CAT4003B - Constant Current Programmable LED Driver with 32 Dimming Levels
Document overview
- Manufacturer or author: s2189c
- PDF pages: 12
Technical content
Features
- 3, 4 LED Current Sinks with Tight Matching
- 32 Dimming Levels
- Low Dropout Driver 75 mV at 20 mA
- No Switching Noise
- Shutdown Current less than 1 /C0109A
- 25 mA Max LED Current per Channel
- Dimming via 1−wire EZDim Interface
- Thermal Shutdown Protection
- RoHS Compliant
- 6−lead TSOT−23, TSOP, SC−70, and 8−pad UDFN 2 mm x 2 mm Packages Typical Applications
- LCD Display Backlight
- Cellular Phones
- Digital Still Cameras This document contains information on some products that are still under development. ON Semiconductor reserves the right to change or discontinue these products without notice. http://onsemi.com See detailed ordering information on page 2 of this data sheet.
ORDERING INFORMATION
SC70−6 SD SUFFIX CASE 419AD TSOT23−6 TD SUFFIX CASE 419AF UDFN−8 HU2 SUFFIX CASE 517AW TYPICAL APPLICATION CIRCUIT GND VIN 2.4 V to 5.5 V EN/DIM CAT4003B VIN 1 /C0109F LED1 LED3 One Wire Programming
32 Steps
TSOP−6 TS SUFFIX CASE 318G
CAT4003B, CAT4004B http://onsemi.com MARKING DIAGRAMS TSOT23−6LUDFN8 (2 x 2 mm) SC70−6L BHA YM BH = CAT4004B Device Code A = Assembly Location Code Y = Production Year (last digit) M = Production Month: 1 − 9, O, N, D KL = CAT4003B Device Code Y = Production Year (last digit) M = Production Month: 1 − 9, O, N, D KL = CAT4003B Device Code A = Assembly Location Code KLYM KLA TSOP−6 L4AYW L4 = CAT4003B Device Code A = Assembly Location Code YW = Year and Work Week ORDERING INFORMATION (Note 1) Orderable Part Number Package Finish Shipping (Note 2) CAT4003BTD−GT3 TSOT−23, 6−Lead NiPdAu (RoHS Compliant) 3,000 / Tape & Reel CAT4003BTS−T3 TSOP, 6−Lead Matte−Tin (RoHS Compliant) 3,000 / Tape & Reel CAT4003BSD−GT3 SC−70, 6−Lead NiPdAu (RoHS Compliant) 3,000 / Tape & Reel CAT4004BHU2−GT3 UDFN, 8−Pad, 2 x 2 mm NiPdAu (RoHS Compliant) 3,000 / Tape & Reel 1. For additional package and temperature options, please contact your nearest ON Semiconductor Sales office. 2. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 3. For detailed information and a breakdown of device nomenclature and numbering systems, please see the ON Semiconductor Device Nomenclature document, TND310/D, available at www.onsemi.com
Table 1. PIN FUNCTIONS TAB Connect to GND on the PCB, for CAT4004B only. Table 2. ABSOLUTE MAXIMUM RATINGS Table 3. RECOMMENDED OPERATING CONDITIONS
- Typical application circuit with external components is shown on page 1.
Table 4. ELECTRICAL OPERATING CHARACTERISTICS
- For the CAT4003B, I LEDAVG = (ILED,CH1 + ILED,CH2 + ILED,CH3) / 3
- The Min/Max limits apply across the −40°C to +85°C ambient temperature range and are assured by design, characterization and correlation
Table 5. RECOMMENDED EN/DIM TIMING (For 3 V ≤ VIN ≤ 5.5 V, over full ambient temperature range −40°C to +85°C.) (Note 7)
- The Min/Max limits apply across the −40°C to +85°C ambient temperature range and are assured by design, characterization and correlation
Figure 1. CAT400XB EN/DIM Dimming Timing Diagram
32 Levels
internally set to 25 mA (no external resistor).
channels are disabled and the device enters shutdown mode. connected to the ground plane on the PCB. soldered to the PCB and connected to the ground plane.
4 Current Sink
Figure 12. CAT4004B Functional Block Diagram accurately regulate LED current in each channel. values. Any unused LED channels should be left open. quickly be set to zero or to any other level.
EN/DIM is held low for longer than 5 ms. EN/DIM after the power−up, as shown in Table 6. Table 6. DIMMING LEVELS
CAT4003B, CAT4004B http://onsemi.com PACKAGE DIMENSIONS UDFN8, 2x2 CASE 517AW−01 ISSUE O L E PIN #1 INDEX AREA PIN #1 IDENTIFICATION DETAIL A D b e A TOP VIEW SIDE VIEW DETAIL A BOTTOM VIEW Notes: (1) All dimensions are in millimeters. (2) Complies with JEDEC MO-229. SYMBOL MIN NOM MAX A 0.45 0.50 0.55 A1 0.00 0.02 0.05 b 0.18 0.25 0.30 D 1.90 2.00 2.10 D2 1.50 1.60 1.70 E 2.00 E2 0.80 0.90 1.00 e 1.90
0.50 BSC
2.10 L 0.20 0.30 0.45
CAT4003B, CAT4004B http://onsemi.com PACKAGE DIMENSIONS SC−70, 6 Lead, 1.25x2 CASE 419AD−01 ISSUE O D A L L1 L2 ee b c TOP VIEW SIDE VIEW END VIEW /C01131 /C01131 Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-203. E /C0113 SYMBOL MIN NOM MAX θ A b c D E e L 0º 8º 0.00 0.15 0.10 0.26 1.80 1.80 1.15
0.65 BSC
0.15 BSC
1.10 0.10 0.30 0.18 0.46 2.20 2.40 1.35 0.80 θ1 4º 10º A2 0.80 1.00
0.42 REF
0.36 2.00 2.10 1.25
CAT4003B, CAT4004B http://onsemi.com PACKAGE DIMENSIONS TSOT−23, 6 LEAD CASE 419AF−01 ISSUE O E1 E e b D c A TOP VIEW SIDE VIEW END VIEW L Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-193. SYMBOL θ MIN NOM MAX /C0113 A b c D E e L 0º 8º 0.01 0.80 0.30 0.12 0.30 0.05 0.87 0.15
2.90 BSC
2.80 BSC
1.60 BSC
0.95 TYP
0.40
0.60 REF
0.25 BSC
1.00 0.10 0.90 0.45 0.20 0.50
CAT4003B, CAT4004B http://onsemi.com PACKAGE DIMENSIONS ÉÉ ÉÉ TSOP−6 CASE 318G−02 ISSUE U 456 D e b A0.05 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D AND E1 ARE DETERMINED AT DATUM H. 5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE. c *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* DIM A MIN NOM MAX MILLIMETERS 0.90 1.00 1.10 A1 0.01 0.06 0.10 b 0.25 0.38 0.50 c 0.10 0.18 0.26 D 2.90 3.00 3.10 E 2.50 2.75 3.00 e 0.85 0.95 1.05 L 0.20 0.40 0.60
0.25 BSCL2
−0° 10° 1.30 1.50 1.70E1 E RECOMMENDED NOTE 5 L CM H SEATING PLANE GAUGE PLANE DETAIL Z DETAIL Z 0.60 3.20 0.95 0.95 PITCH DIMENSIONS: MILLIMETERS M ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. CAT4003B/D PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative