CBA3216GA300N4 SAMWHA | Alldatasheet

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SAMWHA ELECTRONICS CO., LTD vApplications vFeatures vDimensions Array Series http://www.samwha.com/chip This description in the this catalogue is subject to change without notice

  • CD-ROM, DVD, MD Lines
  • Digital TVs and VTRs (unit : mm)
  • Good reliability (Monolithic structure)
  • Magnetically shielded
  • Fast mounting speed
  • RoHS compliant vGeneral Code vTemperature Range
  • Operating Temp. -55 ~ +125℃
  • Storage Temp. -10 ~ +40 ℃ vTypical Material Characteristics A J,K M V High μ Low μ (Low RXCP) (High RXCP) DPS-081104 CHIP BEADS ARRAY CBA

3216 G 121 E

A Series Code CBA : Chip Ferrite Beads Array Dimension Code The first two digits : length (mm) The last two digits : width (mm) Application Code G : Signal Line P : High Current Line U : Ultra High Current Line Material Code A: General Frequency K,J: Medium Frequency M: High Frequency V: Very High Frequency Impedance Value Code The first two digits represents significant The last digit is the number of zeros following ex) 121 = 120 (Ω) Number of circuit N4 : 4 array Packaging Code E : Reel embossed tape packaging L W B D E T 0.4±0.15E 3.2±0.20L 0.3±0.20B 1.6±0.20W 0.9±0.20T 0.8±0.10D 3216Size

SAMWHA ELECTRONICS CO., LTD v3216 SIZE http://www.samwha.com/chip DPS-081104 This description in the this catalogue is subject to change without notice ※Measuring Equipment -. Z : HP4291B / E4991A -. Rdc : HP4338B CHIP BEAD ARRAY Series CHIP BEADS ARRAY 1000.50600CBA3216GM601N4 2000.1030CBA3216GM300N4 1500.751000CBA3216GK102N4 2000.60600CBA3216GK601N4 2000.50470CBA3216GK471N4 2500.40300CBA3216GK301N4 2500.35220CBA3216GK221N4 3500.30120CBA3216GK121N4 4000.2560CBA3216GK600N4 500.70100CBA3216GA102N4 1000.50601CBA3216GA601N4 1000.45470CBA3216GA471N4 1000.40300CBA3216GA301N4 1500.35220CBA3216GA221N4 3000.30120CBA3216GA121N4 2000.2560CBA3216GA600N4 100 2000.1030CBA3216GA300N4 1000.45470CBA3216GM471N4 1000.45300CBA3216GM301N4 1000.20120CBA3216GM121N4 2000.1260CBA3216GM600N4 Test Frequency (MHz) Rated Current (mA) max. DC Resistance (Ω) max. Impedance (Ω) ±25%Samwha P/N

SAMWHA ELECTRONICS CO., LTD v3216 SIZE http://www.samwha.com/chip This description in the this catalogue is subject to change without notice DPS-081104 CHIP BEADS ARRAY CHIP BEAD ARRAY Series 1 10 100 1000 100 X R Z CBA 3216 GA 600 N4 Impedance [W] Frequency [MHz] 1 10 100 1000 100 150 200 X R Z CBA 3216 GA 121 N4 Impedance [W] Frequency [MHz] 1 10 100 1000 X R Z CBA 3216 GA 300 N4 Impedance [W] Frequency [MHz] 1 10 100 1000 150 225 300 X R Z CBA 3216 GA 221 N4 Impedance [W] Frequency [MHz] 1 10 100 1000 100 200 300 400 X R Z CBA 3216 GA 301 N4 Impedance [W] Frequency [MHz] 1 10 100 1000 200 400 600 800 X R Z CBA 3216 GA 601 N4 Impedance [W] Frequency [MHz] 1 10 100 1000 300 600 900 1200 X R Z CBA 3216 GA 102 N4 Impedance [W] Frequency [MHz] 1 10 100 1000 120 180 240 X R Z CBA 3216 GK 121 N4 Impedance [W] Frequency [MHz] 1 10 100 1000 100 200 300 400 X R Z CBA 3216 GK 221 N4 Impedance [W] Frequency [MHz] 1 10 100 1000 200 400 600 X R Z CBA 3216 GK 301 N4 Impedance [W] Frequency [MHz] 1 10 100 1000 200 400 600 800 X R Z CBA 3216 GK 471 N4 Impedance [W] Frequency [MHz] 1 10 100 1000 250 500 750 1000 X R Z CBA 3216 GK 601 N4 Impedance [W] Frequency [MHz]

SAMWHA ELECTRONICS CO., LTD Reliability & Test Condition http://www.samwha.com/chip This description in the this catalogue is subject to change without notice CHIP BEAD, Reliability & Test Condition Temperature : 125 ± 3 ℃ Applied current : rated current Time : 1000 ± 12 hours Measurement at room ambient temperature after placing for 24 hours High temperature load resistance Temperature : 40 ± 2 ℃ Humidity : 90 ± 2 % RH Time : 500 ± 12 hours Measurement at room ambient temperature after placing for 24 hours Humidity resistance Preheat temperature : 150 ℃ Preheat time : 60 sec. Solder temperature : 245 ± 5 ℃ Soldering time : 10 sec. max. (Reflow soldering profile) More than 50% of the terminal electrode shall be covered with new solder Reflow soldering at packing condition40 ℃max., 70% RH max.Storage temperature range Preheat temperature : 100 ~ 150 ℃ Preheat time : 60 sec. Solder temperature : 245 ± 5 ℃ Soldering time : 10 ± 1 sec. More than 90% of the terminal electrode shall be covered with new solderSolderability Preheat temperature : 100 ~ 150 ℃ Preheat time : 60 sec. Solder temperature : 270 ± 10 ℃ Soldering time : 10 ± 0.5 sec. 1. No damage such as cracks should be caused in chip element 2. More than 75% of the terminal electrode shall be covered with new solder 3. Impedance shall not change more than ±30 % Resistance to soldering heat Temperature : 125 ± 3 ℃ Time : 500 ± 12 hours Measurement at room ambient temperature after placing for 24 hours 1. No mechanical damage 2. Impedance shall not change more than ±30 % High temperature resistance --55 ℃~ + 125 ℃Operating temperaturerange Test ConditionsRequirementsItem ST ≥ CT1 CTST DPS-081104 CHIP BEADS ARRAY

SAMWHA ELECTRONICS CO., LTD http://www.samwha.com/chip This description in the this catalogue is subject to change without notice ITEM 4 ARRAY 0.4 0.8B (mm) 3.0 0.8 W (kgf) C (mm) A (mm) No mechanical damage Flexure strength 1. No mechanical damage 2. Impedance shall not change more than ±30 % Temperature : 40 ± 2 ℃ Humidity : 90 ± 2 % RH Applied current : rated current Time : 500 ± 12 hours Measurement at room ambient temperature after placing for 24 hours Humidity load resistance Temperature : -55 ± 3 ℃ Time : 1000 ± 12 hours Measurement at room ambient temperature after placing for 24 hours Low temperature resistance 1. -55 ± 3℃for 30 minutes 2.125 ± 3 ℃for 30 minutes 3. repeat 100 cycle Thermal shock The terminal electrode shall be neither break off nor the chip damage Drop 10 times on a concrete floor from a height of 100 cmDrop Bending strength Frequency : 10 ~ 55 Hz Amplitude : 1.5 mm Direction : X, Y, Z Sweep time : 2 hours for each axis Vibration Test ConditionsRequirementsItem R340 W 2 mm Resistance meter Reliability & Test Condition CHIP BEAD, Reliability & Test Condition DPS-081104 CHIP BEADS ARRAY W R0.5 A D B C Land pattern

SAMWHA ELECTRONICS CO., LTD http://www.samwha.com/chip This description in the this catalogue is subject to change without notice DPS-081104 CHIP BEADS Packaging CHIP BEAD,Packaging vStandard Quantity

0.85 T size

2,0004516 10,0001005 3,0003216 4,0001608 4,0002012 Remarks 1,0004532 Q’TY(PCS)Size vReel Dimension Φ13±0.5Φ50 min.Φ178±2 WED 2±0.2 B 9±1.54±0.8 CA (Unit:mm) vLeader & Blank Portion (Unit:mm) Blank 150 min BlankChips Leader

60 Pitch 60 Pitch

350±50 mm 350±50 mm

SAMWHA ELECTRONICS CO., LTD http://www.samwha.com/chip This description in the this catalogue is subject to change without notice DPS-081104 CHIP BEADS Packaging vTaping Dimensions (Paper tape) (Unit:mm) 4.0 4.0 2.0 P ±0.1 0.81.00.651.151005 1.12.01.001.801608 1.12.01.552.302012 T (Max.) S ±0.1 B ±0.1 A ±0.1Type B S P T A vTaping Dimensions (Emboss tape) (Unit:mm 0.231.251.853.503216 0.301.351.904.904516 0.301.403.604.854532 1.50 C ±0.1 0.231.452.252012 D ±0.1 B ±0.1 A ±0.1Type CHIP BEAD,Packaging

SAMWHA ELECTRONICS CO., LTD http://www.samwha.com/chip This description in the this catalogue is subject to change without notice DPS-081104 CHIP BEADS Soldering Profile 2 sec. max. 150 vReflow Soldering vFlow Soldering vManual Soldering CoolingSolderingPre -heating 150 60~120 sec. 10 sec. max. 60 sec. min. 245±5℃ 180 230 30~60 sec. CoolingSolderingPre -heating 250 250±5℃ 180 300 Tc Soldering Iron : 30W max. Diameter of soldering iron : 1.2 mm max. CHIP BEAD, Soldering Profile