CC2640F128RGZ

CC2640_15 TI | Alldatasheet

Document overview

• Manufacturer or author: Texas Instruments, Incorporated [SWRS176,*]
• PDF pages: 51

Technical content

Sample & Buy T echnical Documents Tools & Software Support & Community CC2640 SWRS176 –FEBRUARY 2015 CC2640SimpleLink™ Bluetooth®SmartWirelessMCU

1 Device Overview

1.1 Features

– Very Few External Components• Microcontroller – Seamless Integration With the SimpleLink– Powerful ARM® Cortex®-M3 CC2590 and CC2592 Range Extenders– EEMBC CoreMark® score: 142 – Active-mode Sensor Controller: 8.2 µA/MHz• Efficient Code Size Architecture, Placing Drivers, – Standby: 1 µA (RTC Running and RAM/CPUBluetooth® Low Energy Controller, and Bootloader Retention)in ROM – Shutdown: 100 nA (Wake-up on External• RoHS-Compliant Packages Events)– 4-mm × 4-mm RSM QFN32 (10 GPIOs)

• RF Section– 5-mm × 5-mm RHB QFN32 (15 GPIOs) – 2.4 GHz RF Transceiver Compatible With– 7-mm x 7-mm RGZ QFN48 (31 GPIOs) Bluetooth Low Energy (BLE) 4.1 specification• Peripherals – Excellent Receiver Sensitivity (–97 dBm for– All Digital Peripheral Pins can be Routed to any BLE), Selectivity, and Blocking PerformanceGPIO – Programmable Output Power up to +5 dBm– 4 General-Purpose Timer Modules (8 × 16-Bit or – Single-ended or Differential RF Interface4 × 32-Bit Timer, PWM Each) – Suitable for Systems Targeting Compliance With– 12-Bit ADC, 200-ksamples/s, 8-Channel Analog Worldwide Radio Frequency RegulationsMUX
• ETSI EN 300 328 (Europe)– Continuous Time Comparator
• EN 300 440 Class 2 (Europe)– Ultra-Low Power Analog Comparator
• FCC CFR47 Part 15 (US)– Programmable Current Source
• ARIB STD-T66 (Japan)– UART
• Tools and Development Environment– 2x SSI (SPI, µW, TI) – Full-Feature and Low-Cost Development Kits– I2C – Multiple Reference Designs for Different RF– I2S Configurations– Real-Time Clock (RTC) – Packet Sniffer PC Software– AES-128 Security Module – Sensor Controller Studio– True Random Number Generator (TRNG) – SmartRF™ Studio– 10, 15, or 31 GPIOs, Depending on Package – SmartRF Flash Programmer 2Option – IAR Embedded Workbench® for ARM– Support for 8 Capacitive Sensing Buttons – Code Composer Studio™– Integrated Temperature Sensor
• External System – On-Chip internal DC-DC Converter An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.

SWRS176 –FEBRUARY 2015 www.ti.com

1.2 Applications

• Home and Building Automation • Health and Medical – Connected Appliances – Thermometers – Lighting – SpO2 – Locks – Blood Glucose and Pressure Meters – Gateways – Weight-scales – Security Systems – Vitals Monitoring – Hearing Aids• Industrial – Logistics • Sports and Fitness – Production and Manufacturing – Activity Monitors and Fitness Trackers – Automation – Heart Rate Monitors – Asset Tracking and Management – Running Sensors – Remote Display – Biking Sensors – Cable Replacement – Sports Watches – HMI – Gym Equipment – Access Control – Team Sports Equipment
• Retail • HID – Beacons – Remote Controls – Advertising – Keyboards and Mice – ESL / Price Tags – Gaming – Point of Sales / Payment Systems • Accessories – Toys – Trackers – Luggage-tags – Wearables

1.3 Description

The CC2640 is a wireless MCU targeting Bluetooth Smart applications. The device is a member of the CC26xx family of cost-effective, ultra-low power, 2.4-GHz RF devices. Very low active RF and MCU current, and low-power mode current consumption provides excellent battery lifetime and allows operation on small coin cell batteries and in energy-harvesting applications. The CC2640 contains a 32-bit ARM Cortex-M3 running at 48-MHz as the main processor and a rich peripheral feature set, including a unique ultra-low power sensor controller, ideal for interfacing external sensors and/or collecting analog and digital data autonomously while the rest of the system is in sleep mode. This makes the CC2640 ideal for a wide range of applications where long battery lifetime, small form factor, and ease of use is important. The Bluetooth Low Energy controller is embedded into ROM and run partly on an ARM Cortex®-M0 processor. This architecture improves overall system performance and power consumption and frees up flash memory for the application. The Bluetooth Smart stack is available free of charge from www.ti.com. Device Information(1) PART NUMBER PACKAGE BODY SIZE CC2640F128RGZ RGZ (QFN48) 7.00 mm × 7.00 mm CC2640F128RHB RHB (QFN32) 5.00 mm × 5.00 mm (1) For more information, see Section 9, Mechanical Packaging and Orderable Information.

2 Device Overview Copyright © 2015, Texas Instruments Incorporated

Submit Documentation Feedback Product Folder Links: CC2640

www.ti.com SWRS176 –FEBRUARY 2015 Device Information(1) (continued) PART NUMBER PACKAGE BODY SIZE CC2640F128RSM RSM (QFN32) 4.00 mm × 4.00 mm Copyright © 2015, Texas Instruments Incorporated Device Overview 3 Submit Documentation Feedback Product Folder Links: CC2640

SWRS176 –FEBRUARY 2015 www.ti.com

1.4 Functional Block Diagram

Section 1.4 shows a block diagram for the CC2640. Figure 1-1. Block Diagram

4 Device Overview Copyright © 2015, Texas Instruments Incorporated

Submit Documentation Feedback Product Folder Links: CC2640

www.ti.com SWRS176 –FEBRUARY 2015 Table of Contents Copyright © 2015, Texas Instruments Incorporated Table of Contents 5 Submit Documentation Feedback Product Folder Links: CC2640

SWRS176 –FEBRUARY 2015 www.ti.com

2 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version. DATE REVISION NOTES February 2015 * Initial Release

6 Revision History Copyright © 2015, Texas Instruments Incorporated

Submit Documentation Feedback Product Folder Links: CC2640

www.ti.com SWRS176 –FEBRUARY 2015

3 Device Comparison

Table 3-1. Device Family Overview Device PHY Support Flash (KB) RAM (KB) GPIO Package(1) CC2650F128xxx Multi-Protocol(2) 128 20 31, 15, 10 RGZ, RHB, RSM CC2640F128xxx Bluetooth low energy 128 20 31, 15, 10 RGZ, RHB, RSM CC2630F128xxx IEEE 802.15.4 ( ZigBee®/6LoWPAN) 128 20 31, 15, 10 RGZ, RHB, RSM CC2620F128xxx IEEE 802.15.4 (RF4CE) 128 20 31, 15, 10 RGZ, RHB, RSM (1) Package designator replaces the xxx in device name to form a complete device name, RGZ is 7-mm x 7-mm QFN48, RHB is 5-mm x 5- mm QFN32, and RSM is 4-mm x 4-mm QFN32. (2) The CC2650 supports all PHYs and can be reflashed to run all the supported standards. Copyright © 2015, Texas Instruments Incorporated Device Comparison 7 Submit Documentation Feedback Product Folder Links: CC2640

30 QFN32 4x4

DIO_6 VSS DIO_5 RESET_N VSS VDDS_DCDC DCDC_SW DIO_7 VDDR_RF X24M_N X24M_P VSS VDDR DIO_9 VDDS DIO_8 DIO_1 JTAG_TMSC DIO_2 DCOUPL VDDS2 JTAG_TCKC DIO_3 DIO_4 RF_P RF_N VSS X32K_Q2 VSS DIO_0 RX_TX X32K_Q1 CC2640 SWRS176 –FEBRUARY 2015 www.ti.com

4 Terminal Configuration and Functions

I/O pins marked in bold have high drive capabilities. I/O pins marked in italics have analog capabilities.

