CB1608PA121

CB1608PA100 SAMWHA | Alldatasheet

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SAMWHA ELECTRONICS CO., LTD vApplications vFeatures vDimensions Power Line Series http://www.samwha.com/chip This description in the this catalogue is subject to change without notice

• PDP/LCD Monitor, Digital TV/VCR etc. L W T B (unit : mm)
• High impedance characteristics
• Low Rdc, High Current characteristics
• Good reliability (Monolithic structure)
• Magnetically shielded
• Fast mounting speed
• RoHS compliant vGeneral Code Series Code CB : Chip Ferrite Beads Dimension Code The first two digits : length(mm) The last two digits : width(mm) Application Code G : Signal Line P : High Current Line U : Ultra High Current Line Material Code A: General Frequency K,J: Medium Frequency M: High Frequency V: Very High Frequency Impedance Value Code The first two digits represents significant The last digit is the number of zeros following ex) 601 = 600 (Ω) Packaging Code T : Reel paper packaging E : Reel embossed tape packaging CB

2012 P 601 T

J vTemperature Range

• Operating Temp. -55 ~ +125℃
• Storage Temp. -10 ~ +40 ℃ vTypical Material Characteristics A J,K M V High μ Low μ (Low RXCP) (High RXCP) DPS-081104 CHIP BEADS 0.85±0.2 1.5±0.25 T BWLSize

SAMWHA ELECTRONICS CO., LTD v1608 SIZE http://www.samwha.com/chip This description in the this catalogue is subject to change without notice ※Measuring Equipment -. Z : HP4291B / E4991A -. Rdc : HP4338B 10000.12120CB1608PJ121 20000.0530CB1608PJ300 10000.1060CB1608PJ600 20000.0510CB1608PK100 20000.0530CB1608PK300 10000.0860CB1608PK600 8000.10120CB1608PK121 8000.12180CB1608PK181 8000.12180CB1608PA181 8000.10120CB1608PA121 20000.0510CB1608PA100 Test Frequency (MHz) Rated Current (mA) max. DC Resistance (Ω) max. Impedance (Ω) ±25%Samwha P/N 8000.12120CB1608PM121 10000.0860CB1608PM600 15000.0630CB1608PM300 10000.0860CB1608PA600 100 20000.0530CB1608PA300 DPS-081104 CHIP BEADS, For Power Line CHIP BEAD, Power Line Series

SAMWHA ELECTRONICS CO., LTD v1608 SIZE http://www.samwha.com/chip This description in the this catalogue is subject to change without notice DPS-081104 CHIP BEADS, For Power Line CHIP BEAD, Power Line Series 1 10 100 1000 120 160 X R Z CB 1608 PK 600 Impedance [W] Frequency [MHz] 1 10 100 1000 X R Z CB 1608 PA 100 Impedance [W] Frequency [MHz] 1 10 100 1000 X R Z CB 1608 PA 300 Impedance [W] Frequency [MHz] 1 10 100 1000 100 X R Z CB 1608 PA 600 Impedance [W] Frequency [MHz] 1 10 100 1000 120 160 X R Z CB 1608 PA 121 Impedance [W] Frequency [MHz] 1 10 100 1000 120 180 240 X R Z CB 1608 PK 121 Impedance [W] Frequency [MHz] 1 10 100 1000 100 X R Z CB 1608 PJ 300 Impedance [W] Frequency [MHz] 1 10 100 1000 120 X R Z CB 1608 PJ 600 Impedance [W] Frequency [MHz] 1 10 100 1000 120 X R Z CB 1608 PM 300 Impedance [W] Frequency [MHz] 1 10 100 1000 100 150 200 X R Z CB 1608 PM 600 Impedance [W] Frequency [MHz] 1 10 100 1000 100 200 300 400 X R Z CB 1608 PM 121 Impedance [W] Frequency [MHz]

SAMWHA ELECTRONICS CO., LTD v2012 SIZE http://www.samwha.com/chip This description in the this catalogue is subject to change without notice ※Measuring Equipment -. Z : HP4291B / E4991A -. Rdc : HP4338B 15000.150800CB2012PJ801 100 15000.100600CB2012PJ601 25000.050120CB2012PM121 705000.3002000CB2012PK202 25000.050120CB2012PK121 20000.070300CB2012PM301 15000.130600CB2012PM601 Test Frequency (MHz) Rated Current (mA) max. DC Resistance (Ω) max. Impedance (Ω) ±25%Samwha P/N 20000.08015CB2012PK150 30000.01530CB2012PK300 30000.02560CB2012PK600 20000.050180CB2012PK181 30000.02060CB2012PM600 10000.2501000CB2012PK102 15000.130600CB2012PK601 20000.070300CB2012PK301 20000.050220CB2012PK221 20000.050220CB2012PM221 15000.130600CB2012PA601 20000.100300CB2012PA301 20000.050220CB2012PA221 25000.050120CB2012PA121 30000.02560CB2012PA600 30000.01530CB2012PA300 100 30000.00711CB2012PA110 DPS-081104 CHIP BEADS, For Power Line CHIP BEAD, Power Line Series

