CAT6201_V01 ONSEMI | Alldatasheet
Document overview
- Manufacturer or author: ON Semiconductor
- PDF pages: 11
Technical content
Features
- Guaranteed 300 mA Continuous Output Current
- Low Dropout V oltage of 250 mV Typical at 300 mA
- Input V oltage Range: 3.3 V to 13.5 V
- User Adjustable Output V oltage
- User Programmable Current Limit
- Fault Output to Indicate Under−voltage, Current Limiting or Thermal Shutdown has Occurred
- Fault Blanking: 3 ms
- VOUT Withstands Battery Fault V oltages of up to 14 V
- Soft−Start Prevents Current Surges
- Stable with Ceramic Output Capacitor
- ±1.5% Output V oltage Initial Accuracy
- ±2.5% Accuracy Over Temperature
- Thermal Protection
- 8 Pad TDFN Package
- CA V Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable
- These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant http://onsemi.com PIN CONNECTIONS HKB LAA YM /C0071 MARKING DIAGRAMS TDFN−8 (Top View) VOUT GND VIN FLT BYP See detailed ordering and shipping information in the package dimensions section on page 10 of this data sheet.
ORDERING INFORMATION
TDFN−8 VP2 SUFFIX CASE 511AK ILIM VADJ EN HKB = CAT6201VP2 −GT3 or = CAV6201BVP2−GT3 L = Assembly Location AA = Last Two Digits of = Assembly Lot Number Y = Production Year (Last Digit) M = Production Month (1 −9, O, N, D) /C0071 = Pb−Free Microdot
Figure 1. CAT6201/CAV6201B Typical Application Figure 2. CAT6201/CAV6201B Functional Block Diagram
1.25 V Ref
Table 1. PIN FUNCTION DESCRIPTION
1 VIN Supply voltage input
2 FLT Fault indicator (active low)
3 EN Enable input (active high)
4 BYP A capacitor between BYP and GND controls the regulator’s turn−on speed and improves PSRR
5 GND Ground reference
6 ILIM Current limit control pin
7 VADJ Output voltage adjustment
8 VOUT LDO Output Voltage
is not required and the pad may be left floating. Table 2. ABSOLUTE MAXIMUM RATINGS
- The maximum allowable power dissipation at any T
power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown. Table 3. RECOMMENDED OPERATING CONDITIONS (Note 2)
- The device is not guaranteed to work outside its operating rating.
CAT6201, CAV6201B http://onsemi.com Pin Function VIN is the supply pin for both the LDO’s operation and the load the LDO is driving. It is recommended that a 1 /C0109F ceramic bypass capacitor be placed between the VIN pin and ground in close proximity to the device. When using longer connections to the power supply, CIN value can be increased without limit. The operating input voltage range is from 3.3 V to 13.5 V . FLT is an active low open−drain output indicating one of 3 fault conditions: 1. Input under−voltage: input is below the intended output voltage 2. Over−current. Brief over−current events are masked by a 3 ms time delay. CAT6201/CA V6201B will limit current anytime the load tries to draw more than the maximum allowed, however reporting of this event will occur only if the event lasts longer than the delay timer. Events terminating before the timer reaches its full count are ignored and the timer is reset. 3. Over−temperature shutdown has occurred. EN is an active HIGH logic level input for switching the regulator’s output between ON and OFF. A weak internal pull down assures that if EN pin is left open, the circuit is disabled. BYP controls the soft−start feature for the regulator. When large capacitive loads are present at the regulator’s output, enabling the regulator will produce large current surges on the V IN supply line. To reduce these surges the regulator can be turned on gently by connecting a capacitor between the BYP pin and ground. The larger the capacitance value the more slowly V OUT approaches its programmed value. The table below gives a list of common capacitor values and their resulting turn −on times. If the soft −start feature is not desired, this pin should be left floating. Capacitance [nF] tON [ms] 0 0.2 10 1 100 10 GND is the ground reference for the LDO in the TDFN package, center metal pad is internally connected to GND. If electrical contact is made with this pad, it should be to GND and/or the ground plane of the PCB. Connection to the ground plane enhances thermal conductivity drawing heat out of the package and into the surrounding PCB. ILIM stands for Current Limit and is the control input for setting the point at which the current limit is invoked. I LIM is defined as the current at which VOUT is still within 80% of its nominal value and should not be confused with ISC, the short circuit current, measured at V OUT = 0 V , which is typically 100 mA greater than ILIM. A resistor REXT placed between ILIM and GND selects the trip current according to a formula: ILIM /C0043ILIM0 /C0041Current_Limit_Factor(CLF) REXT (eq. 1) ILIM0 is the built −in minimum current limit (typically 150 mA), and CLF is a numerical value (typical 30,000 V olts) which relates the allowable load current to a resistance value. The value of this resistor is determined by the following equation: REXT(/C0087) /C0043CLF(V) ILIM(A) /C0042ILIM0(A) (eq. 2) It is recommended that ILIM be set to at least 50% higher than the maximum intended continuous IOUT. Example: Set ILIMIT = 600 mA REXT(/C0087) /C004330, 000 V 0.6 A /C00420.15 A /C004368 K/C0087 (eq. 3) V ADJ is the output voltage control pin. A resistor divider placed between VOUT and GND whose center point connects to V ADJ sets the LDO regulator’s output voltage. Typical V ADJ value is 1.25 V . The current through the resistor divider can be anywhere between 10 /C0109A and 1 mA. The higher this current is, the lower the noise. For best performance R1 and R2 should have similar temperature coefficients, otherwise output voltage accuracy will be compromised. VOUT /C0043VADJ/C04661 /C0041R1 /C0467 (eq. 4) VOUT is the LDO regulator output. A small 2.2 /C0109F ceramic bypass capacitor is required between VOUT and ground. For better transient response, its value can be increased to 4.7 /C0109F. This capacitor should be located near the device. VOUT is protected against short circuits and over−temp operation by internal circuitry. In the event of an over−current, the LDO behaves like a current source, limiting current at the output. The maximum current allowed is set by R EXT, the resistor between ILIM and GND. If the load attempts to draw more than the allowed current, VOUT and IOUT decrease together and thus limit the total power delivered. VOUT is protected against the application of voltages greater than VIN. For example, in automotive applications, if CAT6201/CA V6201B is powering a remote load and damage occurs to a wiring harness shorting a powered line, Battery + for instance, to VOUT, CAT6201/CAV6201B will not be damaged by this higher voltage being applied to VOUT.
Table 4. ELECTRICAL CHARACTERISTICS
- Dropout voltage is defined as the input−to−output differential at which the output voltage drops 2% below its nominal value. During test, the
input voltage stays always above the minimum 3.3 V. The given values are for VOUT = 7.5 V.
Figure 9. Output Short−circuit Current vs. Figure 10. Ground Current vs. Input Voltage Figure 11. Enable Threshold vs. Input Voltage Figure 12. Fault Bar Voltage vs. Input Voltage Figure 13. Output Voltage vs. Load Current Figure 14. Output Current (Sink) vs. Output
2.50 GROUND CURRENT (/C0109A)
68 K/C0087
CAT6201, CAV6201B Device Marking Package Type Lead Finish Shipping (Note 5) CAT6201VP2−GT3 HKB TDFN−8 NiPdAu 3,000 / Tape & Reel CAV6201BVP2−GT3 HKB TDFN−8 NiPdAu 3,000 / Tape & Reel 4. For additional package and temperature options, please contact your nearest ON Semiconductor Sales office. 5. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 6. For detailed information and a breakdown of device nomenclature and numbering systems, please see the ON Semiconductor Device Nomenclature document, TND310/D, available at www.onsemi.com. http://onsemi.com
TDFN8, 2x3, 0.5P CASE 511AK ISSUE B DATE 18 MAR 2015SCALE 2:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.25MM FROM THE TERMINAL TIP . 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. ÇÇ ÇÇ ÇÇ AD E B C0.10 PIN ONE REFERENCE TOP VIEW SIDE VIEW BOTTOM VIEW LD2 C C0.10 C0.08 A1 SEATING PLANE NOTE 3 b8X 0.10 C 0.05 C A B DIM MIN MAX MILLIMETERS A 0.70 0.80 A1 0.00 0.05 b 0.20 0.30 D 2.00 BSC D2 1.30 1.50 E 3.00 BSC E2 1.20 1.40 e 0.50 BSC L 0.20 0.40 1 4 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* 0.50 PITCH 1.45 3.40 DIMENSIONS: MILLIMETERS NOTE 4 0.30 DETAIL A A3 0.20 REF ADETAIL B DETAIL A L ALTERNATE CONSTRUCTIONS L ÇÇ ÇÇÉÉ DETAIL B MOLD CMPDEXPOSED Cu ALTERNATE CONSTRUCTION L1 −−− 0.15 e RECOMMENDED 1.56 GENERIC MARKING DIAGRAM* XXXXX = Specific Device Code A = Assembly Location WL = Wafer Lot Y = Year W = Work Week /C0071 = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ /C0071”, may or may not be present. XXXXX AWLYW/C0071 M M 0.68 C0.10 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. 98AON34336EDOCUMENT NUMBER: DESCRIPTION: Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1TDFN8, 2X3, 0.5P © Semiconductor Components Industries, LLC, 2019 www.onsemi.com
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