4.1 Pin Diagram – RSM Package

Figure 4-1. RSM (4 mm × 4 mm) Pinout, 0.4-mm Pitch

4.2 Signal Descriptions – RSM Package

Table 4-1. Signal Descriptions – RSM Package Pin Name Pin Pin Type Description RF_P 1 RF I/O Positive RF input signal to LNA during RX Positive RF output signal to PA during TX RF_N 2 RF I/O Negative RF input signal to LNA during RX Negative RF output signal to PA during TX RX_TX 4 RF I/O Optional bias pin for the RF LNA VDDS 27 Power 1.8 V to 3.8 V main chip supply(1) VDDS2 11 Power 1.8 V to 3.8 V GPIO supply(1) VDDS_DCDC 19 Power 1.8 V to 3.8 V DC/DC supply. Tie to ground for external regulator mode (1.7 V to 1.95 V operation) VDDR 28 Power 1.7 V to 1.95 V supply, typically connect to output of internal DC/DC(2)(3) VDDR_RF 32 Power 1.7 V to 1.95 V supply, typically connect to output of internal DC/DC(4)(3) DCOUPL 12 Power 1.27 V regulated digital-supply decoupling capacitor(3) VSS 3, 7, 17, 20, 29 Power Ground (1) See Section 8.2, technical reference manual for more details. (2) If internal DC/DC is not used, this pin is supplied internally from the main LDO. (3) Do not supply external circuitry from this pin. (4) If internal DC/DC is not used, this pin must be connected to VDDR for supply from the main LDO.

8 Terminal Configuration and Functions Copyright © 2015, Texas Instruments Incorporated

Submit Documentation Feedback Product Folder Links: CC2640

30 QFN32 5x5

DIO_10 DIO_7 DIO_9 DIO_8 DCDC_SW RESET_N VDDS_DCDC DIO_11 VDDR_RF X24M_N X24M_P VDDR VDDS DIO_13 DIO_14 DIO_12 DIO_3 JTAG_TMSC DIO_4 DCOUPL VDDS2 JTAG_TCKC DIO_5 DIO_6 RF_P RF_N RX_TX DIO_0 DIO_1 DIO_2 X32K_Q1 X32K_Q2 CC2640 www.ti.com SWRS176 –FEBRUARY 2015 Table 4-1. Signal Descriptions – RSM Package (continued) Pin Name Pin Pin Type Description DCDC_SW 18 Power Output from internal DC/DC(1). Tie to ground for external regulator mode (1.7 V to 1.95 V operation) EGP Power Ground – Exposed Ground Pad RESET_N 21 Digital input Reset, active-low. No internal pullup DIO_0 8 Digital I/O GPIO, Sensor Controller, High drive capability DIO_1 9 Digital I/O GPIO, Sensor Controller, High drive capability DIO_2 10 Digital I/O GPIO, Sensor Controller, High drive capability DIO_3 15 Digital I/O GPIO, High drive capability, JTAG_TDO DIO_4 16 Digital I/O GPIO, High drive capability, JTAG_TDI DIO_5 22 Digital/Analog I/O GPIO, Sensor Controller, Analog DIO_6 23 Digital/Analog I/O GPIO, Sensor Controller, Analog DIO_7 24 Digital/Analog I/O GPIO, Sensor Controller, Analog DIO_8 25 Digital/Analog I/O GPIO, Sensor Controller, Analog DIO_9 26 Digital/Analog I/O GPIO, Sensor Controller, Analog JTAG_TMSC 13 Digital I/O JTAG TMSC JTAG_TCKC 14 Digital I/O JTAG TCKC X32K_Q1 5 Analog I/O 32 kHz crystal oscillator pin 1 X32K_Q2 6 Analog I/O 32 kHz crystal oscillator pin 2 X24M_N 30 Analog I/O 24 MHz crystal oscillator pin 1 X24M_P 31 Analog I/O 24 MHz crystal oscillator pin 2

4.3 Pin Diagram – RHB Package

Figure 4-2. RHB (5 mm × 5 mm) Pinout, 0.5-mm Pitch Copyright © 2015, Texas Instruments Incorporated Terminal Configuration and Functions 9 Submit Documentation Feedback Product Folder Links: CC2640

SWRS176 –FEBRUARY 2015 www.ti.com

4.4 Signal Descriptions – RHB Package

Table 4-2. Signal Descriptions – RHB Package Pin Name Pin Pin Type Description RF_P 1 RF I/O Positive RF input signal to LNA during RX Positive RF output signal to PA during TX RF_N 2 RF I/O Negative RF input signal to LNA during RX Negative RF output signal to PA during TX RX_TX 3 RF I/O Optional bias pin for the RF LNA VDDS 28 Power 1.8 V to 3.8 V main chip supply(1) VDDS2 11 Power 1.8 V to 3.8 V GPIO supply(1) VDDS_DCDC 18 Power 1.8 V to 3.8 V DC/DC supply VDDR 29 Power 1.7 V to 1.95 V supply, typically connect to output of internal DC/DC(2)(3) VDDR_RF 32 Power 1.7 V to 1.95 V supply, typically connect to output of internal DC/DC(4)(3) DCOUPL 12 Power 1.27 V regulated digital-supply decoupling(3) DCDC_SW 17 Power Output from internal DC/DC(1) EGP Power Ground – Exposed Ground Pad RESET_N 19 Digital input Reset, active-low. No internal pullup DIO_0 6 Digital I/O GPIO, Sensor Controller DIO_1 7 Digital I/O GPIO, Sensor Controller DIO_2 8 Digital I/O GPIO, Sensor Controller, High drive capability DIO_3 9 Digital I/O GPIO, Sensor Controller, High drive capability DIO_4 10 Digital I/O GPIO, Sensor Controller, High drive capability DIO_5 15 Digital I/O GPIO, High drive capability, JTAG_TDO DIO_6 16 Digital I/O GPIO, High drive capability, JTAG_TDI DIO_7 20 Digital/Analog I/O GPIO, Sensor Controller, Analog DIO_8 21 Digital/Analog I/O GPIO, Sensor Controller, Analog DIO_9 22 Digital/Analog I/O GPIO, Sensor Controller, Analog DIO_10 23 Digital/Analog I/O GPIO, Sensor Controller, Analog DIO_11 24 Digital/Analog I/O GPIO, Sensor Controller, Analog DIO_12 25 Digital/Analog I/O GPIO, Sensor Controller, Analog DIO_13 26 Digital/Analog I/O GPIO, Sensor Controller, Analog DIO_14 27 Digital/Analog I/O GPIO, Sensor Controller, Analog JTAG_TMSC 13 Digital I/O JTAG TMSC, High drive capability JTAG_TCKC 14 Digital I/O JTAG TCKC X32K_Q1 4 Analog I/O 32 kHz crystal oscillator pin 1 X32K_Q2 5 Analog I/O 32 kHz crystal oscillator pin 2 X24M_N 30 Analog I/O 24 MHz crystal oscillator pin 1 X24M_P 31 Analog I/O 24 MHz crystal oscillator pin 2 (1) See Section 8.2, technical reference manual for more details. (2) If internal DC/DC is not used, this pin is supplied internally from the main LDO. (3) Do not supply external circuitry from this pin. (4) If internal DC/DC is not used, this pin must be connected to VDDR for supply from the main LDO.

10 Terminal Configuration and Functions Copyright © 2015, Texas Instruments Incorporated

Submit Documentation Feedback Product Folder Links: CC2640

DIO_25 38 DIO_24 37 DCDC_SW33 DIO_18 RESET_N35 DIO_2336 X32K_Q2 4 X32K_Q1 3 RF_N 2 RF_P 1 DIO_2232 DIO_2131 DIO_2030 DIO_1929 DIO_0 5 DIO_1 6 DIO_2 7 JTAG_TCKC25 CC26xx QFN48 7x7 RGZ DIO_15 DIO_14 VDDR 45 VDDR_RF 48 DIO_17 DIO_16 VDDS_DCDC DIO_26 DIO_12 DIO_13 VDDS2 DIO_11 DIO_10 DIO_5 DIO_6 DIO_7 DIO_3 DIO_4 X24M_P X24M_N DIO_8 DIO_9 DIO_28 VDDS3 DCOUPL JTAG_TMSC DIO_29 DIO_30 DIO_27 VDDS CC2640 www.ti.com SWRS176 –FEBRUARY 2015

4.5 Pin Diagram – RGZ Package

Figure 4-3. RGZ (7 mm × 7 mm) Pinout, 0.5-mm Pitch

4.6 Signal Descriptions – RGZ Package

Table 4-3. Signal Descriptions – RGZ Package Pin Name Pin Pin Type Description RF_P 1 RF I/O Positive RF input signal to LNA during RX Positive RF output signal to PA during TX RF_N 2 RF I/O Negative RF input signal to LNA during RX Negative RF output signal to PA during TX VDDS 44 Power 1.8 V to 3.8 V main chip supply(1) VDDS2 13 Power 1.8 V to 3.8 V DIO supply(1) VDDS3 22 Power 1.8 V to 3.8 V DIO supply(1) VDDS_DCDC 34 Power 1.8 V to 3.8 V DC/DC supply VDDR 45 Power 1.7 V to 1.95 V supply, typically connect to output of internal DC/DC(2)(3) VDDR_RF 48 Power 1.7 V to 1.95 V supply, typically connect to output of internal DC/DC(4)(3) DCOUPL 23 Power 1.27 V regulated digital-supply decoupling capacitor(3) EGP Power Ground – Exposed Ground Pad DCDC_SW 33 Power Output from internal DC/DC(1) RESET_N 35 Digital input Reset, active-low. No internal pullup DIO_0 5 Digital I/O GPIO, Sensor Controller (1) See Section 8.2, technical reference manual for more details. (2) If internal DC/DC is not used, this pin is supplied internally from the main LDO. (3) Do not supply external circuitry from this pin. (4) If internal DC/DC is not used, this pin must be connected to VDDR for supply from the main LDO. Copyright © 2015, Texas Instruments Incorporated Terminal Configuration and Functions 11 Submit Documentation Feedback Product Folder Links: CC2640

