CC1512FC CADDOCK | Alldatasheet

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Sales and Corporate Office

1717 Chicago Avenue

Riverside, California 92507-2364 Phone: (951) 788-1700 Fax: (951) 369-1151 Applications Engineering 17271 North Umpqua Hwy. Roseburg, Oregon 97470-9422 Phone: (541) 496-0700 Fax: (541) 496-0408 e-mail: caddock@caddock.com • web: www.caddock.com For Caddock Distributors listed by country see caddock.com/contact/dist.html © 2004 Caddock Electronics, Inc. C AD KDOC CC1512FC Standard Resistance Values: Tolerance CC1512FC ±1% Standard (except as noted). CC2015FC Standard Resistance Values: Tolerance CC2015FC ±1% Standard (except as noted). CC2520FC Standard Resistance Values: 0.010 Ω 5% 0.015 Ω 5% 0.020 Ω 5% 0.025 Ω 5% 0.030 Ω 5% Tolerance CC2520FC ±1% Standard (except as noted). 0.033 Ω 5% 0.040 Ω 5% 0.050 Ω 2% 0.075 Ω 2% 0.10 Ω 0.15 Ω 0.20 Ω 0.25 Ω 0.30 Ω 0.33 Ω 0.40 Ω 0.50 Ω 0.75 Ω 1.00 Ω 1.50 Ω 2.00 Ω 2.50 Ω 3.00 Ω 0.010 Ω 5% 0.015 Ω 5% 0.020 Ω 5% 0.025 Ω 5% 0.030 Ω 5% 0.033 Ω 5% 0.040 Ω 5% 0.050 Ω 2% 0.075 Ω 2% 0.10 Ω 0.15 Ω 0.20 Ω 0.25 Ω 0.30 Ω 0.33 Ω 0.40 Ω 0.50 Ω 0.75 Ω 1.00 Ω 1.50 Ω 2.00 Ω 2.50 Ω 3.00 Ω 0.020 Ω 5% 0.025 Ω 5% 0.030 Ω 5% 0.033 Ω 5% 0.040 Ω 5% 0.050 Ω 2% 0.075 Ω 2% 0.10 Ω 0.15 Ω 0.20 Ω 0.25 Ω 0.30 Ω 0.33 Ω 0.40 Ω 0.50 Ω 0.75 Ω 1.00 Ω 1.50 Ω 2.00 Ω 2.50 Ω 3.00 Ω 3.30 Ω 4.00 Ω 5.00 Ω 7.50 Ω 8.00 Ω 10.0 Ω Custom resistance values and non-standard tolerances can be manufactured for high quantity applications. Please contact Caddock Applications Engineering. Recommended Circuit Board Layout (current and sense connections): Fig. 1A: Kelvin layout recom- mended for values below 0.20Ω Fig. 1B: Kelvin layout recommended for higher resistance values. Type CC Low Resistance Precision Chip Resistors Style FC - Flip Chip Version is a surface mount version with solderable pads for flip chip soldering. Note 1: General Applications - The power rating for general applications is based upon 0.5 sq. in. (300 mm2) of termination pad or trace area (2 oz. copper) connected to each end of the resistor. Maximum chip temperature is 150°C. Use Derating Curve to derate appropriately for the maximum ambient temperature and for the temperature limitations of the adjacent materials. Note 2: Thermal Resistance - In High Power Applications where the circuit board material provides high heat sinking benefits (such as IMS, Alumina, or other) the thermal resistance of the chip resistor is useful to establish the maximum power capability of the chip resistor in the application. The film temperature is measured at the center of the resistor element and the solder pad temperature is measured at the center of the termination pad (point X in the recommended circuit layouts shown below). Maximum temperature of the chip resistor (at the center of chip) should not exceed 150°C through the temperature range of the application . Style FC Derating Curve For General Applications 3.30 Ω 4.00 Ω 5.00 Ω 7.50 Ω 8.00 Ω 10.0 Ω 3.30 Ω 4.00 Ω 5.00 Ω 7.50 Ω 8.00 Ω 10.0 Ω S S X X C C C X X SS C C C = Current connection S = Sense connection Note: Actual width of current trace is based on magnitude of current. Point of connection should be in the area shown. 0.015 Ω0.010 Ω Model Resistance Min. Max. Power Capability Information CC1512FC CC2015FC CC2520FC 10.0 Ω0.020 Ω 10.0 Ω 0.020 Ω 10.0 Ω 0.020 Ω 0.010 Ω 0.025 Ω 150°C0.75 Watt Max. Chip Temperature General Applications High Power Applications Thermal Resistance - RθJC Film (J) to Solder Pad (C) (see note 2) 22.7°C/Watt Power Rating at 70° C (see note 1) 22.7°C/Watt 16.0°C/Watt 13.0°C/Watt 11.5°C/Watt 150°C 150°C 150°C 150°C Dimensions in inches and (millimeters) .150 ±.007 (3.81 ±.18) A B D .120 ±.007 (3.05 ±.18) .035 min. (0.89 min.) C .027 ±.005 (.69 ±.13) .250 ±.007 (6.35 ±.18) .200 ±.007 (5.08 ±.18) .065 min. (1.66 min.) .032 ±.005 (.81 ±.13) .250 ±.007 (6.35 ±.18) .200 ±.007 (5.08 ±.18) .040 min. (1.02 min.) .041 ±.004 (1.04 ±.10) .200 ±.007 (5.08 ±.18) .150 ±.007 (3.81 ±.18) .050 min. (1.27 min.) .027 ±.003 (.69 ±.08) .150 ±.007 (3.81 ±.18) .120 ±.007 (3.05 ±.18) .035 min. (0.89 min.) .022 ±.003 (.56 ±.08) Comments Solder Coated Pads Solderable Pads Solderable Pads Solder Coated Pads Solderable Pads

0.75 Watt

1.0 Watt

1.5 Watts

AMBIENT TEMPERATURE, C RATED LOAD, % o 100 25 100 15070

  • Style FC - Flip Chip version for surface mount applications. Style WB - Wire Bond version for hybrid applications with metallized back surface for solder down heat sinking of the chip, includes bondable termination pads to receive aluminum wire bonds.
  • Thermal resistance is provided to optimize high power designs when utilizing higher thermal conductivity circuit board substrates such as IMS or Alumina.
  • Resistance range down to 0.010 ohm at ±5%, 0.050 ohm at ±2%, and 0.10 ohm at ±1%.
  • Low inductance provides excellent high frequency and pulse response.
  • High pulse handling and overload capability.
  • Best choice for switching power supplies, motor speed controls, and high current sensing applications. Page 1 of 2 28_IL106.1004

Sales and Corporate Office Riverside, California 92507-2364 Phone: (951) 788-1700 Fax: (951) 369-1151 Applications Engineering 17271 North Umpqua Hwy. Roseburg, Oregon 97470-9422 Phone: (541) 496-0700 Fax: (541) 496-0408 e-mail: caddock@caddock.com • web: www.caddock.com For Caddock Distributors listed by country see caddock.com/contact/dist.html © 2004 Caddock Electronics, Inc. C AD KDOC CC 2520 FC - 0.10 - 1% Type CC Physical Size 1512 = 0.150” x 0.120” 2015 = 0.200” x 0.150” 2520 = 0.250” x 0.200” Style: FC or WB Resistor Value (Ω) See charts for availability Tolerance: ± 5% below 0.050Ω ± 2% 0.050Ω to 0.099Ω ± 1% 0.10Ω and above Specifications: Temperature Coefficient: TC referenced to +25°C, ΔR taken at +150°C. 0.50 ohm and above, -20 to +80 ppm/°C 0.050 ohm to 0.49 ohm, 0 to +200 ppm/°C below 0.050 ohm, 0 to +300 ppm/°C. Inductance: Less than 5 nH typical. Load Life: 1000 hours at rated power, based upon 150°C max. chip temperature, Momentary Overload: 1.5 times rated power, for 5 seconds, ΔR ± (0.5% + 0.0005 ohm). Operating Temperature: -55°C to +150°C. Measurement Note: All measurements are taken using Kelvin connections per the recommended connection locations. Ordering Information: Ko signifies tape thickness and dimension 12mm 0.473” Ao Bo 7” dia. (178 mm) .512” arbor hole (13mm) Packaging information: Style FC, flip chip resistors, are shipped with the bare ceramic side up in the pocket, with the solderable pads fac- ing down. Style WB, wire bondable resistors, are shipped with the wire bondable pads facing up in the pocket. The illustration shows the orientation of the CC1512 and CC2015 chip resistors in the tape. The CC2520 chip resistors are rotated 90° from what is shown in the illustration. 0.135” (3.43mm) Carrier Tape and pocket dimensions: Tape is 12mm Carrier Tape (8mm pitch) 0.167” (4.24mm) 0.037” (0.94mm) 0.189” (4.80mm) Size 2015 0.209” (5.31mm) 0.087” (2.21mm) 0.271” (6.88mm) Size 2520 0.216” (5.49mm) 0.066” (1.68mm) Ao Bo Ko Size 1512 Full reel quantities: 1500 pieces per reel for CC1512 1000 pieces per reel for CC2015 and CC2520 Quantities of less than 250 will be shipped in tape without reel and without tape leader at the option of Caddock. Tape dimensions and materials will be consistent with EIA-481-1. Reels will be marked with a label containing Caddock logo, part number, resistor value, tolerance, packaging date, and quantity. CC2015WB Standard Resistance Values: Tolerance CC2015WB ±1% Standard (except as noted). CC2520WB Standard Resistance Values: 0.025 Ω 5% 0.030 Ω 5% 0.033 Ω 5% 0.040 Ω 5% Tolerance CC2520WB ±1% Standard (except as noted). 0.050 Ω 2% 0.075 Ω 2% 0.10 Ω 0.15 Ω 0.20 Ω 0.25 Ω 0.30 Ω 0.33 Ω 0.40 Ω 0.50 Ω 0.75 Ω 1.00 Ω 1.50 Ω 2.00 Ω 2.50 Ω 3.00 Ω 3.30 Ω 4.00 Ω 5.00 Ω 7.50 Ω 8.00 Ω 10.0 Ω 0.020 Ω 5% 0.025 Ω 5% 0.030 Ω 5% 0.033 Ω 5% 0.040 Ω 5% 0.050 Ω 2% 0.075 Ω 2% 0.10 Ω 0.15 Ω 0.20 Ω 0.25 Ω 0.30 Ω 0.33 Ω 0.40 Ω 0.50 Ω 0.75 Ω 1.00 Ω 1.50 Ω 2.00 Ω 2.50 Ω 3.00 Ω 3.30 Ω 4.00 Ω 5.00 Ω 7.50 Ω 8.00 Ω 10.0 Ω Custom resistance values and non-standard tolerances can be manufactured for high quantity applications. Please contact Caddock Applications Engineering. Style WB - Wire Bond Version Model Resistance Min. Max. Power Capability Information CC2015WB CC2520WB 10.0 Ω 10.0 Ω 0.020 Ω 0.025 Ω Max. Chip Temperature Thermal Resistance RθJC Film (J) to Solder Pad (C) (see note 3) 13.9°C/Watt 8.33°C/Watt 150°C 150°C Dimensions in inches and (millimeters) A B DC .250 ±.007 (6.35 ±.18) .200 ±.007 (5.08 ±.18) .040 min. (1.02 min.) .200 ±.007 (5.08 ±.18) .150 ±.007 (3.81 ±.18) .050 min. (1.27 min.) .027 ±.003 (.69 ±.08) Comments Aluminum wire to be used for bonding .027 ±.003 (.69 ±.08) Aluminum wire to be used for bonding Note 3: Thermal Resistance - In High Power Applications where the circuit board material provides high heat sinking benefits (such as IMS, Alumina, or other) the thermal resistance of the chip resistor is useful to establish the maximum power capability of the chip resistor in the application. The film temperature is measured at the center of the resistor element and the solder pad temperature is measured at the soldered interface with the circuit board. Maximum temperature of the chip resistor (at the center of chip) should not exceed 150°C through the temperature range of the application. WB Resistor mounting Circuit board: IMS, Ceramic (Alumina) , or other. Sense Wire Current Wire Film Temperature Measuring Point Solder pad, soldered interface with circuit board. Sense Wire Current Wire Sense connection shall be made in the crosshatched portion of the termination pad. .055 (1.40) centered Location for Sense (Potential) Connection: General Information for Type CC - Style FC and Style WB - Chip Resistors Solder attachment note: Style FC has a bare ceramic back surface. The recommended solders for flip chip solder attachment are 62Sn / 36Pb / 2Ag, 96.5Sn / 3.5Ag, or standard Sn / Ag / Cu solder alloys. Style WB has a metallized back surface for soldering to a substrate or a heat sink. The recommended solders to be used are 62Sn / 36Pb / 2Ag, 96.5Sn / 3.5Ag, or standard Sn / Ag / Cu solder alloys. A D B C Dimensions in inches and (millimeters) is a hybrid mountable version with metallized pads for wire bonding utilizing aluminum wire and a metallized back surface for solder attachment of the back surface to a heat sinking substrate. Type CC Low Resistance Precision Chip Resistors Page 2 of 2 28_IL106.1004