SAMWHA ELECTRONICS CO., LTD v2012 SIZE http://www.samwha.com/chip This description in the this catalogue is subject to change without notice DPS-081104 CHIP BEADS, For Power Line CHIP BEAD, Power Line Series 1 10 100 1000 X R Z CB 2012 PA 110 Impedance [W] Frequency [MHz] 1 10 100 1000 120 X R Z CB 2012 PA 600 Impedance [W] Frequency [MHz] 1 10 100 1000 120 160 X R Z CB 2012 PA 121 Impedance [W] Frequency [MHz] 1 10 100 1000 100 200 300 400 X R Z CB 2012 PA 221 Impedance [W] Frequency [MHz] 1 10 100 1000 200 400 600 800 X R Z CB 2012 PA 601 Impedance [W] Frequency [MHz] 1 10 100 1000 120 160 X R Z CB 2012 PK 121 Impedance [W] Frequency [MHz] 1 10 100 1000 100 200 300 400 X R Z CB 2012 PK 301 Impedance [W] Frequency [MHz] 1 10 100 1000 200 400 600 800 X R Z CB 2012 PK 601 Impedance [W] Frequency [MHz] 1 10 100 1000 300 600 900 1200 X R Z CB 2012 PK 102 Impedance [W] Frequency [MHz] 1 10 100 1000 500 1000 1500 2000 2500 X R Z CB 2012 PK 202 Impedance [W] Frequency [MHz] 1 10 100 1000 250 500 750 1000 X R Z CB 2012 PJ 601 Impedance [W] Frequency [MHz] 1 10 100 1000 250 500 750 1000 X R Z CB 2012 PJ 801 Impedance [W] Frequency [MHz]

SAMWHA ELECTRONICS CO., LTD v2012 SIZE http://www.samwha.com/chip This description in the this catalogue is subject to change without notice DPS-081104 CHIP BEADS, For Power Line CHIP BEAD, Power Line Series 1 10 100 1000 120 X R Z CB 2012 PM 600 Impedance [W] Frequency [MHz] 1 10 100 1000 100 200 300 400 X R Z CB 2012 PM 121 Impedance [W] Frequency [MHz] 1 10 100 1000 300 600 900 1200 X R Z CB 2012 PM 601 Impedance [W] Frequency [MHz]

SAMWHA ELECTRONICS CO., LTD v3216 SIZE http://www.samwha.com/chip This description in the this catalogue is subject to change without notice ※Measuring Equipment -. Z : HP4291B / E4991A -. Rdc : HP4338B 30000.06600CB3216PJ601 30000.0390CB3216PA900 30000.0370CB3216PA700 30000.03120CB3216PM121 30000.06600CB3216PK601 30000.06500CB3216PK501 30000.06600CB3216PA601 30000.06600CB3216PM601 30000.06500CB3216PA501 30000.06300CB3216PA301 30000.03150CB3216PA151 30000.03120CB3216PA121 30000.03100CB3216PA101 30000.0360CB3216PA600 30000.0350CB3216PA500 30000.0335CB3216PA350 100 30000.0331CB3216PA310 Test Frequency (MHz) Rated Current (mA) max. DC Resistance (Ω) max. Impedance (Ω) ±25%Samwha P/N DPS-081104 CHIP BEADS, For Power Line CHIP BEAD, Power Line Series

SAMWHA ELECTRONICS CO., LTD v3216 SIZE http://www.samwha.com/chip This description in the this catalogue is subject to change without notice DPS-081104 CHIP BEADS, For Power Line CHIP BEAD, Power Line Series 1 10 100 1000 X R Z CB 3216 PA 310 Impedance [W] Frequency [MHz] 1 10 100 1000 X R Z CB 3216 PA 350 Impedance [W] Frequency [MHz] 1 10 100 1000 X R Z CB 3216 PA 500 Impedance [W] Frequency [MHz] 1 10 100 1000 120 X R Z CB 3216 PA 101 Impedance [W] Frequency [MHz] 1 10 100 1000 120 160 X R Z CB 3216 PA 121 Impedance [W] Frequency [MHz] 1 10 100 1000 150 300 450 600 X R Z CB 3216 PA 501 Impedance [W] Frequency [MHz] 1 10 100 1000 150 300 450 600 X R Z CB 3216 PK 501 Impedance [W] Frequency [MHz] 1 10 100 1000 160 240 320 X R Z CB 3216 PM 121 Impedance [W] Frequency [MHz] 1 10 100 1000 300 600 900 1200 X R Z CB 3216 PM 601 Impedance [W] Frequency [MHz]

SAMWHA ELECTRONICS CO., LTD Reliability & Test Condition http://www.samwha.com/chip This description in the this catalogue is subject to change without notice CHIP BEAD, Reliability & Test Condition Temperature : 125 ± 3 ℃ Applied current : rated current Time : 1000 ± 12 hours Measurement at room ambient temperature after placing for 24 hours High temperature load resistance Temperature : 40 ± 2 ℃ Humidity : 90 ± 2 % RH Time : 500 ± 12 hours Measurement at room ambient temperature after placing for 24 hours Humidity resistance Preheat temperature : 150 ℃ Preheat time : 60 sec. Solder temperature : 245 ± 5 ℃ Soldering time : 10 sec. max. (Reflow soldering profile) More than 50% of the terminal electrode shall be covered with new solder Reflow soldering at packing condition40 ℃max., 70% RH max.Storage temperature range Preheat temperature : 100 ~ 150 ℃ Preheat time : 60 sec. Solder temperature : 245 ± 5 ℃ Soldering time : 10 ± 1 sec. More than 90% of the terminal electrode shall be covered with new solderSolderability Preheat temperature : 100 ~ 150 ℃ Preheat time : 60 sec. Solder temperature : 270 ± 10 ℃ Soldering time : 10 ± 0.5 sec. 1. No damage such as cracks should be caused in chip element 2. More than 75% of the terminal electrode shall be covered with new solder 3. Impedance shall not change more than ±30 % Resistance to soldering heat Temperature : 125 ± 3 ℃ Time : 500 ± 12 hours Measurement at room ambient temperature after placing for 24 hours 1. No mechanical damage 2. Impedance shall not change more than ±30 % High temperature resistance --55 ℃~ + 125 ℃Operating temperaturerange Test ConditionsRequirementsItem ST ≥ CT1 CTST DPS-081104 CHIP BEADS

SAMWHA ELECTRONICS CO., LTD http://www.samwha.com/chip This description in the this catalogue is subject to change without notice 5.0 3.8 3.6 1.5 4532 5.0 3.0 3.6 1.5 4516 5.0 3.0 1.5 1.3 3216 4.0 1.3 1.0 1.0 2012 2.0 1.3 0.8 1.0 1608ITEM 1005 0.7 0.5B (mm) 0.7 0.7 W (kgf) C (mm) A (mm) No mechanical damage Flexure strength 1. No mechanical damage 2. Impedance shall not change more than ±30 % Temperature : 40 ± 2 ℃ Humidity : 90 ± 2 % RH Applied current : rated current Time : 500 ± 12 hours Measurement at room ambient temperature after placing for 24 hours Humidity load resistance Temperature : -55 ± 3 ℃ Time : 1000 ± 12 hours Measurement at room ambient temperature after placing for 24 hours Low temperature resistance 1. -55 ± 3℃for 30 minutes 2.125 ± 3 ℃for 30 minutes 3. repeat 100 cycle Thermal shock The terminal electrode shall be neither break off nor the chip damage Drop 10 times on a concrete floor from a height of 100 cmDrop Bending strength Frequency : 10 ~ 55 Hz Amplitude : 1.5 mm Direction : X, Y, Z Sweep time : 2 hours for each axis Vibration Test ConditionsRequirementsItem Reliability & Test Condition CHIP BEAD, Reliability & Test Condition DPS-081104 CHIP BEADS W A B C R0.5 A R340 W 2 mm Resistance meter

SAMWHA ELECTRONICS CO., LTD http://www.samwha.com/chip This description in the this catalogue is subject to change without notice DPS-081104 CHIP BEADS Packaging CHIP BEAD,Packaging vStandard Quantity

0.85 T size

2,0004516 10,0001005 3,0003216 4,0001608 4,0002012 Remarks 1,0004532 Q’TY(PCS)Size vReel Dimension Φ13±0.5Φ50 min.Φ178±2 WED 2±0.2 B 9±1.54±0.8 CA (Unit:mm) vLeader & Blank Portion (Unit:mm) Blank 150 min BlankChips Leader

60 Pitch 60 Pitch

350±50 mm 350±50 mm

SAMWHA ELECTRONICS CO., LTD http://www.samwha.com/chip This description in the this catalogue is subject to change without notice DPS-081104 CHIP BEADS Packaging vTaping Dimensions (Paper tape) (Unit:mm) 4.0 4.0 2.0 P ±0.1 0.81.00.651.151005 1.12.01.001.801608 1.12.01.552.302012 T (Max.) S ±0.1 B ±0.1 A ±0.1Type B S P T A vTaping Dimensions (Emboss tape) (Unit:mm 0.231.251.853.503216 0.301.351.904.904516 0.301.403.604.854532 1.50 C ±0.1 0.231.452.252012 D ±0.1 B ±0.1 A ±0.1Type CHIP BEAD,Packaging

SAMWHA ELECTRONICS CO., LTD http://www.samwha.com/chip This description in the this catalogue is subject to change without notice DPS-081104 CHIP BEADS Soldering Profile CHIP BEAD, Soldering Profile 2 sec. max. 150 vReflow Soldering vFlow Soldering vManual Soldering CoolingSolderingPre -heating 150 60~120 sec. 10 sec. max. 60 sec. min. 245±5℃ 180 230 30~60 sec. CoolingSolderingPre -heating 250 250±5℃ 180 300 Tc Soldering Iron : 30W max. Diameter of soldering iron : 1.2 mm max.