CB4516UM600

CB1608UA101 SAMWHA | Alldatasheet

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Technical content

SAMWHA ELECTRONICS CO., LTD vApplications vFeatures vDimensions Ultra Power Line Series http://www.samwha.com/chip This description in the this catalogue is subject to change without notice

• PDP/LCD Monitor, Digital TV/VCR etc. L W T B (unit : mm)
• High Current characteristics
• Low Rdc characteristics
• Good reliability (Monolithic structure)
• Magnetically shielded
• Fast mounting speed
• RoHS compliant vGeneral Code Series Code CB : Chip Ferrite Beads Dimension Code The first two digits : length(mm) The last two digits : width(mm) Application Code G : Signal Line P : High Current Line U : Ultra High Current Line Material Code A: General Frequency K,J: Medium Frequency M: High Frequency V: Very High Frequency Impedance Value Code The first two digits represents significant The last digit is the number of zeros following ex) 300 = 30 (Ω) Packaging Code T : Reel paper packaging E : Reel embossed tape packaging CB

2012 U 300 T

A vTemperature Range

• Operating Temp. -55 ~ +125℃
• Storage Temp. -10 ~ +40 ℃ vTypical Material Characteristics A J,K M V High μ Low μ (Low RXCP) (High RXCP) DPS-081104 CHIP BEADS 0.85±0.2 1.5±0.25 T BWLSize

SAMWHA ELECTRONICS CO., LTD v1608~4532 SIZE http://www.samwha.com/chip DPS-081104 This description in the this catalogue is subject to change without notice ※Measuring Equipment -. Z : HP4291B / E4991A -. Rdc : HP4338B 40000.030120CB2012UJ121 60000.020120CB3216UA121 60000.01060CB3216UM600 60000.200120CB3216UM121 60000.01060CB4516UM600 60000.030120CB4532UK121 40000.045400CB4532UK401 40000.030120CB2012UM121 100 40000.030100CB1608UA101 40000.02550CB1608UK500 Test Frequency (MHz) Rated Current (mA) max. DC Resistance (Ω) max. Impedance (Ω) ±25%Samwha P/N 40000.030120CB2012UK121 40000.030120CB2012UA121 40000.020100CB2012UA101 50000.01560CB2012UA600 50000.01030CB2012UA300 40000.03060CB1608UK600 DPS-081104 CHIP BEADS, For Ultra Power Line CHIP BEAD, Ultra Power Line Series

SAMWHA ELECTRONICS CO., LTD v1608~4532 SIZE http://www.samwha.com/chip DPS-081104 This description in the this catalogue is subject to change without notice DPS-081104 CHIP BEADS, For Ultra Power Line CHIP BEAD, Ultra Power Line Series 1 10 100 1000 120 160 X R Z CB 2012 UM 121 Impedance [ Ω ] Frequency[MHz] 1 10 100 1000 X R Z CB 2012 UA 300 Impedance [Ohm] Frequency [MHz] 1 10 100 1000 120 X R Z CB 2012 UA 101 Impedance [Ohm] Frequency [MHz] 1 10 100 1000 100 150 200 X R Z CB 2012 UK 121 Impedance [Ohm] Frequency [MHz] 1 10 100 1000 120 160 X R Z CB 3216 UM 121 Impedance [ Ω ] Frequency[MHz] 1 10 100 1000 100 150 200 CB 2012 UJ 121 X R Z Impedance [ O ] Frequency [MHz] 1 10 100 1000 100 CB 1608 UK 500 X R Z Impedance [ O ] Frequency [MHz] 1 10 100 1000 100 CB 1608 UK 600 X R Z Impedance [ O ] Frequency [MHz] 1 10 100 1000 135 180 X R Z CB 3216 UA 121 Impedance [ O ] Frequency [MHz] 1 10 100 1000 140 210 280 X R Z CB 4532 UK 121 Impedance [ O ] Frequency [MHz]

