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Document overview
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- PDF pages: 12
Technical content
Features
- Automotive Temperature Grade 1 (−40°C to +125°C)
- Supports Standard and Fast I2C Protocol
- 2.5 V to 5.5 V Supply V oltage Range
- 32−Byte Page Write Buffer
- Hardware Write Protection for Entire Memory
- CA V Prefix for Automotive and Other Applications Requiring Site and Change Control
- Schmitt Triggers and Noise Suppression Filters on I2C Bus Inputs (SCL and SDA)
- Low Power CMOS Technology
- 1,000,000 Program/Erase Cycles
- 100 Year Data Retention
- SOIC, TSSOP 8−lead, and WLCSP 4−Ball and 5−Ball Packages
- This Device is Pb−Free, Halogen Free/BFR Free, and RoHS Compliant
Figure 1. Functional Symbol This document contains information on some products that are still under development. dimensions section on page 12 of this data sheet.
ORDERING INFORMATION
SOIC−8 W SUFFIX CASE 751BD SCL SOIC (W), TSSOP (Y) TSSOP−8 Y SUFFIX CASE 948AL For the location of Pin 1, please consult the corresponding package drawing. Device Address InputA0, A1, A2 Serial Data Input/OutputSDA Serial Clock InputSCL Write Protect InputWP Power SupplyVCC GroundVSS FunctionPin Name PIN FUNCTION WLCSP4 C4C SUFFIX CASE 567JY WLCSP5 C5A SUFFIX CASE 567JQ VCC SDA VSS SCL WLCSP4 (C4C) WLCSP5 (C5A) WP SCL VCC VSS SDA 13 2 A B C A B PIN CONFIGURATIONS (Top Views)
Table 1. ABSOLUTE MAXIMUM RATINGS should not be assumed, damage may occur and reliability may be affected.
- During input transitions, voltage undershoot on any pin should not exceed −1 V for more than 20 ns. Voltage overshoot on pins A
maximum ratings, irrespective of VCC. Table 2. RELIABILITY CHARACTERISTICS (Note 2)
- These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC−Q100
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
Table 4. PIN IMPEDANCE CHARACTERISTICS (VCC = 2.5 V to 5.5 V, TA = −40°C to +125°C, unless otherwise specified.)
- These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC−Q100
- When not driven, the WP, A0, A1 and A2 pins are pulled down to GND internally. For improved noise immunity, the internal pull−down is relatively
as the input level exceeds the trip point of the CMOS input buffer (~ 0.5 x VCC), the strong pull−down reverts to a weak current source.
- Test conditions according to “AC Test Conditions” table.
- Tested initially and after a design or process change that affects this parameter.
PU is the delay between the time VCC is stable and the device is ready to accept commands. Table 6. A.C. TEST CONDITIONS
www.onsemi.com PACKAGE DIMENSIONS SOIC 8, 150 mils CASE 751BD ISSUE O E1 E A h θ L c e b D PIN # 1 IDENTIFICATION TOP VIEW SIDE VIEW END VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MS-012. SYMBOL MIN NOM MAX θ A b c D E e h 0º 8º 0.10 0.33 0.19 0.25 4.80 5.80 3.80
1.27 BSC
1.75 0.25 0.51 0.25 0.50 5.00 6.20 4.00 L 0.40 1.27 1.35
www.onsemi.com PACKAGE DIMENSIONS TSSOP8, 4.4x3 CASE 948AL ISSUE O E1 E e b D cA TOP VIEW SIDE VIEW END VIEW /C01131 L Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-153. SYMBOL θ MIN NOM MAX A b c D E e 0º 8º L 0.05 0.80 0.19 0.09 0.50 2.90 6.30 4.30
0.65 BSC
1.00 REF
1.20 0.15 1.05 0.30 0.20 0.75 3.10 6.50 4.50 0.90 0.60 3.00 6.40 4.40
www.onsemi.com PACKAGE DIMENSIONS WLCSP5, 1.34x0.91 CASE 567JQ ISSUE A SEATING PLANE 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO THE SPHERICAL CROWNS OF THE SOLDER BALLS. 4. DIMENSION b IS MEASURED AT THE MAXIMUM BALL DIAMETER PARALLEL TO DATUM C. DIM A MIN MAX −−− MILLIMETERS D 1.34 BSC E b 0.16 0.20 e 0.40 BSC 0.35 ÈÈ ÈÈ E D A B PIN A1 REFERENCE e A0.05 BC 0.03 C 0.05 C 5X b C B A 0.10 C A C 0.08 0.12
0.91 BSC
e1 0.693 BSC 0.18 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* 0.69
0.10 C2X
A2 0.23 REF RECOMMENDED PACKAGE OUTLINE PITCH 0.40 PITCH DETAIL A DIE COAT A3(OPTIONAL) DETAIL A A3 0.025 REF
www.onsemi.com PACKAGE DIMENSIONS ÈÈ ÈÈ WLCSP4, 0.76x0.76 CASE 567JY ISSUE O SEATING PLANE 0.05 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. DIM A MIN MAX −−− MILLIMETERS D 0.76 BSC E b 0.15 0.16 e 0.40 BSC 0.35 D E A B PIN A1 REFERENCE e A0.05 BC 0.03 C 0.05 C 4X b B A 0.05 C A C 0.0415 0.0715
0.76 BSC
0.05 C2X TOP VIEW
e A2 0.255 REF PITCH 0.16 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* 0.40 0.40 RECOMMENDED A1 PACKAGE OUTLINE PITCH DIE COAT DETAIL A (OPTIONAL) A2 A3 0.025 REF DETAIL A
www.onsemi.com (Note 10)
2 WLCSP5 SnAgCu Tape & Reel, 5,000 Units / Reel
(Note 10) P WLCSP5 with Die Coat SnAgCu Tape & Reel, 5,000 Units / Reel CAV24C32C4CTR (Note 10) B WLCSP4 with Die Coat SnAgCu Tape & Reel, 5,000 Units / Reel CAV24C32WE−GT3 24C32F SOIC−8, JEDEC NiPdAu Tape & Reel, 3,000 Units / Reel CAV24C32YE−G (Note 10) C32F TSSOP−8 NiPdAu Tube, 100 Units / Tube CAV24C32YE−GT3 C32F TSSOP−8 NiPdAu Tape & Reel, 3,000 Units / Reel 9. All packages are RoHS−compliant (Lead−free, Halogen−free). 10.Please contact your nearest ON Semiconductor Sales office for availability. 11. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Ree l Packaging Specifications Brochure, BRD8011/D. 12.Caution: The EEPROM devices delivered in WLCSP must never be exposed to ultraviolet light. When exposed to ultraviolet light the EEPROM cells lose their stored data. ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidia ries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 CAV24C32/D ON Semiconductor is licensed by Philips Corporation to carry the I2C Bus Protocol. LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative