CBTD3861 NXP | Alldatasheet
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Technical content
OE is HIGH, each switch is disabled. The CBTD3861 is characterized for operation from −40 °C to +85 °C. Table 1. Ordering information
Product data sheet Rev. 1 — 19 August 2010 2 of 16 NXP Semiconductors CBTD3861 10-bit level shifting bus switch with output enable 4. Functional diagram 5. Pinning information
5.1 Pinning
Fig 1. Logic diagram 001aam471 A1 22 2 B1 A10 11 OE 23
13 B10
Fig 2. Pin configuration for TSSOP24 (SOT355-1) F ig 3. Pin configuration for SSOP24 (SOT556-1) CBTD3861 n.c. V CC A1 OE A2 B1 A3 B2 A4 B3 A5 B4 A6 B5 A7 B6 A8 B7 A9 B8 A10 B9 GND B10 001aam477 CBTD3861 n.c. V CC A1 OE A2 B1 A3 B2 A4 B3 A5 B4 A6 B5 A7 B6 A8 B7 A9 B8 A10 B9 GND B10 001aam478
5.2 Pin description
[1] H = HIGH voltage level; L = LOW voltage level; Z = high-impedance OFF-state. (1) The die substrate is attached to this p ad using conductive die attach material. It can not be used as supply pin or input. Table 2. Pin description Table 3. Function selection [1]
conditions for extended periods may affect device reliability. [2] The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
- Recommended operating conditions
Table 4. Limiting values Tamb = −40 °C to +85 °C, unless otherwise specified. Table 5. Operating conditions All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Table 6. Static characteristics Voltages are referenced to GND (ground = 0 V).
[1] All typical values are at V CC =5V , Tamb =2 5 °C. [2] This is the increase in supply current for each input th at is at the specified TTL voltage level rather than VCC or GND. determined by the lowest voltage of the two (nAn or nBn) terminals.
9.1 Typical pass voltage graphs
Table 6. Static characteristics …continued Voltages are referenced to GND (ground = 0 V).
Product data sheet Rev. 1 — 19 August 2010 6 of 16 NXP Semiconductors CBTD3861 10-bit level shifting bus switch with output enable (1) I SW = 100 μA (2) I SW = 6 mA (3) I SW =12 mA (4) I SW = 24 mA (1) I SW = 100 μA (2) I SW = 6 mA (3) I SW =12 mA (4) I SW = 24 mA Fig 7. Pass voltage versus supply voltage; Tamb =2 5 °C (typical) Fig 8. Pass voltage versus supply voltage; Tamb =0 °C (typical) 001aak836 VCC (V) 4.4 5.6 5.24.8 2.8 2.4 3.2 3.6 Vpass (V) 2.0 (4) (1) (2) (3) 001aak837 VCC (V) 4.4 5.6 5.24.8 2.8 2.4 3.2 3.6 Vpass (V) 2.0 (4) (1) (3) (2) (1) I SW = 100 μA (2) I SW = 6 mA (3) I SW =12 mA (4) I SW = 24 mA Fig 9. Pass voltage versus supply voltage; T amb = −40 °C (typical) 001aak838 VCC (V) 4.4 5.6 5.24.8 2.8 2.4 3.2 3.6 Vpass (V) 2.0 (1) (3) (2) (4)
when driven by an ideal voltage source (zero output impedance). [2] t pd is the same as tPLH and tPHL. ten is the same as tPZL and tPZH. tdis is the same as tPLZ and tPHZ. Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 12. Measurement points are given in Table 8. Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Measurement points are given in Table 8. Logic levels: VOL and VOH are typical output voltage levels that occur with the output load. Table 8. Measurement points
Test data is given in Table 9. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz; Zo =5 0 Ω. The outputs are measured one at a time with one transition per measurement. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to output impedance Zo of the pulse generator. VEXT = External voltage for measuring switching times. Table 9. Test data
Product data sheet Rev. 1 — 19 August 2010 10 of 16 NXP Semiconductors CBTD3861 10-bit level shifting bus switch with output enable 13. Package outline Fig 13. Package outline SOT556-1 (SSOP24) UNIT A 1 A2 A3 HE Lpbp cD (1) E(1) Z(1)eL y wv θ REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.25 0.10 1.55 1.40 0.25 0.31 0.20 0.25 0.18 8.8 8.6 4.0 3.8 0.635 1 6.2 5.8 0.89 0.41 1.05 0.66 o o o o 0.180.25 0.1 DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) Note 1. Plastic or metal protrusions of 0.2 mm (0.008 inch) maximum per side are not included. SOT556-1 99-12-27 03-02-18 w M bp D HE E Z e c v M A X A y 1 12 24 13 θ A Lp detail X L (A )3 MO-137 0 2.5 5 mm scale SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635 mm SOT556-1 A max. 1.73 inches 0.0098 0.0040 0.061 0.055 0.01 0.012 0.008 0.0098 0.0075 0.344 0.337 0.157 0.150 0.025 0.0410.244 0.228 0.035 0.016 0.040
Product data sheet Rev. 1 — 19 August 2010 11 of 16 NXP Semiconductors CBTD3861 10-bit level shifting bus switch with output enable Fig 14. Package outline SOT355-1 (TSSOP24) UNIT A 1 A2 A3 bp cD (1) E(2) (1)eH E LL p QZ ywv θ REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 7.9 7.7 4.5 4.3 0.65 6.6 6.2 0.4 0.3 o o0.13 0.10.21 DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 SOT355-1 MO-153 99-12-27 03-02-19 0.25 0.5 0.2 w M bp Z e 11 2 24 13 pin 1 index θ AA1 Lp Q detail X L (A )3 HE E c v M A XAD y 0 2.5 5 mm scale TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm SOT355-1 A max. 1.1
Product data sheet Rev. 1 — 19 August 2010 12 of 16 NXP Semiconductors CBTD3861 10-bit level shifting bus switch with output enable Fig 15. Package outline SOT815-1 (DHVQFN24) REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. SOT815-1 0 2.5 5 mm scale b yy1 C C AC C Bv M w M terminal 1 index area terminal 1 index area X UNIT A(1) max. A1 bc e Eh Le1 ywv mm 1 0.05 0.00 0.30 0.18 0.5 4.5 1.50.2 2.25 1.95 Dh 4.25 3.95 0.05 0.05 0.10.1 DIMENSIONS (mm are the original dimensions) 0.5 0.3 D(1) 5.6 5.4 E(1) 3.6 3.4 D E B A e DHVQFN24: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 24 terminals; body 3.5 x 5.5 x 0.85 mm A A1 c detail X Eh L Dh
Table 10. Abbreviations Table 11. Revision history
Product data sheet Rev. 1 — 19 August 2010 14 of 16 NXP Semiconductors CBTD3861 10-bit level shifting bus switch with output enable 16. Legal information
16.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.
16.3 Disclaimers
Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. The product is not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This docu ment contains the product specification.
Product data sheet Rev. 1 — 19 August 2010 15 of 16 NXP Semiconductors CBTD3861 10-bit level shifting bus switch with output enable Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors CBTD3861 10-bit level shifting bus switch with output enable © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 19 August 2010 Document identifier: CBTD3861 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 18. Contents