CBC050 CYMBET | Alldatasheet

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Technical content

Features

All Solid State Construction• Lead-Free Reflow Tolerant• Thousands of Recharge Cycles• Low Self-Discharge• Eco-Friendly, RoHS Compliant• Electrical Properties Output voltage: 3.8V Capacity (typical): 50µAh Charging source: 4.00V to 4.15V Recharge time to 80%: 20 minutes Charge/Discharge cycles: >5000 to 10% DOD Physical Properties Package size: 8 mm x 8 mm Operating temperature: -20°C to 70°C Storage temperature: -40°C to 125°C The EnerChip™ CBC050 is a surface-mount, solid state, rechargeable energy storage device rated for 50µAh at 3.8V. It is ideal as a localized, on- board power source for SRAMs, real-time clocks and microcontrollers which require standby power to retain time or data. It is also suitable for RFID tags, smart sensors, and remote applications which require a miniature, low-cost, and rugged power source. For many applications, the CBC050 is a superior alternative to coin cell batteries and supercapacitors. Because of their solid state design, EnerChip™ storage devices are able to withstand solder reflow temperatures and can be processed in high- volume manufacturing lines similar to conventional semiconductor devices. There are no harmful gases, liquids or special handling procedures, in contrast to traditional rechargeable batteries. The EnerChip recharge is fast and simple, with a direct connection to a 4.1V voltage source and no current limiting components. Recharge time is 20 minutes to 80% capacity. Robust design offers thousands of charge/discharge cycles. The CBC050 is packaged in an 8 mm x 8 mm quad flat package. It is available in reels for use with automatic insertion equipment.

Applications

Standby supply • for non-volatile SRAM, real-time clocks, controllers, supply supervisors, and other system-critical components. Wireless sensors and RFID tags• and other powered, low duty cycle applications. Localized power source• to keep microcontrollers and other devices alert in standby mode. Power bridging• to provide backup power to system during exchange of main batteries. Energy Harvesting• by coupling the EnerChip with energy transducers such as solar panels. Embedded Energy• where bare die can be embedded into modules or co-packaged with other ICs. Pin Number(s) Description 1 V+ 4 V- 2,3 NIC 5-16 NIC Note: NIC = No Internal Connection 8 mm x 8 mm CBC050 Schematic - Top View 5.7 mm x 6.1 mm Bare Die

EnerChip™ CBC050 Solid State Energy Storage ©2009-2010 Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com DS-72-01 Rev B Page 2 of 4 Operating Characteristics Parameter Condition Min Typical Max Units Discharge Cutoff Voltage 25°C 3.0(1) - - V Charge Voltage 25°C 4.0(2) 4.1 4.3 V Pulse Discharge Current 25°C 300(3) - - µA Cell Resistance (25°C) Charge cycle 2 - 750 2000 ΩCharge cycle 1000 - 4200 7000 Self-Discharge (5yr average; 25°C) Non-recoverable - 2.5 - % per year Recoverable - 1.5(4) - % per year Operating Temperature - -20 25 +70 °C Storage Temperature - -40 - 125(5) °C Recharge Cycles (to 80% of rated capacity; 4.1V charge voltage) 25°C 10% depth-of-discharge 5000 - - cycles 50% depth-of discharge 1000 - - cycles 40°C 10% depth-of-discharge 2500 - - cycles 50% depth-of-discharge 500 - - cycles Recharge Time (to 80% of rated capacity; 4.1V charge voltage) Charge cycle 2 - 20 35 minutesCharge cycle 1000 - 60 95 Capacity 100µA discharge; 25°C 50 - - µAh (1) Failure to cutoff the discharge voltage at 3.0V will result in EnerChip performance degradation. (2) Charging at 4.0V will charge the cell to approximately 70% of its rated capacity. (3) Typical pulse duration = 20 milliseconds. (4) First month recoverable self-discharge is 5% average. (5) Storage temperature is for uncharged EnerChip. EnerChip Part Number Description Notes CBC050-M8C 50µAh in 16-pin M8 QFN Package tube CBC050-M8C-TR1 50µAh in 16-pin M8 QFN Package tape & reel 1000 pcs CBC050-M8C-TR5 50µAh in 16-pin M8 QFN Package tape & reel 5000 pcs CBC050-M8C-WP 50µAh in 16-pin M8 QFN Package waffle pack CBC050-BDC-WP 50µAh Bare Die Contact Cymbet CBC050-BUC-WP 50µAh Bumped Bare Die Contact Cymbet

Ordering Information

Note: All specifications contained within this document are subject to change without notice EnerChip Discharge Characteristics

EnerChip™ CBC050 Solid State Energy Storage ©2009-2010 Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com DS-72-01 Rev B Page 3 of 4 Package Dimensions - 16-pin QFN (package code M8) [Dimensions in inches [mm]

EnerChip™ CBC050 Solid State Energy Storage ©2009-2010 Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com DS-72-01 Rev B Page 4 of 4 Figure 1: Recommended PCB layout for the CBC050 package. Do not route signal traces under the EnerChip as they could become shorted to the die pad (as shown by the dotted lines) on the package underside. Printed Circuit Board (PCB) Layout Guidelines and Recommendations Electrical resistance of solder flux residue on PCBs can be low enough to partially or fully discharge the backup energy cell and in some cases can be comparable to the load typically imposed on the cell when delivering power to an integrated circuit in low power mode. Therefore, solder flux must be thoroughly washed from the board following soldering. The PCB layout can make this problem worse if the cell’s positive and negative terminals are routed near each other and under the package, where it is difficult to wash the flux residue away. To avoid this situation, make sure positive and negative traces are routed outside of the package footprint to ensure that flux residue will not cause a discharge path between the positive and negative pads. Similarly, a leakage current path can exist from the package lead solder pads to the exposed die pad on the underside of the package as well as any solder pad on the PCB that would be connected to that exposed die pad during the reflow solder process. Therefore, it is strongly recommended that the PCB layout not include a solder pad in the region where the exposed die pad of the package will land. It is sufficient to place PCB solder pads only where the package leads will be. That region of the PCB where the exposed die pad will land must not have any solder pads, traces, or vias. When placing a silk screen on the PCB around the perimeter of the package, place the silk screen outside of the package and all metal pads. Failure to observe this precaution can result in package cracking during solder reflow due to the silk screen material interfering with the solder solidification process during cooling. A recommended CBC050 PCB layout is shown in Figure 1 below. Notice that there should not be a center pad on the PCB to mate with the exposed die pad on the CBC050 package. Again, this is to reduce the possible number and severity of leakage paths between the EnerChip terminals. Dimensions in inches [mm] Cymbet, the Cymbet Logo and EnerChip are trademarks of Cymbet Corporation. All Rights Reserved 5 76 8 13141516 Disclaimer of Warranties; As Is The information provided in this data sheet is provided “As Is” and Cymbet Corporation disclaims all representations or warranties of any kind, express or implied, relating to this data sheet and the Cymbet EnerChip product described herein, including without limitation, the implied warranties of merchantability, fitness for a particular purpose, non-infringement, title, or any warranties arising out of course of dealing, course of performance, or usage of trade. Cymbet EnerChip products are not approved for use in life critical applications. Users shall confirm suitability of the Cymbet EnerChip product in any products or applications in which the Cymbet EnerChip product is adopted for use and are solely responsible for all legal, regulatory, and safety-related requirements concerning their products and applications and any use of the Cymbet EnerChip product described herein in any such product or applications. Soldering, Rework, and Electrical Test Refer to the Cymbet User Manual for soldering, rework, and replacement of the EnerChip on printed circuit boards, and for instructions on in-circuit electrical testing of the EnerChip.