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Document overview

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  • PDF pages: 11

Technical content

Features

  • Automotive Temperature Grade 1 (−40°C to +125°C)
  • Supports Standard and Fast I2C Protocol
  • 2.5 V to 5.5 V Supply V oltage Range
  • 32−Byte Page Write Buffer
  • Hardware Write Protection for Entire Memory
  • CA V Prefix for Automotive and Other Applications Requiring Site and Change Control
  • Schmitt Triggers and Noise Suppression Filters on I2C Bus Inputs (SCL and SDA)
  • Low Power CMOS Technology
  • 1,000,000 Program/Erase Cycles
  • 100 Year Data Retention
  • SOIC, TSSOP 8−lead, and WLCSP 4−Ball Packages
  • This Device is Pb−Free, Halogen Free/BFR Free, and RoHS Compliant

Figure 1. Functional Symbol dimensions section on page 11 of this data sheet.

ORDERING INFORMATION

SOIC−8 W SUFFIX CASE 751BD TSSOP−8 Y SUFFIX CASE 948AL Device Address InputA0, A1, A2 Serial Data Input/OutputSDA Serial Clock InputSCL Write Protect InputWP Power SupplyVCC GroundVSS FunctionPin Name PIN FUNCTION WLCSP−4 C4C SUFFIX CASE 567JY PIN CONFIGURATIONS (Top Views) SOIC (W), TSSOP (Y) SDA WP VCC VSS A0 1 SCL WLCSP (C4C) A1 A2 B1 B2 SDA VSS SCL VCC

Table 1. ABSOLUTE MAXIMUM RATINGS should not be assumed, damage may occur and reliability may be affected.

  1. During input transitions, voltage undershoot on any pin should not exceed −1 V for more than 20 ns. Voltage overshoot on pins A

maximum ratings, irrespective of VCC. Table 2. RELIABILITY CHARACTERISTICS (Note 2)

  1. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC−Q100

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

Table 4. PIN IMPEDANCE CHARACTERISTICS (VCC = 2.5 V to 5.5 V, TA = −40°C to +125°C, unless otherwise specified.)

  1. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC−Q100
  2. When not driven, the WP, A0, A1 and A2 pins are pulled down to GND internally. For improved noise immunity, the internal pull−down is relatively

as the input level exceeds the trip point of the CMOS input buffer (~ 0.5 x VCC), the strong pull−down reverts to a weak current source.

  1. Test conditions according to “AC Test Conditions” table.
  2. Tested initially and after a design or process change that affects this parameter.
  3. t PU is the delay between the time VCC is stable and the device is ready to accept commands.

Table 6. A.C. TEST CONDITIONS

www.onsemi.com PACKAGE DIMENSIONS SOIC 8, 150 mils CASE 751BD ISSUE O E1 E A h θ L c e b D PIN # 1 IDENTIFICATION TOP VIEW SIDE VIEW END VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MS-012. SYMBOL MIN NOM MAX θ A b c D E e h 0º 8º 0.10 0.33 0.19 0.25 4.80 5.80 3.80

1.27 BSC

1.75 0.25 0.51 0.25 0.50 5.00 6.20 4.00 L 0.40 1.27 1.35

www.onsemi.com PACKAGE DIMENSIONS TSSOP8, 4.4x3 CASE 948AL ISSUE O E1 E e b D cA TOP VIEW SIDE VIEW END VIEW /C01131 L Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-153. SYMBOL θ MIN NOM MAX A b c D E e 0º 8º L 0.05 0.80 0.19 0.09 0.50 2.90 6.30 4.30

0.65 BSC

1.00 REF

1.20 0.15 1.05 0.30 0.20 0.75 3.10 6.50 4.50 0.90 0.60 3.00 6.40 4.40

www.onsemi.com PACKAGE DIMENSIONS ÈÈ ÈÈ WLCSP4, 0.76x0.76 CASE 567JY ISSUE O SEATING PLANE 0.05 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. DIM A MIN MAX −−− MILLIMETERS D 0.76 BSC E b 0.15 0.16 e 0.40 BSC 0.35 D E A B PIN A1 REFERENCE e A0.05 BC 0.03 C 0.05 C 4X b B A 0.05 C A C 0.0415 0.0715

0.76 BSC

0.05 C2X TOP VIEW

e A2 0.255 REF PITCH 0.16 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* 0.40 0.40 RECOMMENDED A1 PACKAGE OUTLINE PITCH DIE COAT DETAIL A (OPTIONAL) A2 A3 0.025 REF DETAIL A

www.onsemi.com Device Marking Package Type Lead Finish Shipping† CAV24C64YE−GT3 C64F TSSOP−8 NiPdAu Tape & Reel, 3,000 Units / Reel CAV24C64YE−G (Note 9) C64F TSSOP−8 NiPdAu Tube, 100 Units / Tube CAV24C64WE−GT3 24C64F SOIC−8, JEDEC NiPdAu Tape & Reel, 3,000 Units / Reel CAV24C64C4CTR (Note 9) A WLCSP4 SnAgCu Tape & Reel, 5,000 Units / Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 9. Please contact your nearest ON Semiconductor Sales office for availability. ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidia ries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 CAV24C64/D ON Semiconductor is licensed by Philips Corporation to carry the I2C Bus Protocol. LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative