CB1F-10S-1.5H-TEJL-PA

CB1G-10S-1.5H-PEJC2 HIROSE | Alldatasheet

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Memory Stick® Connectors CB1 Series NEWNEW 2003.12 I Outline Receptacle connectors for use with the new generation of digital media devices requiring “Memory Stick ®” type of consumer removable memory card. Several variations are available: Miniature, Low Profile and with or without ejection mechanism. I Features 1. Indication of Incorrect Card Insertion The connector will not allow the card to be complete inserted from the wrong end or reversed. The card will stop about 7mm before complete insertion position, visually indicating incorrect insertion. 2. Protection of the Contacts Incorrect insertion of the card will not damage the contacts. The card can be easily withdrawn and re- inserted correctly. 3. Excellent Card Handling The type that is equipped with an ejection mechanism provides a long ejection of the card which offers excellent card handling qualities. *Memory Stick is a registered trademark of the Sony Corporation. Card Push Insert/Push Eject <CB1G Series> G Card ejection distance of 10 mm G Mounting height of 3.5 mm G Mounting area: Smaller design is 78% of former size Button Touch Ejection <CB1F Series> G Card ejection with tactile button operation G Card ejection distance of 10 mm G Equipped with card ejection switch Without Card Ejection <CB1D Series> G Miniaturized, low profile design G Improved installation to the equipment is permitted using (M1.7) tapping screws G Can be equipped with an ejection mechanism depending on the design of the equipment side portion Note: Please position the card ejection button at the side of the equipment.

1. Insulation resistance 1000 M ohms min. 500 V DC 2. Withstanding voltage No flashover or insulation breakdown 500 V AC / one minute 3. Contact resistance 100 m ohms max. 100mA DC 4. Vibration No electrical discontinuity of 1 µs or more Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 2 hours / 3 axis 5. Humidity Contact resistance: 40 m ohms max. from initial value Insulation resistance: 100 M ohms min. 6. Temperature cycle 7. Durability Contact resistance: 40m ohms max. from initial value 12000 cycles at 400 to 600 cycles per hour(mating/unmating) 8. Resistance to No deformation of any component. Reflow: At the recommended temperature profile soldering heat No affect on contacts Manual soldering: 300 ç for 3 seconds I Materials CB 1 E - 10 S - 1.5 H - PEJC - ** 1 4 62 3 5 7 98 Series name : CB Ejector type : C E With eject mechanismF G D Without eject mechanismA 1 Contact pitch : 1.5 mm Surface mount Eject mechanism codes: PEJC : Card Push insert/Push eject EJL : Left button eject EJR : Right button eject Suffix Series No. : 1 Number of contacts : 10

5 Connector type S : Receptacle

Item Specification Conditions Temperature: -55ç/+5ç to +35ç/+85ç/+5ç to +35ç Duration: 30/5/30/5(Minutes) 5 cycles Contact resistance: 40 m ohms max. from initial value Insulation resistance: 100 M ohms min. CB1E,CB1F,CB1G Series is without the termination area. The CB1E Series has termination area with tin-lead plated. 96 hours at temperature of 40ç±2ç and humidity of 90% to 95% I Product Specifications Note :Includes temperature rise caused by current flow. Rating Current rating 0.5A Voltage rating 125V AC Operating humidity range Relative humidity 96% max. (No condensation) Operating temperature range -20 ç to +85ç(Note) Storage temperature range -40ç to +85ç Insulator Color: Black UL94V-0 Metal hold down Phosphor bronze or stainless steel Part Material Finish Remarks I Ordering information Heat resistant glass reinforced therm oplastic compound Stainless steel Heat resistant glass reinforced therm oplastic compound Contact area: Gold plated Termination area: Tin-Iead plated or tinned copper plated Contact area: Nickel platingTermination area: Tin-Iead plated or tinned copper plated

I Low Profile, Push Insert-Push Eject 33 (31) 29.4 13.5 9.3 26.8 (5.525) 3.2 26.2 (21) (19.8) P=1.5 0.6 3.85 3.5 (3.25) CONTACT No.1 Memory stick card outline Card ejected Card fully inserted Card pushed for ejection 1.9±0.1 4±0.11.9±0.1 26.6±0.1 9.3±0.05P=1.5±0.03 0.9±0.05 1.9±0.126.8±0.1 BPCB mounting pattern Part No. CL No. CB1G-10S-1.5H-PEJC2 CL689-0037-5 I Button Touch Eject 27.75 34.9 18.3 16.5 32.5 11.15 10.9 22.75 (5.525)11.975 39.8 (13) (23) 4.5 (0.8) 13.5 4.2 P=1.5 0.6 0.4 1.5Ø1.2 Ø0.55 3.85 3.5 (3.25) (2) Eject stroke CONTACT No.1 Memory stick card outline Card ejected 4-Ø2.4 Card fully inserted 32.5±00.3 18.3±00.3 1.5±0.03 10.9±00.3 3.4±0.1 5.3±0.1 4.2±0.0513.5±0.05 P=1.5±0.05 3±0.05 0.9±0.05 0.6±0.05 4-Ø3.2 +0.1 - 0.05 2-Ø1.3 +0.05 BPCB mounting pattern Part No. CL No. CB1F-10S-1.5H-TEJL-PA CL689-0028-4 I Without Card Ejection Ø1.2 CONTACT No.1 0.3 3.55 24.5 13.5 24.7 6.95 P=1.5 4.15 18.7 0.6 5.80.6 4.15 1.45 Ø1.3 19.51.4 3.5 5.5 Ø1.8 +0.1 0 1.05±0.05 6.1±0.05 P=1.5±0.05 13.5±0.05 5.8±0.05 1±0.1 2±0.1 2±0.11±0.1 6.1±0.05 Ø1.3 +0.05 Ø1.3 +0.05 0 18.7±0.03 4.15±0.05 2.65±0.03 BPCB mounting pattern Part No. CL No. CB1D-10S-1.5H CL689-0021-5

(3.25) Memory stick card outline (3.5) 2410.1 3.2 (19.5) (13.3) (12) 30.4 26.8 (5.525) CONTACT No.1 P=1.5 13.5 9.3 0.6

40.8 Card ejected

9.3±0.05P=1.5±0.03 0.9±0.05 10.5±0.1 24±0.03 4±0.14±0.1 BPCB mounting pattern Part No. CL No. CB1EB-10S-1.5H-PEJC2 CL689-0026-9 G With "U" cut-out 2410.1 3.2 30.4 CONTACT No.1 P=1.5 13.5 9.3 0.6 (5.525) 26.8 40.8 Memory stick card outline 13.4 8.85 15.1 3.5 3.85 (3.25) (19.5) (13.3) (12) Card ejected Card fully inserted Card pushed for ejection 4±0.1 4±0.1 9.3±0.05 8.6±0.1 10.5±0.1 P=1.5±0.03 0.9±0.05 24±0.03 BPCB mounting pattern Part No. CL No. CB1EBG-10S-1.5H-PEJC2 CL689-0034-7 G With square window (19.5) (13.3) (12) 3.5 3.85 (3.25) 2410.1 3.2 CONTACT No.1 P=1.5 13.5 9.3 0.6 (5.525) 26.8 40.8 8.38.1 3.623.8 Memory stick card outline 29.4 Card ejected Card fully inserted Card pushed for ejection 4±0.1 4±0.1 9.3±0.05 8.6±0.1 10.5±0.1 P=1.5±0.03 0.9±0.05 24±0.03 BPCB mounting pattern Part No. CL No. CB1EBH-10S-1.5H-PEJC2 CL689-0035-0

10.5 23.1 (6) Card ejected (3.3) Eject stroke 21.8 4.45 29.9 5.5 5.55 47.95 51.45 53.45 26.45 8.75 16.45 4.05 P=1.5 0.6 13.5 4.55 2 2-Ø1 Ø1.8 3.5 5.2 CONTACT No.1 Memory stick card outline 3.65 0.1 6.55 3.45 10.5±0.03 P= 1.5±0.05 13.5±0.05 4.95±0.05 2.4±0.1 4.65±0.05 3±0.1 0.4±0.05 0.9±0.1 3.2±0.1 2-Ø1.3 +0.05 4.55±0.05 48MAX Front edge of the printed circuit board BPCB mounting pattern Part No. CL No. CB1C-10S-1.5H-EJL(56) CL689-0006-1-56 I Right Ejection (6) Card ejected(3.3)Eject stroke 4.4 21.8 5.5 23.4 47.15 17.359.25 4.05 P=1.5 0.6 13.5 4.55 2-Ø1.2 Ø2.3 3.243.95 8.6 31.2 53.45 10.5 CONTACT No.1 Memory stick card outline 3.65 5.55 3.45 10.5±0.03 P=1.5±0.05 13.5±0.05 4.95±0.05 2.4±0.1 4.65±0.05 3±0.1 0.4±0.05 0.9±0.1 3.2±0.1 2-Ø1.3 +0.05 0 4.55±0.05 41MAX Front edge of the printed circuit board BPCB mounting pattern Part No. CL No. CB1C-10S-1.5H-EJR(59) CL689-0007-4-59

40.5 4.4 9.5 1.35 21.45 2.8 I With flange, for screw attachment 4.725±0.05 3.8±0.1 2.75±0.1 2-Ø2.1 +0.1 Ø2.2 +0.2 0 (hole) 30.05±0.05 P=1.5±0.05 13.5±0.05 16.5±0.05 6.6±0.1 4.9±0.1 11.6±0.13.3±0.1 0.9±0.05 4.1±0.1 Ø2.2 +0.2 0 (hole) 7.4±0.1 19.25 1.5 30.05 18.6 1.7 1.2 0.5 2.9 1.9 2-Ø1.8 26.3 20.3 4.4 5.25 5.3 0.6 P=1.5 13.5 16.5 33.45 1.5 4.725 4.4±0.05 CONTACT No.1 3.8±0.1 6.3±0.1 (hole) BPCB mounting pattern Part No. CL No. CB1A-10S-1.5H(57) CL689-0001-8-57 I Without flange 3.8±0.1 2.75±0.1 2-Ø2.1 +0.1 0 (hole) P=1.5±0.05 13.5±0.05 16.5±0.05 6.6±0.1 4.9±0.1 11.6±0.13.3±0.1 0.9±0.05 4.1±0.1 7.4±0.1 19.25 1.5 1.2 26.3 5.25 5.3 0.6 P=1.5 13.5 16.5 18.6 0.5 20.3 26.7 CONTACT No.1 3.8±0.1 6.3±0.1 BPCB mounting pattern BMemory Stick card insertion directionBMemory Stick fully inserted dimensions Part No. CL No. CB1AA-10S-1.5H(57) CL689-0002-0-57

19±0.2 CB1A(1) P=39.5±0.2 330 0 320±0.5 P=29.5±0.2 177±0.3 225 0 215±0.5 C C B CB1C(R1) 330 0 320±0.5 55±0.2 27.5±0.2P=40±0.2 20PICS 225 0 215±0.5 B 160±0.3 P=74±0.2 222±0.3 B B 330 0 320±0.5 225 0 215±0.5 177±0.3 P=29.5±0.2 19±0.2 255.5±0.3 P=36.5±0.2 32.25±0.2 CB1E(PEJC1) 2 5 P I C S P S A 225 215±0.5 330 0 320±0.5 55±0.2 P=55±0.2 220±0.3 27.5±0.2P=40±0.2 160±0.3 A 20PICS PS CB1F(TEJL1) 225 215±0.5 330 0 320±0.5 P=65±0.2100±0.2 195±0.3 30.1±0.2P=40±0.2 160±0.3 A A PS CB1G SERIES 40PICS 225 215±0.5 330 0 320±0.5 P=36±0.2 160±0.3 A A I Packaging specification (Tray packaging) G Part Number: CB1G-10S-1.5H-PEJC2(1 tray: 40 pieces) G Part Number: CB1F-10S-1.5H-TEJL-PA(1 tray: 20 pieces) G Part Number: CB1D-10S-1.5H(1 tray: 50 pieces) G Part Number: CB1EB*-10S-1.5H-PEJC2(1 tray: 25 pieces) G Part Number: CB1C-10S-1.5H-EJL(56)(1 tray: 20 pieces) G Part Number: CB1C-10S-1.5H-EJR(59)(1 tray: 20 pieces) G Part Number: CB1A*-10S-1.5H(57)(1 tray: 50 pieces) A A CB1C(L1) 330 0 320±0.5 33.4±0.2 P=63.3±0.2 253.2±0.3 29.5±0.2P=52±0.2 156±0.3 2 0 P I C S 225 0 215±0.5

1.Care should be taken to correctly insert/withdraw the Memory Stick® card. Following correct insertion/withdrawal procedures will prevent device or connector damage. When handling the CB1C series connectors, hold it in the areas indicated by the arrows, as illustrated below. 2.Follow the recommended insertion angles, as illustrated below. <Memory Stick Allowable Insertion Angles> Recommended holding area Recommended holding area Contacts Metal hold-down Contacts, metal hold-down and ejection components areas ±2°MAX Initial insertion (15 mm max.) Complete insertion (from 15 mm to full insertion) 0°±0.22° ±1°MAX ±1°MAX ±0.5°MAX ±0.2°M AX Outline of the Memory Stick card Outline of the Memory Stick card CB1A Series CB1A Series CB1C Series CB1C Series

3.When inserting or withdrawing cards from the CB1C Series, the side contacts on both sides will protrude outward by 0.6 mm. Care should be taken that they will not be restricted or touch other components. 4. Application of an excessive external force to the push rod may prevent the ejection or insertion of the card. Do not apply any load in a direction other than the push direction. (0.6) side contact Push direction Do not twist or bend ! Do not pull ! Push rod

100ç 150ç 200ç 300ç 50S0S 100S 150S 200S 240ç max. 220ç Preheating Soldering Preheating : 150ç 30 to 90 sec. IR Reflow Conditions Soldering : 235±5ç 10 sec. max. 220ç min. 10 to 20 sec. <Recommended Conditions> Reflow system : IR reflow Solder : Paste type 63 Sn/37 Pb (Flux content 9 wt%) Test board : Glass epoxy 60mm x 100mm x 1.6 mm Metal mask thickness : 0.15 mm Recommended temperature. The temperature may be slightly changed according to the solder paste type and volume used. I Recommended Temperature Profile