SWRS176 –FEBRUARY 2015 www.ti.com Table 4-3. Signal Descriptions – RGZ Package (continued) Pin Name Pin Pin Type Description DIO_1 6 Digital I/O GPIO, Sensor Controller DIO_2 7 Digital I/O GPIO, Sensor Controller DIO_3 8 Digital I/O GPIO, Sensor Controller DIO_4 9 Digital I/O GPIO, Sensor Controller DIO_5 10 Digital I/O GPIO, Sensor Controller, High drive capability DIO_6 11 Digital I/O GPIO, Sensor Controller, High drive capability DIO_7 12 Digital I/O GPIO, Sensor Controller, High drive capability DIO_8 14 Digital I/O GPIO DIO_9 15 Digital I/O GPIO DIO_10 16 Digital I/O GPIO DIO_11 17 Digital I/O GPIO DIO_12 18 Digital I/O GPIO DIO_13 19 Digital I/O GPIO DIO_14 20 Digital I/O GPIO DIO_15 21 Digital I/O GPIO DIO_16 26 Digital I/O GPIO, JTAG_TDO, High drive capability DIO_17 27 Digital I/O GPIO, JTAG_TDI, High drive capability DIO_18 28 Digital I/O GPIO DIO_19 29 Digital I/O GPIO DIO_20 30 Digital I/O GPIO DIO_21 31 Digital I/O GPIO DIO_22 32 Digital I/O GPIO DIO_23 36 Digital/Analog I/O GPIO, Sensor Controller, Analog DIO_24 37 Digital/Analog I/O GPIO, Sensor Controller, Analog DIO_25 38 Digital/Analog I/O GPIO, Sensor Controller, Analog DIO_26 39 Digital/Analog I/O GPIO, Sensor Controller, Analog DIO_27 40 Digital/Analog I/O GPIO, Sensor Controller, Analog DIO_28 41 Digital/Analog I/O GPIO, Sensor Controller, Analog DIO_29 42 Digital/Analog I/O GPIO, Sensor Controller, Analog DIO_30 43 Digital/Analog I/O GPIO, Sensor Controller, Analog JTAG_TMSC 24 Digital I/O JTAG TMSC, High drive capability JTAG_TCKC 25 Digital I/O JTAG TCKC X32K_Q1 3 Analog I/O 32 kHz crystal oscillator pin 1 X32K_Q2 4 Analog I/O 32 kHz crystal oscillator pin 2 X24M_N 46 Analog I/O 24 MHz crystal oscillator pin 1 X24M_P 47 Analog I/O 24 MHz crystal oscillator pin 2

12 Terminal Configuration and Functions Copyright © 2015, Texas Instruments Incorporated

Submit Documentation Feedback Product Folder Links: CC2640

www.ti.com SWRS176 –FEBRUARY 2015

5 Specifications

5.1 Absolute Maximum Ratings(1)(2)

[over operating free-air temperature range (unless otherwise noted)] Under no circumstances must the absolute maximum ratings be violated. Stress exceeding one or more of the limiting values may cause permanent damage to the device. MIN MAX UNIT VDDR supplied by internal DC/DC regulator orSupply voltage, VDDS(3) –0.3 4.1 Vinternal GLDO External regulator mode (VDDS and VDDR pinsSupply voltage, VDDS(3) and VDDR –0.3 2.25 Vconnected on PCB) VDDS+0.3, maxVoltage on any digital pin(4) –0.3 V4.1 Voltage on crystal oscillator pins, VDDR+0.3, maxX32K_Q1, X32K_Q2, X24M_N and –0.3 V2.25X24M_P Internal fixed or relative reference, voltage –0.3 VDDSscaling enabled Internal fixed reference, voltage scaling disabled –0.3 1.49 Internal relative reference, voltage scalingVoltage on ADC input (Vin) –0.3 VDDS / 2.9 Vdisabled min (Vref × 2.9,External reference, voltage scaling enabled –0.3 VDDS) External reference, voltage scaling disabled –0.3 Vref Voltage on external ADC reference –0.3 1.6 V(Vref) Input RF level +5 dBm Tstg Storage temperature –40 150 °C (1) All voltage values are with respect to VDDS, unless otherwise noted. (2) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (3) VDDS2 and VDDS3 needs to be at the same potential as VDDS. (4) Including analog capable DIO.

5.2 ESD Ratings

Human Body Model (HBM), per ANSI/ESDA/JEDEC All pins ±2500JS001(1) Electrostatic dischargeVESD V(ESD) performance: RF pins ±750 Charged Device Model (CDM), per JESD22-C101(2) non-RF pins ±750 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

5.3 Recommended Operating Conditions

The operating conditions for CC2640 are listed below. MIN MAX UNIT Ambient temperature range –40 85 °C Operating supply voltage For operation in 1.8 V systems (VDDS and VDDR), external (VDDS and VDDR pins connected on PCB, internal DC/DC 1.7 1.95 V regulator mode cannot be used) Operating supply voltage For operation in battery-powered and 3.3 V systems 1.8 3.8 V(VDDS) (internal DC/DC can be used to minimize power consumption) Rising supply voltage slew rate 0 100 mV/us Falling supply voltage slew rate 0 20 mV/us Copyright © 2015, Texas Instruments Incorporated Specifications 13 Submit Documentation Feedback Product Folder Links: CC2640

SWRS176 –FEBRUARY 2015 www.ti.com Recommended Operating Conditions (continued) The operating conditions for CC2640 are listed below. MIN MAX UNIT Falling supply voltage slew rate, 3 mV/uswith low-power flash settings(1) Positive temperature gradient in No limitation for negative temperature gradient, or outside 5 °C/sstandby(2) standby mode (1) For smaller coin cell batteries, with high worst-case end-of-life equivalent source resistance, a 22uF VDDS input capacitor (see Figure 7- 1) should be used to ensure compliance with this slew rate. (2) Applications using RCOSC_LF as sleep timer must also consider the drift in frequency caused by a change in temperature. See Section 5.13

5.4 Thermal Characteristics

NAME DESCRIPTION RSM (°C/W)(1) RHB (°C/W)(1) RGZ (°C/W)(1) ΘJA Junction-to-ambient thermal resistance 36.9 32.8 29.6 ΘJCtop Junction-to-case (top) thermal resistance 30.3 24.0 15.7 ΘJB Junction-to-board thermal resistance 7.6 6.8 6.2 ΨJT Junction-to-top characterization parameter 0.4 0.3 0.3 ΨJB Junction-to-board characterization parameter 7.4 6.8 6.2 ΘJCbot Junction-to-case (bottom) thermal resistance 2.1 1.9 1.9 (1) °C/W = degrees Celsius per watt.

14 Specifications Copyright © 2015, Texas Instruments Incorporated

Submit Documentation Feedback Product Folder Links: CC2640

www.ti.com SWRS176 –FEBRUARY 2015

5.5 Electrical Characteristics

Measured on Texas Instruments CC2650EM-5XD reference design with Tc=25°C, VDDS = 3.0 V with internal DC-DC converter, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Icore Core current consumption Reset. RESET_N pin asserted 100 nA Shutdown. No clocks running, no retention 150 Standby. With RTC, CPU, RAM and (partial) register 1retention. RCOSC_LF Standby. With RTC, CPU, RAM and (partial) register 1.2retention. XOSC_LF Standby. With Cache, RTC, CPU, RAM and (partial) µA2.5register retention. RCOSC_LF Standby. With Cache, RTC, CPU, RAM and (partial) 2.7register retention. XOSC_LF Idle. Supply Systems and RAM powered. 550 1.45 mA +Active. Core running CoreMark 31 µA/MHz Radio RX (1) 5.9 Radio RX(2) 6.1 mA Radio TX, 0 dBm output power(1) 6.1 Radio TX, 5 dBm output power(2) 9.1 Iperi Peripheral Current Consumption (Adds to core current Icore for each peripheral unit activated)(3) Peripheral power domain Delta current with domain enabled 20 µA Serial power domain Delta current with domain enabled 13 µA Delta current with power domain enabled, clockRF Core 237 µAenabled, RF Core Idle µDMA Delta current with clock enabled, module idle 130 µA Timers Delta current with clock enabled, module idle 113 µA I2C Delta current with clock enabled, module idle 12 µA I2S Delta current with clock enabled, module idle 36 µA SSI Delta current with clock enabled, module idle 93 µA UART Delta current with clock enabled, module idle 164 µA (1) Single-ended RF mode optimized for size and power consumption. Measured on CC2650EM-4XS (2) Differential RF mode optimized for RF performance. Measured on CC2650EM-5XD (3) Iperi not supported in Standby and Shutdown Copyright © 2015, Texas Instruments Incorporated Specifications 15 Submit Documentation Feedback Product Folder Links: CC2640

SWRS176 –FEBRUARY 2015 www.ti.com

5.6 General Characteristics

Measured on Texas Instruments CC2650EM-5XD reference design with Tc=25°C, VDDS = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Wake-up and Timing Idle -> Active 14 µs Standby -> Active 151 µs Shutdown -> Active 1015 µs Flash Memory Supported flash erase cycles before 100 k Cycles failure Flash page/sector erase current Average delta current 12.6 mA Flash page/sector erase time(1) 8 ms Flash page/sector size 4 KB Flash write current Average delta current, 4 bytes at a time 8.15 mA Flash write time(1) 4 bytes at a time 8 µs (1) This number is dependent on Flash aging and will increase over time and erase cycles 5.7 1-Mbps GFSK (Bluetooth Low Energy) – RX Measured on Texas Instruments CC2650EM-5XD reference design with Tc=25°C, VDDS = 3.0 V, fRF = 2440 MHz, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Differential mode. Measured at the CC2650EM-5XD SMAReceiver sensitivity –97 dBmconnector, BER = 10-3 Single-ended mode. Measured on CC2650EM-4XS, at the SMAReceiver sensitivity –96 dBmconnector, BER = 10-3 Differential mode. Measured at the CC2650EM-5XD SMAReceiver saturation 4 dBmconnector, BER = 10-3 Single-ended mode. Measured on CC2650EM-4XS, at the SMAReceiver saturation 0 dBmconnector, BER = 10-3 Wanted signal at -67 dBm, modulated interferer in channel,Co-channel rejection(1) -6 dBBER = 10-3 Wanted signal at -67 dBm, modulated interferer at ±1 MHz,Selectivity, ±1 MHz(1) 7 / 3(2) dBBER = 10-3 Wanted signal at -67 dBm, modulated interferer at ±2 MHz,Selectivity, ±2 MHz(1) 34 / 25(2) dBBER = 10-3 Wanted signal at -67 dBm, modulated interferer at ±3 MHz,Selectivity, ±3 MHz(1) 38 / 26(2) dBBER = 10-3 Wanted signal at -67 dBm, modulated interferer at ±4 MHz,Selectivity, ±4 MHz(1) 42 / 29(2) dBBER = 10-3 Wanted signal at -67 dBm, modulated interferer at ≥ ±5 MHz,Selectivity, ±5 MHz or more(1) 32 dBBER = 10-3 Wanted signal at -67 dBm, modulated interferer at imageSelectivity, Image frequency(1) 25 dBfrequency, BER = 10-3 Selectivity, Image frequency ±1 Wanted signal at -67 dBm, modulated interferer at ±1 MHz from 3 / 26(2) dBMHz(1) image frequency, BER = 10-3 Out-of-band blocking(3) 30 MHz to 2000 MHz –20 dBm Out-of-band blocking 2003 MHz to 2399 MHz –5 dBm Out-of-band blocking 2484 MHz to 2997 MHz –8 dBm Out-of-band blocking 3000 MHz to 12.75 GHz –8 dBm Wanted signal at 2402 MHz, -64 dBm. Two interferers at 2405Intermodulation -34 dBmand 2408 MHz respectively, at the given power level (1) Numbers given as I/C dB (2) X / Y, where X is +N MHz and Y is -N MHz (3) Excluding one exception at Fwanted / 2, per Bluetooth Specification

16 Specifications Copyright © 2015, Texas Instruments Incorporated

Submit Documentation Feedback Product Folder Links: CC2640

www.ti.com SWRS176 –FEBRUARY 2015 1-Mbps GFSK (Bluetooth Low Energy) – RX (continued) Measured on Texas Instruments CC2650EM-5XD reference design with Tc=25°C, VDDS = 3.0 V, fRF = 2440 MHz, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Conducted measurement in a 50 Ω single-ended load. SuitableSpurious emissions, 30 to 1000 for systems targeting compliance with EN 300 328, EN 300 440 –71 dBmMHz class 2, FCC CFR47, Part 15 and ARIB STD-T-66 Conducted measurement in a 50 Ω single-ended load. SuitableSpurious emissions, 1 to 12.75 for systems targeting compliance with EN 300 328, EN 300 440 –62 dBmGHz class 2, FCC CFR47, Part 15 and ARIB STD-T-66 RSSI dynamic range 70 dB RSSI accuracy ±4 dB 5.8 1-Mbps GFSK (Bluetooth Low Energy) – TX Measured on Texas Instruments CC2650EM-5XD reference design with Tc=25°C, VDDS = 3.0 V, fRF = 2440 MHz, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Differential mode, delivered to a single-ended 50-Ω loadOutput power, highest setting +5 dBmthrough a balun Measured on CC2650EM-4XS, delivered to a single-endedOutput power, highest setting +2 dBm50-Ω load Output power, lowest setting Delivered to a single-ended 50-Ω load through a balun –21 dBm f < 1 GHz, outside restricted bands –43 dBm f < 1 GHz, restricted bands ETSI –65 dBm Spurious emission conducted f < 1 GHz, restricted bands FCC –76 dBm measurement f > 1 GHz, including harmonics –46 dBm Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan) 5.9 1-Mbps GFSK (Bluetooth Low Energy) – Common RX/TX Measured on Texas Instruments CC2650EM-5XD reference design with Tc=25°C, VDDS = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Difference between center frequency of theFrequency error tolerance -350 +350 kHzreceived RF signal and local oscillator frequency. Data rate error tolerance -750 +750 ppm Copyright © 2015, Texas Instruments Incorporated Specifications 17 Submit Documentation Feedback Product Folder Links: CC2640

SWRS176 –FEBRUARY 2015 www.ti.com 5.10 24-MHz Crystal Oscillator (XOSC_HF)(1) Measured on Texas Instruments CC2650EM-5XD reference design with Tc=25°C, VDDS = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Crystal frequency 24 MHz Crystal frequency tolerance(2) -40 40 ppm ESR Equivalent series resistance 20 60 Ω CL Crystal load capacitance 5 9 pF Start-up time(3) 150 µs (1) Probing or otherwise stopping the XTAL while the DC-DC converter is enabled may cause permanent damage to the device. (2) Includes initial tolerance of the crystal, drift over temperature, aging and frequency pulling due to incorrect load capacitance. As per Bluetooth specification (3) Kick-started based on a temperature and aging compensated RCOSC_HF using precharge injection 5.11 32.768-kHz Crystal Oscillator (XOSC_LF) Measured on Texas Instruments CC2650EM-5XD reference design with Tc=25°C, VDDS = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Crystal frequency 32.768 kHz Crystal frequency tolerance, Bluetooth low -250 250 ppm energy applications ESR Equivalent series resistance 30 100 kΩ CL Crystal load capacitance 6 12 pF 5.12 48-MHz RC Oscillator (RCOSC_HF) Measured on Texas Instruments CC2650EM-5XD reference design with Tc=25°C, VDDS = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Frequency 48 MHz Uncalibrated frequency accuracy ±1% Calibrated frequency accuracy(1) ±0.25% Start-up time 5 µs (1) Accuracy relatively to the calibration source (XOSC_HF). 5.13 32-kHz RC Oscillator (RCOSC_LF) Measured on Texas Instruments CC2650EM-5XD reference design with Tc=25°C, VDDS = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Calibrated frequency 32.8 kHz Temperature coefficient 50 ppm/°C

18 Specifications Copyright © 2015, Texas Instruments Incorporated

Submit Documentation Feedback Product Folder Links: CC2640

www.ti.com SWRS176 –FEBRUARY 2015

5.14 ADC Characteristics(1)

Tc=25°C, VDDS = 3.0 V and voltage scaling enabled, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Input voltage range 0 VDDS V Resolution 12 Bits Sample rate 200 ksps Offset Internal 4.3 V equivalent reference(2) 2 LSB Gain error Internal 4.3 V equivalent reference(2) 2.4 LSB DNL(3) Differential nonlinearity >–1 LSB INL(4) Integral nonlinearity ±3 LSB Internal 4.3 V equivalent reference(2), 200 ksps, 9.6 kHz input tone 9.8 VDDS as reference, 200 ksps, 9.6 kHz input tone 10ENOB Effective number of bits Bits Internal 1.44 V reference, voltage scaling disabled, 32 samples 11.1 average, 200 ksps, 300 Hz input tone Internal 4.3 V equivalent reference(2), 200 ksps, 9.6 kHz input tone –65 VDDS as reference, 200 ksps, 9.6 kHz input tone –69THD Total harmonic distortion dB Internal 1.44 V reference, voltage scaling disabled, 32 samples –71average, 200 ksps, 300 Hz input tone Internal 4.3 V equivalent reference(2), 200 ksps, 9.6 kHz input tone 60 SINA Signal-to-noise and VDDS as reference, 200 ksps, 9.6 kHz input tone 63D / dBdistortion ratio Internal 1.44 V reference, voltage scaling disabled, 32 samples 69SNDR average, 200 ksps, 300 Hz input tone Internal 4.3 V equivalent reference(2), 200 ksps, 9.6 kHz input tone 67 Spurious-free dynamic VDDS as reference, 200 ksps, 9.6 kHz input tone 72SFDR dBrange Internal 1.44 V reference, voltage scaling disabled, 32 samples 73 average, 200 ksps, 300 Hz input tone Serial conversion, time-to-output, 24 MHz clock 50 clock-Conversion time cycles Current consumption Internal 4.3 V equivalent reference(2) 0.66 mA Current consumption VDDS as reference 0.75 mA Internal reference voltage Internal 4.3 V equivalent reference(2) 1.44 V Internal reference voltage VDDS as reference VDDS / V2.82 (1) Using IEEE Std 1241™ -2010 for terminology and test methods. (2) Input signal scaled down internally before conversion, as if voltage range was 0 to 4.3V (3) No missing codes. Positive DNL typically varies from +0.3 to +3.5 depending on device, see Figure 5-13 (4) For a typical example, see Figure 5-14

5.15 Temperature Sensor

Measured on Texas Instruments CC2650EM-5XD reference design with Tc=25°C, VDDS = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Resolution 4 °C Range –40 85 °C Accuracy ±5 °C Supply voltage coefficient(1) 3.2 °C/V (1) Automatically compensated when using supplied driver libraries.

5.16 Battery Monitor

Measured on Texas Instruments CC2650EM-5XD reference design with Tc=25°C, VDDS = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Resolution 50 mV Range 1.8 3.8 V Copyright © 2015, Texas Instruments Incorporated Specifications 19 Submit Documentation Feedback Product Folder Links: CC2640

SWRS176 –FEBRUARY 2015 www.ti.com Battery Monitor (continued) Measured on Texas Instruments CC2650EM-5XD reference design with Tc=25°C, VDDS = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Accuracy 13 mV

5.17 Continuous Time Comparator

Tc=25°C, VDDS = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Input voltage range 0 VDDS V External reference voltage 0 VDDS V Internal reference voltage DCOUPL as reference 1.27 V Offset 3 mV Hysteresis <2 mV Decision time Step from -10mV to +10mV 0.72 µs Current consumption when enabled(1) 8.6 µA (1) Additionally the bias module needs to be enabled when running in standby mode.

5.18 Low-Power Clocked Comparator

Tc=25°C, VDDS = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Input voltage range 0 VDDS V Clock frequency 32 kHz Internal reference voltage, VDDS / 2 1.49 - 1.51 V Internal reference voltage, VDDS / 3 1.01 - 1.03 V Internal reference voltage, VDDS / 4 0.78 - 0.79 V Internal reference voltage, DCOUPL / 1 1.25 - 1.28 V Internal reference voltage, DCOUPL / 2 0.63 - 0.65 V Internal reference voltage, DCOUPL / 3 0.42 - 0.44 V Internal reference voltage, DCOUPL / 4 0.33 - 0.34 V Offset <2 mV Hysteresis <5 mV Decision time Step from -50mV to +50mV <1 clock-cycle Current consumption when enabled 362 nA

5.19 Programmable Current Source

Tc=25°C, VDDS = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Current source programmable output range 0.25 - µA Resolution 0.25 µA Including current source at maximumCurrent consumption(1) 23 µAprogrammable output (1) Additionally the bias module needs to be enabled when running in standby mode.

20 Specifications Copyright © 2015, Texas Instruments Incorporated

Submit Documentation Feedback Product Folder Links: CC2640

www.ti.com SWRS176 –FEBRUARY 2015

5.20 DC Characteristics

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT TA = 25°C, VDDS = 1.8 V GPIO VOH at 8mA load IOCURR=2, high drive GPIOs only 1.54 V GPIO VOL at 8mA load IOCURR=2, high drive GPIOs only 0.26 V GPIO VOH at 4mA load IOCURR=1 1.58 V GPIO VOL at 4mA load IOCURR=1 0.21 V GPIO pullup current Input mode, pullup enabled, Vpad=0V 71.7 µA GPIO pulldown current Input mode, pulldown enabled, Vpad=VDDS 21.1 µA GPIO high/low input transition, no hysteresis IH=0, transition between reading 0 and reading 1 0.88 V GPIO low-to-high input transition, with hysteresis IH=1, transition voltage for input read as 0→1 1.07 V GPIO high-to-low input transition, with hysteresis IH=1, transition voltage for input read as 1→0 0.74 V GPIO input hysteresis IH=1, difference between 0→1 and 1→0 points 0.33 V TA = 25°C, VDDS = 3.0 V GPIO VOH at 8mA load IOCURR=2, high drive GPIOs only 2.68 V GPIO VOL at 8mA load IOCURR=2, high drive GPIOs only 0.33 V GPIO VOH at 4mA load IOCURR=1 2.72 V GPIO VOL at 4mA load IOCURR=1 0.28 V TA = 25°C, VDDS = 3.8 V GPIO pullup current Input mode, pullup enabled, Vpad=0V 277 µA GPIO pulldown current Input mode, pulldown enabled, Vpad=VDDS 113 µA GPIO high/low input transition, no hysteresis IH=0, transition between reading 0 and reading 1 1.67 V GPIO low-to-high input transition, with hysteresis IH=1, transition voltage for input read as 0→1 1.94 V GPIO high-to-low input transition, with hysteresis IH=1, transition voltage for input read as 1→0 1.54 V GPIO input hysteresis IH=1, difference between 0→1 and 1→0 points 0.4 V

5.21 Control Input AC Characteristics

TA = -40°C to 85°C, VDDS = 1.7 V to 3.8 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT RESET_N low duration 1 μs

5.22 Synchronous Serial Interface (SSI) Characteristics

Tc=25°C, VDDS = 3.0 V, unless otherwise noted. PARAMETER PARAMETER PARAMETER NAME MIN TYP MAX UNITNO. S1 tclk_per SSIClk cycle time 12 65024 system clocks Copyright © 2015, Texas Instruments Incorporated Specifications 21 Submit Documentation Feedback Product Folder Links: CC2640

VDDS (V) Output power (dBm) D003 5XD 5/c10dBm Setting 4XS 2/c10dBm Setting Temperature (/c71 C) TX Current (mA) -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 D002 5XD 5/c10 dBm Setting 4XS 2/c10 dBm Setting VDDS (V) TX Current (mA) D015 4XS 2-dBm Setting 5XD 5-dBm Setting Temperature (/c71C) RX Current (mA) -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 5.6 5.8 6.2 6.4 6.6 6.8 D001 5XD RX Current 4XS RX Current Temperature (/c71C) Sensitivity (dBm) -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 -99 -98 -97 -96 -95 -94 Sensitivity 4XS Sensitivity 5XD Temperature (/c71C) Output Power (dBm) -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 4XS 2-dBm Setting 5XD 5-dBm Setting CC2640 SWRS176 –FEBRUARY 2015 www.ti.com

5.23 Typical Characteristics

Figure 5-2. Output Power vs Temperature Figure 5-1. BLE Sensitivity vs Temperature Figure 5-3. Transmit Current Consumption vs. Supply Voltage Figure 5-4. RX Mode Current Consumption vs Temperature(VDDS) Figure 5-6. TX Output Power vs Supply Voltage (VDDS)Figure 5-5. TX Mode Current Consumption vs Temperature

22 Specifications Copyright © 2015, Texas Instruments Incorporated

Submit Documentation Feedback Product Folder Links: CC2640

Input Frequency (Hz) Effective Number of Bits 200300 500 1000 2000 5000 10000 20000 100000 9.4 9.6 9.8 10.2 10.4 10.6 10.8 11.2 11.4 D009 Fs= 200 kHz, No Averaging Fs= 200 kHz, 32 samples averaging Temperature (/c71C) ADC Code -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 1004.5 1005 1005.5 1006 1006.5 1007 1007.5 D013 ADC Code INL 0 200 400 600 800 1000 1200 1400 1600 1800 2000 2200 2400 2600 2800 3000 3200 3400 3600 3800 4000 4200 D011 ADC Code DNL 200 400 600 800 1000 1200 1400 1600 1800 2000 2200 2400 2600 2800 3000 3200 3400 3600 3800 4000 4200 -1.5 -0.5 0.5 1.5 2.5 3.5 D010 CC2640 SWRS176 –FEBRUARY 2015 www.ti.com Figure 5-13. DNL vs. ADC Code (Internal Reference, No Scaling) Figure 5-14. INL vs. ADC Code (Internal Reference, No Scaling) Figure 5-15. SoC ADC Output vs Temperature (Fixed Input, Figure 5-16. ENOB vs Sampling FrequencyInternal Reference, No Scaling) (Input frequency = Fs/10)

24 Specifications Copyright © 2015, Texas Instruments Incorporated

Submit Documentation Feedback Product Folder Links: CC2640

www.ti.com SWRS176 –FEBRUARY 2015

6 Detailed Description

6.1 Overview

Section 1.4 shows a block diagram of the core modules of the CC26xx product family.

6.2 Main CPU

The SimpleLink CC2640 Wireless MCU contains an ARM Cortex-M3 (CM3) 32-bit CPU, which runs the application and the higher layers of the protocol stack. The CM3 processor provides a high-performance, low-cost platform that meets the system requirements of minimal memory implementation, and low-power consumption, while delivering outstanding computational performance and exceptional system response to interrupts. CM3 features include:

• 32-bit ARM Cortex-M3 architecture optimized for small-footprint embedded applications
• Outstanding processing performance combined with fast interrupt handling
• ARM Thumb®-2 mixed 16- and 32 bit instruction set delivers the high performance expected of a 32 bit ARM core in a compact memory size usually associated with 8- and 16-bit devices, typically in the range of a few kilobytes of memory for microcontroller-class applications: – Single-cycle multiply instruction and hardware divide – Atomic bit manipulation (bit-banding), delivering maximum memory use and streamlined peripheral control – Unaligned data access, enabling data to be efficiently packed into memory
• Fast code execution permits slower processor clock or increases sleep mode time
• Harvard architecture characterized by separate buses for instruction and data
• Efficient processor core, system, and memories
• Hardware division and fast digital-signal-processing oriented multiply accumulate
• Saturating arithmetic for signal processing
• Deterministic, high-performance interrupt handling for time-critical applications
• Enhanced system debug with extensive breakpoint and trace capabilities
• Serial wire trace reduces the number of pins required for debugging and tracing
• Migration from the ARM7™ processor family for better performance and power efficiency
• Optimized for single-cycle flash memory use
• Ultra-low power consumption with integrated sleep modes
• 1.25 DMIPS per MHz

6.3 RF Core

The RF Core contains an ARM Cortex M0 that interfaces the analog RF and base-band circuitries, handles data to and from the system side, and assembles the information bits in a given packet structure. The RF core offers a high level, command-based API to the main CPU. The RF core is capable of autonomously handling the time-critical aspects of the radio protocols (Bluetooth Low Energy) thus offloading the main CPU and leaving more resources for the user application. The RF core has a dedicated 4-KB SRAM block and runs initially from separate ROM memory. The ARM Cortex M0 is not programmable by customers. Copyright © 2015, Texas Instruments Incorporated Detailed Description 25 Submit Documentation Feedback Product Folder Links: CC2640

SWRS176 –FEBRUARY 2015 www.ti.com

6.4 Sensor Controller

The Sensor Controller contains circuitry that can be selectively enabled in standby mode. The peripherals in this domain may be controlled by the Sensor Controller Engine which is a proprietary power-optimized CPU. This CPU can read and monitor sensors or perform other tasks autonomously, thereby significantly reducing power consumption and offloading the main CM3 CPU. The Sensor Controller is set up using a PC-based configuration tool, called Sensor Controller Studio, and typical use cases may be (but are not limited to):

• Analog sensors using integrated ADC
• Digital sensors using GPIOs and bit-banged I2C and/or SPI
• UART communication for sensor reading or debugging
• Capacitive sensing
• Waveform generation
• Pulse counting
• Keyboard scan
• Quadrature decoder for polling rotation sensors
• Oscillator calibration The peripherals in the Sensor Controller include the following:
• The low-power clocked comparator can be used to wake the device from any state in which the comparator is active. A configurable internal reference can be used in conjunction with the comparator. The output of the comparator can also be used to trigger an interrupt or the ADC.
• Capacitive sensing functionality is implemented through the use of a constant current source, a time- to-digital converter, and a comparator. The continuous time comparator in this block can also be used as a higher-accuracy alternative to the low-power clocked comparator. The Sensor Controller will take care of baseline tracking, hysteresis, filtering and other related functions.
• The ADC is a 12-bit, 200 ksamples/s ADC with 8 inputs and a built-in voltage reference. The ADC can be triggered by many different sources, including timers, I/O pins, software, the analog comparator, and the RTC.
• The Sensor Controller also includes a SPI/I2C digital interface.
• The analog modules can be connected to up to 8 different GPIOs. The peripherals in the Sensor Controller can also be controlled from the main application processor.

26 Detailed Description Copyright © 2015, Texas Instruments Incorporated

Submit Documentation Feedback Product Folder Links: CC2640

www.ti.com SWRS176 –FEBRUARY 2015 Table 6-1. GPIOs Connected to the Sensor Controller(1) Analog capable 7x7 RGZ DIO# 5x5 RHB DIO# 4x4 RSM DIO# Y 30 14 Y 29 13 Y 28 12 Y 27 11 9 Y 26 9 8 Y 25 10 7 Y 24 8 6 Y 23 7 5 N 7 4 2 N 6 3 1 N 5 2 0 N 4 1 N 3 0 N 2 N 1 N 0 (1) Depending on the package size, up to 16 pins can be connected to the Sensor Controller. Up to 8 of them can be connected to analog modules

6.5 Memory

The flash memory provides nonvolatile storage for code and data. The flash memory is in-system programmable. The SRAM (static RAM) can be used for both storage of data and execution of code and is split into two 4-KB blocks and two 6-KB blocks. Retention of the RAM contents in standby mode can be enabled or disabled individually for each block to minimize power consumption. In addition, if flash cache is disabled, the 8-KB cache can be used as a general-purpose RAM. The ROM provides preprogrammed embedded TI RTOS kernel, Driverlib and lower layer protocol stack software (Bluetooth Low Energy Controller). It also contains a bootloader that can be used to reprogram the device using SPI or UART.

6.6 Debug

The on-chip debug support is done through a dedicated cJTAG (IEEE 1149.7) or JTAG (IEEE 1149.1) interface. Copyright © 2015, Texas Instruments Incorporated Detailed Description 27 Submit Documentation Feedback Product Folder Links: CC2640

SWRS176 –FEBRUARY 2015 www.ti.com

6.7 Power Management

To minimize power consumption, the CC2640 supports a number of power modes and power management features (see Table 6-2). Table 6-2. Power Modes Software Configurable Power Modes Mode Reset Pin Held Active Idle Standby Shutdown CPU Active Off Off Off Off Flash On Available Off Off Off SRAM On On On Off Off Radio Available Available Off Off Off Supply System On On Duty Cycled Off Off Current 1.45 mA + 31 µA/MHz 550 µA 1 µA 0.15 µA 0.1 µA Wake-up Time to CPU Active(1) – 14 µs 151 µs 1015 µs 1015 µs Register Retention Full Full Partial No No SRAM Retention Full Full Full No No XOSC_HF or XOSC_HF orHigh-Speed Clock Off Off OffRCOSC_HF RCOSC_HF XOSC_LF or XOSC_LF or XOSC_LF orLow-Speed Clock Off OffRCOSC_LF RCOSC_LF RCOSC_LF Peripherals Available Available Off Off Off Sensor Controller Available Available Available Off Off Wake-up on RTC Available Available Available Off Off Wake-up on Pin Edge Available Available Available Available Off Wake-up on Reset Pin Available Available Available Available Available (1) Not including RTOS overhead In Active mode, the application CM3 CPU is actively executing code. Active mode provides normal operation of the processor and all of the peripherals that are currently enabled. The system clock can be any available clock source (see Table 6-2). In Idle mode, all active peripherals can be clocked, but the Application CPU core and memory are not clocked and no code is executed. Any interrupt event will bring the processor back into Active mode. In Standby, only the AON (Always-on) domain is active. An external wake event, RTC event, or Sensor Controller event is required to bring the device back to Active. MCU peripherals with retention do not need to be reconfigured when waking up again and the CPU will continue execution from where it went into Standby. All GPIOs are latched in Standby. In Shutdown, the device is entirely turned off, including the AON domain and Sensor Controller, I/Os are latched with the value they had before entering Shutdown. A change of state on any I/O pin defined as a "wake from Shutdown pin" will wake up the device and function as a reset trigger. The CPU can differentiate between reset in this way and reset-by-reset pin or power-on-reset by reading the reset status register. The only state retained in this mode is the latched I/O state and the Flash memory contents. The Sensor Controller is an autonomous processor that can control the peripherals in the Sensor Controller independently of the main CPU. This means that the main CPU does not have to wake up to for example execute an ADC sample or poll a digital sensor over SPI, and saves both current and wake-up time that would otherwise be wasted. The Sensor Controller Studio enables the user to configure the Sensor Controller and choose which peripherals are controlled and which conditions will wake up the main CPU.

28 Detailed Description Copyright © 2015, Texas Instruments Incorporated

Submit Documentation Feedback Product Folder Links: CC2640

www.ti.com SWRS176 –FEBRUARY 2015

6.8 Clock Systems

The CC2640 supports two external and two internal clock sources. A 24 MHz crystal is required as the frequency reference for the radio. This signal is doubled internally to create a 48 MHz clock. The 32 kHz crystal is optional. Bluetooth low energy requires a slow-speed clock with better than ±500 ppm accuracy if the device is to enter any sleep mode while maintaining a connection. The internal 32 kHz RC oscillator can in some use cases be compensated to meet the requirements. The low-speed crystal oscillator is designed for use with a 32 kHz watch-type crystal. The internal high-speed oscillator (48 MHz) can be used as a clock source for the CPU subsystem. The internal low-speed oscillator (32.768 kHz) can be used as a reference if the low-power crystal oscillator is not used. The 32 kHz clock source can be used as external clocking reference through GPIO.

6.9 General Peripherals and Modules

The I/O controller controls the digital I/O pins and contains multiplexer circuitry to allow a set of peripherals to be assigned to I/O pins in a flexible manner. All digital I/Os are interrupt and wake-up capable, have a programmable pullup and pulldown function and can generate an interrupt on a negative or positive edge (configurable). When configured as an output, pins can function as either push-pull or open-drain. Five GPIOs have high drive capabilities (marked in bold in Section 4). The SSIs are synchronous serial interfaces that are compatible with SPI, MICROWIRE, and Texas Instruments synchronous serial interfaces. The SSIs support both SPI master and slave up to 4 MHz. The UART implements a universal asynchronous receiver/transmitter function. It supports flexible baud- rate generation up to a maximum of 3 Mbps and is compatible with the Bluetooth HCI specifications. Timer 0 is a general-purpose timer module (GPTM), which provides two 16-bit timers. The GPTM can be configured to operate as a single 32-bit timer, dual 16-bit timers or as a PWM module. Timer 1, Timer 2, and Timer 3 are also GPTMs. Each of these timers is functionally equivalent to Timer 0. In addition to these four timers, the RF core has its own timer to handle timing for RF protocols; the RF timer can be synchronized to the RTC. The I2C interface is used to communicate with devices compatible with the I2C standard. The I2C interface is capable of 100 kHz and 400 kHz operation, and can serve as both I2C master and I2C slave. The TRNG module provides a true, nondeterministic noise source for the purpose of generating keys, initialization vectors (IVs), and other random number requirements. The TRNG is built on 24 ring oscillators that create unpredictable output to feed a complex nonlinear combinatorial circuit. The watchdog timer is used to regain control if the system fails due to a software error after an external device fails to respond as expected. The watchdog timer can generate an interrupt or a reset when a predefined time-out value is reached. The device includes a direct memory access (µDMA) controller. The µDMA controller provides a way to offload data transfer tasks from the CM3 CPU, allowing for more efficient use of the processor and the available bus bandwidth. The µDMA controller can perform transfer between memory and peripherals. The µDMA controller has dedicated channels for each supported on-chip module and can be programmed to automatically perform transfers between peripherals and memory as the peripheral is ready to transfer more data. Some features of the µDMA controller include the following (this is not an exhaustive list):

• Highly flexible and configurable channel operation of up to 32 channels
• Transfer modes: Memory-to-memory, memory-to-peripheral, peripheral-to-memory, and peripheral-to- peripheral
• Data sizes of 8, 16, and 32 bits Copyright © 2015, Texas Instruments Incorporated Detailed Description 29 Submit Documentation Feedback Product Folder Links: CC2640

SWRS176 –FEBRUARY 2015 www.ti.com The AON domain contains circuitry that is always enabled, except for in Shutdown (where the digital supply is off). This circuitry includes the following:

• The RTC can be used to wake the device from any state where it is active. The RTC contains three compare and one capture registers. With software support, the RTC can be used for clock and calendar operation. The RTC is clocked from the 32 kHz RC oscillator or crystal. The RTC can also be compensated to tick at the correct frequency even when the internal 32 kHz RC oscillator is used instead of a crystal.
• The battery monitor and temperature sensor are accessible by software and give a battery status indication as well as a coarse temperature measure.

6.10 System Architecture

Depending on the product configuration, CC26xx can function either as a Wireless Network Processor (WNP – an IC running the wireless protocol stack, with the application running on a separate MCU), or as a System-on-Chip (SoC), with the application and protocol stack running on the ARM CM3 core inside the device. In the first case, the external host MCU communicates with the device using SPI or UART. In the second case, the application must be written according to the application framework supplied with the wireless protocol stack.

30 Detailed Description Copyright © 2015, Texas Instruments Incorporated

Submit Documentation Feedback Product Folder Links: CC2640

(50 Ohm) 1 pF 1 pF 2.4 nH 2.4-2.7 nH 6.8 pF 6.2-6.8 nH Antenna (50 Ohm) 1.2 pF 15 nH 2 nH 1.2 pF Antenna (50 Ohm) 1.2 pF 2 nH 1.2 pF Antenna (50 Ohm) 1.2 pF 2 nH 1.2 pF Pin 1 (RF P) Pin 2 (RF N) Pin 3 (RXTX) Pin 1 (RF P) Pin 2 (RF N) Pin 1 (RF P) Pin 2 (RF N) Red = Not necessary if internal bias is used Red = Not necessary if internal bias is used Differential operation Single ended operation Single ended operation with 2 antennas Pin 3 (RXTX) 15 nH 15 nH CC 26 xx ( GND exposed die attached pad ) Pin 3/4 (RXTX) Pin 1 (RF P) Pin 2 (RF N) 24MHz XTAL (Load caps on chip) 10uF 10uH Optional inductor. Only needed for DCDC operation 12 pF 12 pF 12 pF 12 pF 2 nH 2 nH 1 pF input decoupling 10uF /cb1 22uF To VDDR pins VDDS_DCDC DCDC_SW Red = Not necessary if internal bias is used CC2640 www.ti.com SWRS176 –FEBRUARY 2015

7 Application Circuit

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. Few external components are required for the operation of the CC2640 device. Figure 7-1 shows a typical application circuit. For a complete reference design, see the product folder on www.ti.com. Figure 7-1. CC2640 Application Circuit Copyright © 2015, Texas Instruments Incorporated Application Circuit 31 Submit Documentation Feedback Product Folder Links: CC2640

( GND exposed die attached pad ) Pin 3/4 (RXTX) Pin 1 (RF P) Pin 2 (RF N) 24MHz XTAL (Load caps on chip) 10uF 10uH VDDS_DCDC input decoupling 10uF /cb1 22uF To all VDDR Pins VDDS_DCDC Pin DCDC_SW Pin CC 26 xx ( GND exposed die attached pad ) Pin 3/4 (RXTX) Pin 1 (RF P) Pin 2 (RF N) 24MHz XTAL (Load caps on chip) 2.2uF 1.7V /cb1 1.95V to all VDDR- and VDDS Pins except VDDS_DCDC VDDS_DCDC Pin DCDC_SW Pin Ext regulator 1.8V /cb1 3.8V to all VDDS Pins Internal DCDC regulator External regulator CC 26 xx ( GND exposed die attached pad ) Pin 3/4 (RXTX) Pin 1 (RF P) Pin 2 (RF N) 24MHz XTAL (Load caps on chip) VDDS_DCDC input decoupling 10uF /cb1 22uF To all VDDR Pins VDDS_DCDC Pin DCDC_SW Pin 1.8V /cb1 3.8V Supply voltage 10uF NC To all VDDS Pins Internal LDO regulator CC2640 SWRS176 –FEBRUARY 2015 www.ti.com Figure 7-2. Supply Voltage Configurations Power supply decoupling capacitors are not shown. Digital I/Os not included. Pin positions, and component values are not final. For detailed overview of power supply decoupling and wiring, see the TI reference designs and the CC26xx technical reference manual (Section 8.2). Figure 7-1 shows that the RF front end can be used both differentially and single-endedly with the option of having internal or external biasing. These options allow for various trade-offs between cost, board- space, and RF performance. Differential operation with external bias gives the best performance while single-ended operation with internal bias gives the least amount of external components and the lowest power consumption. Submit Documentation Feedback Product Folder Links: CC2640

www.ti.com SWRS176 –FEBRUARY 2015

8 Device and Documentation Support

8.1 Device Support

8.1.1 Development Support

TI offers an extensive line of development tools, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software and hardware modules. The following products support development of the CC2640 device applications: Software Tools: SmartRF™ Studio 7: SmartRF Studio is a PC application that helps designers of radio systems to easily evaluate the RF-IC at an early stage in the design process.

• Test functions for sending and receiving radio packets, continuous wave transmit and receive
• Evaluate RF performance on custom boards by wiring it to a supported evaluation board or debugger
• Can also be used without any hardware, but then only to generate, edit and export radio configuration settings
• Can be used in combination with several development kits for Texas Instruments’CCxxxx RF-ICs Sensor Controller Studio: Sensor Controller Studio provides a development environment for the CC26xx Sensor Controller. The Sensor Controller is a proprietary, power-optimized CPU in the CC26xx, which can perform simple background tasks autonomously and independent of the System CPU state.
• Allows for Sensor Controller task algorithms to be implemented using a C-like programming language
• Outputs a Sensor Controller Interface driver, which incorporates the generated Sensor Controller machine code and associated definitions
• Allows for rapid development by using the integrated Sensor Controller task testing and debugging functionality. This allows for live visualization of sensor data and algorithm verification. IDEs and Compilers: Code Composer Studio:
• Integrated development environment with project management tools and editor
• Code Composer Studio (CCS) 6.1 and later has built-in support for the CC26xx device family
• Best support for XDS debuggers; XDS100v3, XDS110 and XDS200
• High integration with TI-RTOS with support for TI-RTOS Object View IAR Embedded Workbench for ARM
• Integrated development environment with project management tools and editor
• IAR EWARM 7.30.3 and later has built-in support for the CC26xx device family
• Broad debugger support, supporting XDS100v3, XDS200, IAR I-Jet and Segger J-Link
• Integrated development environment with project management tools and editor
• RTOS plugin available for TI-RTOS For a complete listing of development-support tools for the CC2640 platform, visit the Texas Instruments website at www.ti.com. For information on pricing and availability, contact the nearest TI field sales office or authorized distributor. Copyright © 2015, Texas Instruments Incorporated Device and Documentation Support 33 Submit Documentation Feedback Product Folder Links: CC2640

SWRS176 –FEBRUARY 2015 www.ti.com

8.1.2 Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to all part numbers and/or date-code. Each device has one of three prefixes/identifications: X, P, or null (no prefix) (for example, CC2640 is in production; therefore, no prefix/identification is assigned). Device development evolutionary flow: X Experimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow. P Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications. null Production version of the silicon die that is fully qualified. Production devices have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies. Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used. TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, RSM). For orderable part numbers of CC2640 devices in the RSM, RHB or RGZ package types, see the Package Option Addendum of this document, the TI website (www.ti.com), or contact your TI sales representative.

34 Device and Documentation Support Copyright © 2015, Texas Instruments Incorporated

Submit Documentation Feedback Product Folder Links: CC2640

www.ti.com SWRS176 –FEBRUARY 2015

8.2 Documentation Support

The following documents describe the CC2640. Copies of these documents are available on the Internet at www.ti.com. SWCU117 Technical Reference Manual. Texas Instruments CC26xx Family of Products SWRS058 Silicon Errata. Texas Instruments CC26xx™ Family of Products

8.2.1 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices.

8.3 Additional Information

Texas Instruments offers a wide selection of cost-effective, low-power RF solutions for proprietary and standard-based wireless applications for use in industrial and consumer applications. The selection includes RF transceivers, RF transmitters, RF front ends, and Systems-on-Chips as well as various software solutions for the sub-1-GHz and 2.4-GHz frequency bands. In addition, Texas Instruments provides a large selection of support collateral such as development tools, technical documentation, reference designs, application expertise, customer support, third-party and university programs. The Low-Power RF E2E Online Community provides technical support forums, videos and blogs, and the chance to interact with engineers from all over the world. With a broad selection of product solutions, end-application possibilities, and a range of technical support, Texas Instruments offers the broadest low-power RF portfolio.

8.3.1 Texas Instruments Low-Power RF Website

Texas Instruments' Low-Power RF website has all the latest products, application and design notes, FAQ section, news and events updates. Go to www.ti.com/lprf.

8.3.2 Low-Power RF Online Community

• Forums, videos, and blogs
• RF design help
• E2E interaction Join at: www.ti.com/lprf-forum. Copyright © 2015, Texas Instruments Incorporated Device and Documentation Support 35 Submit Documentation Feedback Product Folder Links: CC2640

SWRS176 –FEBRUARY 2015 www.ti.com

8.3.3 Texas Instruments Low-Power RF Developer Network

Texas Instruments has launched an extensive network of low-power RF development partners to help customers speed up their application development. The network consists of recommended companies, RF consultants, and independent design houses that provide a series of hardware module products and design services, including:

• RF circuit, low-power RF, and ZigBee design services
• Low-power RF and ZigBee module solutions and development tools
• RF certification services and RF circuit manufacturing For help with modules, engineering services or development tools: Search the Low-Power RF Developer Network to find a suitable partner. www.ti.com/lprfnetwork

8.3.4 Low-Power RF eNewsletter

The Low-Power RF eNewsletter is up-to-date on new products, news releases, developers’news, and other news and events associated with low-power RF products from TI. The Low-Power RF eNewsletter articles include links to get more online information. Sign up at: www.ti.com/lprfnewsletter

8.4 Trademarks

IAR Embedded Workbench is a registered trademark of IAR Systems AB. SimpleLink, SmartRF, Code Composer Studio, CC26xx, E2E are trademarks of Texas Instruments. ARM7 is a trademark of ARM Limited. ARM, Cortex are registered trademarks of ARM Limited (or its subsidiaries). ARM Thumb is a registered trademark of ARM Limited. Bluetooth is a registered trademark of Bluetooth SIG, Inc. CoreMark is a registered trademark of Embedded Microprocessor Benchmark Consortium. IEEE Std 1241 is a trademark of Institute of Electrical and Electronics Engineers, Incorporated. ZigBee is a registered trademark of ZigBee Alliance, Inc.

8.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

8.6 Export Control Notice

Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled product restricted by other applicable national regulations, received from Disclosing party under this Agreement, or any direct product of such technology, to any destination to which such export or re- export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S. Department of Commerce and other competent Government authorities to the extent required by those laws.

8.7 Glossary

SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms and definitions.

36 Device and Documentation Support Copyright © 2015, Texas Instruments Incorporated

Submit Documentation Feedback Product Folder Links: CC2640

www.ti.com SWRS176 –FEBRUARY 2015

9 Mechanical Packaging and Orderable Information

9.1 Packaging Information

The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright © 2015, Texas Instruments Incorporated Mechanical Packaging and Orderable Information 37 Submit Documentation Feedback Product Folder Links: CC2640

www.ti.com 5-Sep-2015 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples CC2640F128RGZR ACTIVE VQFN RGZ 48 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 CC2640 F128 CC2640F128RGZT ACTIVE VQFN RGZ 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 CC2640 F128 CC2640F128RHBR ACTIVE VQFN RHB 32 3000 Green (RoHS & no Sb/Br) CU NIPDAU | Call TI Level-3-260C-168 HR -40 to 85 CC2640 F128 CC2640F128RHBT ACTIVE VQFN RHB 32 250 Green (RoHS & no Sb/Br) CU NIPDAU | Call TI Level-3-260C-168 HR -40 to 85 CC2640 F128 CC2640F128RSMR ACTIVE VQFN RSM 32 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 CC2640 F128 CC2640F128RSMT ACTIVE VQFN RSM 32 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 CC2640 F128 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.

www.ti.com 5-Sep-2015 Addendum-Page 2 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 3-Aug-2015 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CC2640F128RGZR VQFN RGZ 48 2500 367.0 367.0 38.0 CC2640F128RGZT VQFN RGZ 48 250 210.0 185.0 35.0 CC2640F128RHBR VQFN RHB 32 3000 367.0 367.0 35.0 CC2640F128RHBT VQFN RHB 32 250 210.0 185.0 35.0 CC2640F128RSMR VQFN RSM 32 3000 367.0 367.0 35.0 CC2640F128RSMT VQFN RSM 32 250 210.0 185.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 3-Aug-2015 Pack Materials-Page 2

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic”are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated