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Document overview
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Technical content
Features
- Automotive Temperature Grade 1 (−40°C to +125°C)
- 10 MHz SPI Compatible
- 2.5 V to 5.5 V Supply V oltage Range
- SPI Modes (0,0) & (1,1)
- 128−byte Page Write Buffer
- Additional Identification Page with Permanent Write Protection
- Self−timed Write Cycle
- Hardware and Software Protection
- Block Write Protection − Protect 1/4, 1/2 or Entire EEPROM Array
- Low Power CMOS Technology
- 1,000,000 Program/Erase Cycles
- 100 Year Data Retention
- SOIC, TSSOP and WLCSP 8−lead Packages
- This Device is Pb−Free, Halogen Free/BFR Free, and RoHS Compliant SI SOCAV25512 SCK VSS VCC CS WP HOLD
Figure 1. Functional Symbol This document contains information on some products that are still under development. dimensions section on page 14 of this data sheet.
ORDERING INFORMATION
SOIC−8 V SUFFIX CASE 751BD SCK SOIC (V), TSSOP (Y) TSSOP−8 Y SUFFIX CASE 948AL Chip SelectCS Serial Data OutputSO Write ProtectWP GroundVSS Serial Data InputSI Serial ClockSCK FunctionPin Name PIN FUNCTION Hold Transmission InputHOLD Power SupplyVCC PIN CONFIGURATION WLCSP (C8A) (Top View) VCC HOLD VSS WP CS SO SCK SI Reference Pin A1 WLCSP−8 C8A SUFFIX CASE 567MB
Table 1. ABSOLUTE MAXIMUM RATINGS should not be assumed, damage may occur and reliability may be affected.
- The DC input voltage on any pin should not be lower than −0.5 V or higher than VCC + 0.5 V. During transitions, the voltage on any pin may
undershoot to no less than −1.5 V or overshoot to no more than VCC + 1.5 V, for periods of less than 20 ns. Table 2. RELIABILITY CHARACTERISTICS (Note 2)
- These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC−Q100
- The device uses ECC (Error Correction Code) logic with 6 ECC bits to correct one bit error in 4 data bytes. Therefore, when a single byte
from the maximum number of write cycles. performance may not be indicated by the Electrical Characteristics if operated under different conditions.
Table 4. PIN CAPACITANCE (TA = 25°C, f = 1.0 MHz, VCC = +5.0 V) (Note 2)
- This parameter is tested initially and after a design or process change that affects the parameter.
WC is the time from the rising edge of CS after a valid write sequence to the end of the internal write cycle. Table 6. POWER−UP TIMING (Notes 6, 8)
- t PUR and tPUW are the delays required from the time VCC is stable until the specified operation can be initiated.
on the rising edge of the SCK clock input. on the falling edge of the SCK clock. “1”, writing to the Status Register is disabled. VCC, either directly or through a resistor. set and associated op−codes are listed in Table 7. simply providing the READ command and an address. Register, as will be explained later. Page permanent write protected. Table 7. INSTRUCTION SET Figure 2. Synchronous Data Timing
number of status and control bits. to accept commands. For the host, this bit is read only. blocks then become read−only. operations, as detailed in Table 10. automatically reset after read/write operations. and therefore they will remain unchanged. Table 8. STATUS REGISTER Table 9. BLOCK PROTECTION BITS Table 10. WRITE PROTECT CONDITIONS
0 X 0 Protected Protected Protected
0 X 1 Protected Writable Writable
1 Low 0 Protected Protected Protected
1 Low 1 Protected Writable Protected
communication, HOLD must be taken high while SCK is low. following a temporary loss of power. must be issued prior to any writes to the device. remain in the high impedance state. Figure 11. HOLD Timing
www.onsemi.com PACKAGE DIMENSIONS SOIC 8, 150 mils CASE 751BD ISSUE O E1 E A h θ L c e b D PIN # 1 IDENTIFICATION TOP VIEW SIDE VIEW END VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MS-012. SYMBOL MIN NOM MAX θ A b c D E e h 0º 8º 0.10 0.33 0.19 0.25 4.80 5.80 3.80
1.27 BSC
1.75 0.25 0.51 0.25 0.50 5.00 6.20 4.00 L 0.40 1.27 1.35
www.onsemi.com PACKAGE DIMENSIONS TSSOP8, 4.4x3 CASE 948AL ISSUE O E1 E e b D cA TOP VIEW SIDE VIEW END VIEW /C01131 L Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-153. SYMBOL θ MIN NOM MAX A b c D E e 0º 8º L 0.05 0.80 0.19 0.09 0.50 2.90 6.30 4.30
0.65 BSC
1.00 REF
1.20 0.15 1.05 0.30 0.20 0.75 3.10 6.50 4.50 0.90 0.60 3.00 6.40 4.40
www.onsemi.com PACKAGE DIMENSIONS WLCSP8, 1.36x1.99 CASE 567MB ISSUE O SEATING PLANE 0.03 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. 4. DIMENSION b IS MEASURED AT THE MAXIMUM BALL DIAMETER PARALLEL TO DATUM C. 2X DIM A MIN MAX −−− MILLIMETERS D 1.36 BSC E b 0.22 0.32 e 0.50 BSC 0.60 ÈÈ ÈÈ E D A B PIN A1 REFERENCE e A0.05 BC 0.03 C 0.05 C 8X b 123 C B A 0.10 C A C 0.16 0.22
1.99 BSC
e1 0.433 BSC 0.50 0.27 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* 0.25 0.433
0.03 C2X
A2 0.35 REF RECOMMENDED PACKAGE OUTLINE e/2 NOTE 4 PITCH PITCH PITCH
www.onsemi.com Marking Package Type Temperature Range Lead Finish Shipping (Note 11) CAV25512VE−GT3 25512A SOIC−8, JEDEC −40°C to +125°C NiPdAu Tape & Reel, 3,000 Units / Reel CAV25512YE−GT3 S12A TSSOP−8 −40°C to +125°C NiPdAu Tape & Reel, 3,000 Units / Reel CAV25512C8ATR (Note 12) S12A WLCSP−8 −40°C to +125°C SnAgCu Tape & Reel, 5,000 Units / Reel 9. For additional package and temperature options, please contact your nearest ON Semiconductor Sales office. 10.For detailed information and a breakdown of device nomenclature and numbering systems, please see the ON Semiconductor Devic e Nomenclature document, TND310/D, available at www.onsemi.com 11. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Ree l Packaging Specifications Brochure, BRD8011/D. 12.Preliminary. Please contact factory for availability. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries i n the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . A listing of ON Semiconductor’s product/patent ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the right s of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 CAV25512/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative