppmfrequency accuracy Receiver RF Characteristics (TA = +25°C, VBAT = 3.6 V) Characteristics Condition Min Typ Max Unit (Mbps) 1 DSSS –97.5 2 DSSS –95.0 11 CCK –89.0 6 OFDM –91.0 Sensitivity dBm 9 OFDM –91.0 18 OFDM –87.0 36 OFDM –81.0 54 OFDM –75.0 802.11b –10 Maximum input level dBm 802.11g –20

Product Folder Links:CC3000 Not Recommended For New Designs

Table 4lists the SPI timing parameters. Table 4. SPI Timing Parameters (1) The SPI_CS signal is considered to be asynchronous. (2) In this example, launch is on the rising edge, and capture is on the falling edge. The opposite scheme can be configured.

external PC-based software test utility, during development and evaluation phase (seeFigure 6and Table 6). The CC3000 radio test tool utility can be obtained from the CC3000 TI wiki (www.ti.com/connectivitywiki). Figure 6. CC3000 Test Mode Serial Interface Connection Table 6. CC3000 Test Mode Debug Interface Description (1) WL_EN2 pins must be grounded while bringing up the CC3000 radio tool. temperature (TC ) for the module is 250°C. Figure 7shows the mechanical outline for the CC3000 module. Figure 7. CC3000 Module Mechanical Outline

CC3000 Radio Tool Connection 1.8V. Internal Power FET Switch Enable. Voltage level of the Host Interface. Connect to Host SPI Interface. Figure 9shows the schematics for the CC3000 to host reference design. Figure 9. CC3000 Module to Host Reference Design MCU can be the same or different. Table 9lists the bill of materials. Table 9. Bill of Materials (1) Any component with similar values can be used.

This section describes the layout recommendations for the CC3000 module, RF trace, and antenna. EVM board as well as the RF trace routing from the CC3000 module. Figure 10. RF Trace and Antenna Design for PCB Layout

Have a solid ground plane and ground vias under the module for stable system and thermal dissipation.
Do not run signal traces underneath the module on a layer where the module is mounted.
Signal traces can be run on a third layer under the solid ground layer and beneath the module mounting layer. Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 13 Product Folder Links:CC3000 Not Recommended For New Designs

Figure 11. Module Layout

RF traces must have 50-Ω impedance (microstrip transmission line).
RF trace bends must be gradual with a maximum bend of approximately 45 degrees and with trace mitered. RF traces must not have sharp corners.
There must be no traces or ground under the antenna section.
RF traces must have via stitching on the ground plane beside the RF trace on both sides.
RF traces must be as short as possible. The antenna, RF traces, and the module must be on the edge of the PCB product in consideration of the product enclosure material and proximity.

www.ti.com 1-Dec-2015 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples CC3000MOD NRND 46 TBD Call TI Call TI -20 to 70 CC3000MODR NRND 46 TBD Call TI Call TI -20 to 70 CC3000MODT NRND 46 TBD Call TI Call TI CC3000YFVR NRND DSBGA YFV 126 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM CC3000 CC3000YFVT NRND DSBGA YFV 126 TBD Call TI Call TI CC3000 XCC3000MOD OBSOLETE 46 TBD Call TI Call TI -20 to 70 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.

www.ti.com 1-Dec-2015 Addendum-Page 2 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2016 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CC3000YFVR DSBGA YFV 126 0 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2016 Pack Materials-Page 2

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Product Information

CC3000YFVR specifications and overview.

Summary

Module ??Wi-Fi 802.11b/g Network Processor

Description