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Technical content

1© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C 1121_CBR_AUTO • 6/28/2022 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Built Into Tomorrow Benefits

  • A EC-Q200 Qualified
  • U ltra-low ESR and High Q
  • H igh SRF
  • H igh thermal stability
  • 1 M Hz to 50 GHz frequency range
  • Operating temperature range of −55°C to +125°C
  • B ase metal electrode (BME) dielectric system
  • P b-free and RoHS compliant
  • 0 402 and 0603 case sizes (inches)
  • D C voltage rating of 50 V
  • C apacitance offerings ranging from 0.1 pF up to 100 pF
  • A vailable capacitance tolerances of ±0.05 pF, ±0.1 pF,
  • N egligible capacitance change with respect to temperature
  • 1 00% pure matte tin-plated termination finish allowing for excellent solderability

Applications

  • V2X
  • S afety Systems
  • P ower Train
  • A utomotive Communication Systems
  • B ypass, coupling, filtering, impedance matching, DC blocking Overview KEMET’s HiQ CBR Automotive RF Capacitor Series features a copper electrode BME (Base Metal Electrode) system that offers ultra-low ESR and High Q in the VHF , UHF , and microwave frequency bands. Low ESR allows for higher RF currents which are ideal for applications such as V2X, safety systems, power train and automotive communication systems. CBR Series capacitors exhibit no change in capacitance with respect to time and voltage, and boast a negligible change in capacitance with reference to ambient temperature. KEMET's HiQ CBR RF capacitors are characterized using Modelithics TM substrate scalable models and is available in most EDA software. Contact KEMET Sales for details on accessing models. Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Frequency Applications HiQ-CBR Automotive Series, C0G Dielectric, Low ESR, 50 VDC, 1 MHz – 50 GHz (RF & Microwave)

2© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C 1121_CBR_AUTO • 6/28/2022 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Frequency Applications HiQ-CBR Automotive Series, C0G Dielectric, Low ESR, 50 VDC, 1 MHz – 50 GHz (RF & Microwave)

Ordering Information

CBR 04 C 330 F 5 G A C AUTO Series Case Size (L"x W " ) Specification/ Series Capacitance Code (pF) Capacitance Tolerance Voltage Dielectric Termination Style Termination Finish Packaging/ Grade (C-Spec) CBR 04 = 0402 06 = 0603 C = Standard Two significant digits a nd number of zeros Use 9 for 1.0 – 9.9 pF Use 8 for 0.1 – 0.99 pF ex. 2.2 pF = 229 ex. 0.5 pF = 508 A = ±0.05 pF B = ±0.1 pF C = ±0.25 pF D = ±0.5 pF F = ±1% G = ±2% J = ±5% 5 = 50 V G = C0G A = N/A C = 100% Matte Sn See "Packaging C-Spec Ordering Options Table" Tape & Reel Packaging Information Packaging Type Packaging Ordering Code (C-SPEC) 7" Reel AUTO 13" Reel AUTO7411 Environmental Compliance Lead (Pb)-free, RoHS, and REACH compliant without exemptions Lead-free Qualification/Certification Automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC-Q200, Stress T est Qualification for Passive Components. F or additional information regarding the Automotive Electronics Council and AEC-Q200, please visit their website at www.aecouncil.com.

3© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C 1121_CBR_AUTO • 6/28/2022 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Frequency Applications HiQ-CBR Automotive Series, C0G Dielectric, Low ESR, 50 VDC, 1 MHz – 50 GHz (RF & Microwave) Automotive C-Spec Information KEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC–Q200, Stress T est Qualification for Passive Components. These products are supported by a Product Change Notification (PCN) and Production Part Approval Process warr ant (PPAP). Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.” This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade component without the requirement to submit a customer Source Controlled Drawing (SCD) or specification for review by a KEME T engineering specialist. This C-Spec is therefore not intended for use by KEMET OEM automotive customers and are not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited (see details below.) Product Change Notification (PCN) The KEMET product change notification system is used to communicate primarily the following types of changes: Product/process changes th at affect product form, fit, function, and/or reliability Changes in manufacturing site Product obsolescence KEMET Automotive C-Spec Customer Notification Due To: Days Prior To ImplementationProcess/Product change Obsolescence* KEMET assigned 1 Yes (with approval and sign off) Yes 180 days minimum AUTO Yes (without approval) Yes 90 days minimum 1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET. Production Part Approval Process (PPAP) The purpose of the Production Part Approval Process is:

  • T o ensure that supplier can meet the manufacturability and quality requirements for the purchased parts. To provide the evidence that all customer engineering design records and specification requirements are properly u nderstood and fulfilled by the manufacturing organization.
  • T o demonstrate that the established manufacturing process has the potential to produce the part. KEMET Automotive C-Spec PPAP (Product Part Approval Process) Level 1 2 3 4 5 KEMET assigned 1 ● ● ● ● ● AUTO ○ 1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET. Part number specific PPAP available ○ Product family PPAP only

4© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C 1121_CBR_AUTO • 6/28/2022 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Frequency Applications HiQ-CBR Automotive Series, C0G Dielectric, Low ESR, 50 VDC, 1 MHz – 50 GHz (RF & Microwave) Dimensions – Millimeters (Inches) T W L B Case Size (in.) Case Size (mm) L Length W Width T Thickness B Bandwidth Mounting Technique 0402 1005 1.00 ±0.05 (0.040 ±0.002) 0.50 ±0.05 (0.020 ±0.002) 0.50 ±0.05 (0.020 ±0.002) 0.25 ±0.10 (0.010 ±0.004) Solder Wave or Solder Reflow0603 1608 1.60 ±0.10 (0.063 ±0.004) 0.80 ±0.10 (0.031 ±0.004) 0.80 ±0.10 (0.031 ±0.004) 0.40 ±0.20 (0.016 ±0.008) Electrical Parameters/Characteristics Item Parameters/Characteristics Operating Temperature Range −55°C to +125°C C apacitance Change with Reference to +25°C and VDC Applied (TCC) ±30 ppm/°C Ag ing Rate (Maximum % Capacitance Loss/Decade Hour) 0% 1Dielectric Withstanding Voltage (DWV) 250% of rated voltage (5 ±1 seconds and charge/discharge not exceeding 50 mA) 2Quality Factor (Q): ≥ 1,000 for capacitance values ≥ 30 pF ≥ 400 + 20C for capacitance values < 30 pF (C = Capacitance in pF) Insulation Resistance (IR) Limit at 25°C 10 GΩ minimum (rated voltage applied for 120 seconds) 1 DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the capacitor. 2 Capacitance and Quality Factor (Q) measured at 1 MHz ±100 kHz and 1.0 ±0.2 V rms

5© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C 1121_CBR_AUTO • 6/28/2022 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Frequency Applications HiQ-CBR Automotive Series, C0G Dielectric, Low ESR, 50 VDC, 1 MHz – 50 GHz (RF & Microwave) Case Size – Inches (mm) 0402 (1005) 0603 (1608) Rated Voltage (VDC) 50 50 Voltage Code 5 5 Capacitance Capacitance Tolerance Capacitance Code (Available Capacitance) 0.1 pF B = ±0.1pF 108 0.2 pF A = ±0.05 pF B = ±0.1 pF C = ±0.25 pF 208 208 0.3 pF 308 308 0.4 pF 408 408 0.5 pF 508 508 0.6 pF 608 608 0.7 pF 708 708 0.8 pF 808 808 0.9 pF 908 908 1.0 pF 109 109 1.1 pF 119 119 1.2 pF 129 129 1.3 pF 139 139 1.4 pF 149 149 1.5 pF 159 159 1.6 pF 169 169 1.7 pF 179 179 1.8 pF 189 189 1.9 pF 199 199 2.0 pF 209 209 2.1 pF A = ±0.05 pF B = ±0.1 pF C = ±0.25 pF D = ±0.5 pF 219 219 2.2 pF 229 229 2.3 pF 239 239 2.4 pF 249 249 2.5 pF 259 259 2.6 pF 269 269 2.7 pF 279 279 2.8 pF 289 289 2.9 pF 299 299 3.0 pF 309 309 3.1 pF 319 319 3.2 pF 329 329 3.3 pF 339 339 3.4 pF 349 349 3.5 pF 359 359 3.6 pF 369 369 3.7 pF 379 379 3.8 pF 389 389 3.9 pF 399 399 4.0 pF 409 409 4.1 pF 419 419 4.2 pF 429 429 4.3 pF 439 439 4.4 pF 449 449 4.5 pF 459 459 4.6 pF 469 469 4.7 pF 479 479 4.8 pF 489 489 4.9 pF 499 499 5.0 pF 509 509 Rated Voltage (VDC) 50 50 Voltage Code 5 5 Table 1 – CBR AUTO Series, Capacitance Range Waterfall

6© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C 1121_CBR_AUTO • 6/28/2022 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Frequency Applications HiQ-CBR Automotive Series, C0G Dielectric, Low ESR, 50 VDC, 1 MHz – 50 GHz (RF & Microwave) Case Size – Inches (mm) 0402 (1005) 0603 (1608) Rated Voltage (VDC) 50 50 Voltage Code 5 5 Capacitance Capacitance Tolerance Capacitance Code (Available Capacitance) 5.1 pF B = ±0.1 pF C = ±0.25 pF D = ±0.5 pF 519 519 5.2 pF 529 529 5.3 pF 539 539 5.4 pF 549 549 5.5 pF 559 559 5.6 pF 569 569 5.7 pF 579 579 5.8 pF 589 589 5.9 pF 599 599 6.0 pF 609 609 6.1 pF 619 619 6.2 pF 629 629 6.3 pF 639 639 6.4 pF 649 649 6.5 pF 659 659 6.6 pF 669 669 6.7 pF 679 679 6.8 pF 689 689 6.9 pF 699 699 7.0 pF 709 709 7.1 pF 719 719 7.2 pF 729 729 7.3 pF 739 739 7.4 pF 749 749 7.5 pF 759 759 7.6 pF 769 769 7.7 pF 779 779 7.8 pF 789 789 7.9 pF 799 799 8.0 pF 809 809 8.1 pF 819 819 8.2 pF 829 829 8.3 pF 839 839 8.4 pF 849 849 8.5 pF 859 859 8.6 pF 869 869 8.7 pF 879 879 8.8 pF 889 889 8.9 pF 899 899 9.0 pF 909 909 9.1 pF 919 919 9.2 pF 929 929 9.3 pF 939 939 9.4 pF 949 949 9.5 pF 959 959 9.6 pF 969 969 9.7 pF 979 979 9.8 pF 989 989 9.9 pF 999 999 Rated Voltage (VDC) 50 50 Voltage Code 5 5 Table 1 – CBR AUTO Series, Capacitance Range Waterfall cont.

7© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C 1121_CBR_AUTO • 6/28/2022 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Frequency Applications HiQ-CBR Automotive Series, C0G Dielectric, Low ESR, 50 VDC, 1 MHz – 50 GHz (RF & Microwave) Case Size – Inches (mm) 0402 (1005) 0603 (1608) Rated Voltage (VDC) 50 50 Voltage Code 5 5 Capacitance Capacitance Tolerance Capacitance Code (Available Capacitance) 10 pF F = ±1% G = ±2% J = ±5% 100 100 11 pF 110 110 12 pF 120 120 13 pF 130 130 15 pF 150 150 16 pF 160 160 18 pF 180 180 20 pF 200 200 22 pF 220 220 24 pF 240 240 27 pF 270 270 30 pF 300 300 33 pF 330 330 36 pF 360 360 39 pF 390 390 43 pF 430 430 47 pF 470 470 51 pF 510 510 56 pF 560 560 62 pF 620 620 68 pF 680 680 75 pF 750 750 82 pF 820 820 91 pF 910 910 100 pF 101 101 Rated Voltage (VDC) 50 50 Voltage Code 5 5 Table 1 – CBR AUTO Series, Capacitance Range Waterfall cont. Table 2 – Chip Thickness/Reeling Quantities Chip Size Inches (mm) Chip Thickness (mm) Reel Quantity 7" Paper 13" Paper 0402 (1005) 0.50 ±0.05 10,000 50,000 0603 (1608) 0.80 ±0.10 4,000 15,000

8© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C 1121_CBR_AUTO • 6/28/2022 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Frequency Applications HiQ-CBR Automotive Series, C0G Dielectric, Low ESR, 50 VDC, 1 MHz – 50 GHz (RF & Microwave) Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351 (mm) Case Size (Inches) Case Size (mm) Density Level A: Maximum (Most) Land Protrusion Density Level B: Median (Nominal) Land Protrusion Density Level C: Minimum (Least) Land Protrusion C Y X V1 V2 C Y X V1 V2 C Y X V1 V2 Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of 0603(1608) and 0805 (2012) case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351). Image below based on Density Level B for an EIA 1608 case size. C C X Grid Placement Courtyard Y X Y

9© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C 1121_CBR_AUTO • 6/28/2022 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Frequency Applications HiQ-CBR Automotive Series, C0G Dielectric, Low ESR, 50 VDC, 1 MHz – 50 GHz (RF & Microwave) Soldering Process Recommended Soldering Technique: Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 All other EIA case sizes are limited to solder reflow only Recommended Reflow Soldering Profile: KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal str ess. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/ J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions. Profile Feature Termination Finish SnPb 100% Matte Sn Preheat/Soak Temperature Minimum (T Smin) 100°C 150°C Temperature Maximum (T Smax) 150°C 200°C Time (tS) from TSmin to TSmax 60 – 120 seconds 60 – 120 seconds Ramp-Up Rate (T L to TP) 3°C/second m aximum 3°C/second m aximum Liquidous Temperature (T L) 183°C 217°C Time Above Liquidous (t L) 60 – 150 seconds 60 – 150 seconds Peak Temperature (T P) 235°C 260°C Time Within 5°C of Maximum Pe ak Temperature (t P) 20 seconds maximum 30 seconds maximum Ramp-Down Rate (T P to TL) 6°C/second m aximum 6°C/second m aximum Time 25°C to Peak T emperature 6 minutes maximum 8 minutes maximum Note 1: All temperatures refer to the center of the package, measured on the capacitor body surface that is facing up during assembly reflow. Time Temperature Tsmin Tsmax TL TP Maximum Ramp-up Rate = 3°C/second Maximum Ramp-down Rate = 6°C/second tP tL ts 25°C to Peak

10© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C 1121_CBR_AUTO • 6/28/2022 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Frequency Applications HiQ-CBR Automotive Series, C0G Dielectric, Low ESR, 50 VDC, 1 MHz – 50 GHz (RF & Microwave) Storage and Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degradedby high temperature – reels may soften or warp, and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40°C, and maximum st orage humidity not exceed 70% relative humidity. In addition, temperature fluctuations should be minimized to avoid condensation on the par ts, and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability, chip stock should be used promptly, preferably within 1.5 years of receipt. Construction Dielectric Material (BaTiO3 Based) Detailed Cross Section Barrier Layer (Ni) Inner Electrodes (Cu) Termination Finish (100% Matte Sn) Barrier Layer (Ni)Termination Finish (100% Matte Sn) Inner Electrodes (Cu) Dielectric Material (BaTiO3 Based) End Termination/ External Electrode (Cu) End Termination/ External Electrode (Cu)

11© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C 1121_CBR_AUTO • 6/28/2022 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Frequency Applications HiQ-CBR Automotive Series, C0G Dielectric, Low ESR, 50 VDC, 1 MHz – 50 GHz (RF & Microwave) Tape & Reel Packaging Information KEMET offers RF and Microwave Multilayer Ceramic Chip Capacitors packaged in 8 mm tape on 7" reels. This packaging system is compatible with all tape-fed automatic pick and place systems. Table 4 – Carrier Tape Configuration (mm) EIA Case Size Tape Size (W)* Lead Space (P 1)* 0402 8 2 0603 8 4 *Refer to Figure 1 for W and P 1 carrier tape reference locations. *Refer to Table 6 for tolerance specifications. 8 mm Carrier Tape 180 mm (7.00") Anti-Static Reel Punched Paper Carrier Punched Cavity Anti-Static Cover Tape (0.10mm (0.004") Maximum Thickness) KEMET Bar Code Label Sprocket Holes

12© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C 1121_CBR_AUTO • 6/28/2022 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Frequency Applications HiQ-CBR Automotive Series, C0G Dielectric, Low ESR, 50 VDC, 1 MHz – 50 GHz (RF & Microwave) Figure 1 – Punched (Paper) Carrier Tape Dimensions P2A0 W T E F Table 5 – Punched (Paper) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size D0 E1 P0 P2 R Reference Note 2 K0 8 mm 1.55+0.05 (0.061+0.002) 1.55±0.05 (0.061±0.002) 4.0±0.10 (0.157±0.004) 2.0±0.05 (0.079±0.002) 25.0 (0.984) - Variable Dimensions — Millimeters (Inches) Tape Size Pitch A0 B0 F P1 T W D1 8 mm Half (2 mm) 0.37±0.03 (0.015±0.001) 0.67±0.03 (0.03±0.001) 3.5±0.05 (0.138±0.002) 2.0±0.05 (0.079±0.002) 0.42±0.03 (0.017±0.001) 8.0±0.10 (0.315±0.004) - 0.62±0.05 (0.025±0.002) 1.12±0.05 (0.04±0.002) 0.60±0.05 (0.024±0.002) 8 mm Single (4 mm) 1.00±0.10 (0.040±0.004) 1.80±0.10 (0.157±0.004) 0.95±0.05 (0.037±0.002) 1.50±0.10 (0.06±0.004) 2.30±0.10 (0.09±0.004) 0.95±0.05 (0.037±0.002) 2. The tape with or without components shall pass around R without damage (see Figure 3).

15© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C 1121_CBR_AUTO • 6/28/2022 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Frequency Applications HiQ-CBR Automotive Series, C0G Dielectric, Low ESR, 50 VDC, 1 MHz – 50 GHz (RF & Microwave) KEMET Electronics Corporation Sales Offi ces For a complete list of our global sales offi ces, please visit www.kemet.com/sales. Disclaimer All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicated or that other measures may not be required. KEMET is a registered trademark of KEMET Electronics Corporation.