SAMWHA ELECTRONICS CO., LTD Reliability & Test Condition http://www.samwha.com/chip This description in the this catalogue is subject to change without notice CHIP BEAD, Reliability & Test Condition Temperature : 125 ± 3 ℃ Applied current : rated current Time : 1000 ± 12 hours Measurement at room ambient temperature after placing for 24 hours High temperature load resistance Temperature : 40 ± 2 ℃ Humidity : 90 ± 2 % RH Time : 500 ± 12 hours Measurement at room ambient temperature after placing for 24 hours Humidity resistance Preheat temperature : 150 ℃ Preheat time : 60 sec. Solder temperature : 245 ± 5 ℃ Soldering time : 10 sec. max. (Reflow soldering profile) More than 50% of the terminal electrode shall be covered with new solder Reflow soldering at packing condition40 ℃max., 70% RH max.Storage temperature range Preheat temperature : 100 ~ 150 ℃ Preheat time : 60 sec. Solder temperature : 245 ± 5 ℃ Soldering time : 10 ± 1 sec. More than 90% of the terminal electrode shall be covered with new solderSolderability Preheat temperature : 100 ~ 150 ℃ Preheat time : 60 sec. Solder temperature : 270 ± 10 ℃ Soldering time : 10 ± 0.5 sec. 1. No damage such as cracks should be caused in chip element 2. More than 75% of the terminal electrode shall be covered with new solder 3. Impedance shall not change more than ±30 % Resistance to soldering heat Temperature : 125 ± 3 ℃ Time : 500 ± 12 hours Measurement at room ambient temperature after placing for 24 hours 1. No mechanical damage 2. Impedance shall not change more than ±30 % High temperature resistance --55 ℃~ + 125 ℃Operating temperaturerange Test ConditionsRequirementsItem ST ≥ CT1 CTST DPS-081104 CHIP BEADS

SAMWHA ELECTRONICS CO., LTD http://www.samwha.com/chip This description in the this catalogue is subject to change without notice 5.0 3.8 3.6 1.5 4532 5.0 3.0 3.6 1.5 4516 5.0 3.0 1.5 1.3 3216 4.0 1.3 1.0 1.0 2012 2.0 1.3 0.8 1.0 1608ITEM 1005 0.7 0.5B (mm) 0.7 0.7 W (kgf) C (mm) A (mm) No mechanical damage Flexure strength 1. No mechanical damage 2. Impedance shall not change more than ±30 % Temperature : 40 ± 2 ℃ Humidity : 90 ± 2 % RH Applied current : rated current Time : 500 ± 12 hours Measurement at room ambient temperature after placing for 24 hours Humidity load resistance Temperature : -55 ± 3 ℃ Time : 1000 ± 12 hours Measurement at room ambient temperature after placing for 24 hours Low temperature resistance 1. -55 ± 3℃for 30 minutes 2.125 ± 3 ℃for 30 minutes 3. repeat 100 cycle Thermal shock The terminal electrode shall be neither break off nor the chip damage Drop 10 times on a concrete floor from a height of 100 cmDrop Bending strength Frequency : 10 ~ 55 Hz Amplitude : 1.5 mm Direction : X, Y, Z Sweep time : 2 hours for each axis Vibration Test ConditionsRequirementsItem R340 W 2 mm Resistance meter Reliability & Test Condition CHIP BEAD, Reliability & Test Condition DPS-081104 CHIP BEADS W A B C R0.5 A

SAMWHA ELECTRONICS CO., LTD http://www.samwha.com/chip This description in the this catalogue is subject to change without notice DPS-081104 CHIP BEADS Packaging CHIP BEAD,Packaging vStandard Quantity

0.85 T size

2,0004516 10,0001005 3,0003216 4,0001608 4,0002012 Remarks 1,0004532 Q’TY(PCS)Size vReel Dimension Φ13±0.5Φ50 min.Φ178±2 WED 2±0.2 B 9±1.54±0.8 CA (Unit:mm) vLeader & Blank Portion (Unit:mm) Blank 150 min BlankChips Leader

60 Pitch 60 Pitch

350±50 mm 350±50 mm

SAMWHA ELECTRONICS CO., LTD http://www.samwha.com/chip This description in the this catalogue is subject to change without notice DPS-081104 CHIP BEADS Packaging vTaping Dimensions (Paper tape) (Unit:mm) 4.0 4.0 2.0 P ±0.1 0.81.00.651.151005 1.12.01.001.801608 1.12.01.552.302012 T (Max.) S ±0.1 B ±0.1 A ±0.1Type B S P T A vTaping Dimensions (Emboss tape) (Unit:mm 0.231.251.853.503216 0.301.351.904.904516 0.301.403.604.854532 1.50 C ±0.1 0.231.452.252012 D ±0.1 B ±0.1 A ±0.1Type CHIP BEAD,Packaging

SAMWHA ELECTRONICS CO., LTD http://www.samwha.com/chip This description in the this catalogue is subject to change without notice DPS-081104 CHIP BEADS Soldering Profile CHIP BEAD, Soldering Profile 2 sec. max. 150 vReflow Soldering vFlow Soldering vManual Soldering CoolingSolderingPre -heating 150 60~120 sec. 10 sec. max. 60 sec. min. 245±5℃ 180 230 30~60 sec. CoolingSolderingPre -heating 250 250±5℃ 180 300 Tc Soldering Iron : 30W max. Diameter of soldering iron : 1.2 mm max.