CAN4311111002451K YAGEO | Alldatasheet

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Technical content

Supersedes data of 5th February 2001 2 0 0 1S e p2 7R e v . 1 ANTENNA PRODUCTS

2.45 GHz ISM-band antenna for

Bluetooth and WLAN IEEE 802.11b Surface-mount ceramic multilayer antennas www.phycomp-components.com

2001 Sep 27 Rev.1 2 www.phycomp-components.com Phycomp Product specification Surface-mount ceramic multilayer antennas Bluetooth and WLAN IEEE 802.11b

FEATURES

  • Designed for 2.45 GHz ISM-band
  • Simplifies antenna circuitry
  • NiSn lead-free terminations
  • suitable for wave and reflow soldering
  • Supplied in tape on reel.

APPLICATIONS

  • Telecommunications
  • Computing (PCs, printers, PDAs)
  • Wireless office data communications including WLAN
  • Consumer electronics (wireless headphones).

DESCRIPTION

This 2.45 GHz ceramic multilayer antenna has been designed to meet the requirements of the BluetoothTM(1) and IEEE 802.11b wireless communications protocol. It consists of a rectangular block of low-dielectric ceramic material and is fabricated in a water-based non-toxic process. The antenna is capable of providing good connectivity using near 50 Ω microstrip directly onto the PC board. (1) Bluetooth is a trademark owned by Telefonieaktiebolaget L M Ericsson, Sweden. ENVIRONMENTAL CARE The foil making process uses an environment- friendly aqueous-solvent technology that fully complies with today’s green-product design requirements. All terminations are lead-free. Packing materials can be recycled. QUICK REFERENCE DATA DESCRIPTION VALUE Center frequency 2.45, 2.60 and 2.70 GHz Bandwidth 100 MHz Gain 1.2 dBi max. VSWR 2 max. Polarization Linear Azimuth beamwidth Omni-directional Impedance 50 Ω Power dissipation 1 W Operating temperature −55 to +125 °C Terminations NiSn Resistance to soldering heat 260 °C for 10 s Weight 0.16 g

2001 Sep 27 Rev.1 3 www.phycomp-components.com Phycomp Product specification Surface-mount ceramic multilayer antennas Bluetooth and WLAN IEEE 802.11b MECHANICAL DATA Physical dimensions Table 1 Antenna dimensions Note 1. The antenna has built-in circuitry to the ground termination. Connecting the antenna ’s ground point to the system’s RF ground plane is optional. If good matching is achieved, the ground termination is then used as a solder joint (like S1, S2, S3, and S4) to fix the antenna to the substrate only. Device marking LWT FGCS

1 S2 S3 S4

––– feed termination optional1) ground termination NC solder termination NC solder termination NC solder termination NC solder termination Dimensions in millimetres CENTER FREQUENCY (GHZ) MARKING CODE 2.45 no marking 2.60 6 2.70 7 HBK016 W C G F S1 G FT L S4S2 C Dimensions in mm Fig.1 Dimensional outline. For dimensions see Table 1.

2001 Sep 27 Rev.1 4 www.phycomp-components.com Phycomp Product specification Surface-mount ceramic multilayer antennas Bluetooth and WLAN IEEE 802.11b

ELECTRICAL CHARACTERISTICS

Table 2 Recommended solder land pattern DESCRIPTION VALUE Center frequency 2.45, 2.60 and 2.70 GHz Bandwidth 100 MHz Gain 1.2 dBi max. VSWR 2 max. Polarization Linear Azimuth beamwidth Omni-directional Impedance 50 Ω Power dissipation 1 W Operating temperature −55 to +125 °C Terminations NiSn Resistance to soldering heat 260 °C, 10 sec. LWFGC S –– feed pad optional ground pad – NC mounting pad NC mounting pad NC mounting pad NC mounting pad Dimensions in millimetres HBK015 W C L G F C ANTENNA Dimensions in mm Fig.2 Recommended dimensions of solder lands. For dimensions see Table 2.

2001 Sep 27 Rev.1 5 www.phycomp-components.com Phycomp Product specification Surface-mount ceramic multilayer antennas Bluetooth and WLAN IEEE 802.11b STANDARD TEST BOARD FOR RADIATION PATTERN AND SWR MEASUREMENTS HBK090Dimensions in mm 50 Ω transmisson line SMA connector 814 0.8 1.2 antenna chip Fig.3 Typical FR4 test board. HBK088 100 250 Ω Ω Ω 100 250 10 25 100 250 + j − j

2 GHz

3 GHz

2.0 3.0 f (GHz) SWR 1.0 2.0 3.0 5.0 7.0 6.0 8.0 9.0 10.0 4.0 2.2 2.4 2.6 2.8 HBK089 123 Fig.4 Typical SWR and characteristic impedance measurements. Marker data: 1: SWR = 1.28; f = 2.400 GHz 2: SWR = 1.34; f = 2.450 GHz 3: SWR = 1.34; f = 2.500 GHz. Marker data: 1: 50.75 Ω/12.36 Ω; f = 2.400 GHz 2: 44.98 Ω/12.83 Ω; f = 2.450 GHz 3: 43.99 Ω/12.27 Ω; f = 2.500 GHz.

2001 Sep 27 Rev.1 6 www.phycomp-components.com Phycomp Product specification Surface-mount ceramic multilayer antennas Bluetooth and WLAN IEEE 802.11b APPLICATION EXAMPLE HBK018180° −90° 90° −40 −30 −20 −10 0 dBi HBK019180° −90° 90° −40 −30 −20 −10 0 dBi Fig.5 Typical radiation patterns. E-plane H-plane (omni-directional) HBK014 GROUND PLANE (on back side) BLUETOOTH OR OTHER RF MODULE CLEARANCE (no ground plane) CLEARANCE (no ground plane) ANTENNA CHIP Ground Feedpoint 50 Ω transmisson line (can be a straight connection) Dimensions in mm Fig.6 Suggested layout. Note: The ground termination can be optionally connected to RF ground.

2001 Sep 27 Rev.1 7 www.phycomp-components.com Phycomp Product specification Surface-mount ceramic multilayer antennas Bluetooth and WLAN IEEE 802.11b

ORDERING INFORMATION

Components may be ordered by using either a simple 16-digit clear text code or Phycomp ’s unique 12NC. Ordering example for a 2.45 GHz antenna, 1000 pieces supplied in blister tape on 180 mm reel. Clear text ordering code EXAMPLE: AN2450000707051K 12NC ordering code EXAMPLE: 4311 111 00245 PRODUCT CENTER FREQUENCY BANDWIDTH MATERIAL SIZE QUANTITY PACKING AN 2450 00 07 0705 1 K AN = antenna 2450 = 2.45 GHz 2600 = 2.60 GHz 2700 = 2.70 GHz 00 = 100 MHz 07 = K7 0705 = 7.35 × 5.5 × 1.3 mm 1 = 1000 pcs 4 = 4000 pcs K = 180 mm; 7" blister F = 330 mm; 13" blister B = bulk case 43XX 111 00XXX Family Center frequency 43 antenna 245 260 270

2.45 GHz

2.60 GHz

2.70 GHz

180 mm / 7” reel, blister, 1000 pcs 330 mm / 13” reel, blister, 4000 pcs bulk, 1000 pcs 00 100 MHz bandwidth (VSWR <2) Material Size 1 high-frequency material 11 7.35 × 5.5 × 1.3 mm

2001 Sep 27 Rev.1 8 www.phycomp-components.com Phycomp Product specification Surface-mount ceramic multilayer antennas Bluetooth and WLAN IEEE 802.11b TESTS AND REQUIREMENTS Table 3 Test procedures and requirements IEC 60 384-10 CECC 32 100 CLAUSE IEC 60068-2 TEST METHOD TEST PROCEDURE REQUIREMENTS 4.4 mounting The antenna may be mounted on a printed-circuit boards or ceramic substrates by applying wave soldering, reflow soldering (including vapour phase soldering) or conductive adhesive no visual damage 4.5 visual inspection and dimension check any applicable method using ×10 magnification no cracks or fissures larger than 4m m 4.6.1 antenna frequency: 2.45 GHz @ 20 °C standard test board from Fig.3 4.8 adhesion a force of 5 N applied for 10 s to the line joining the terminations and in a plane parallel to the substrate no visible damage 4.9 bond strength of plating on end face mounted in accordance with CECC 32 100, paragraph 4.4 no visible damage conditions: bending 1 mm at a rate of 1 mm/s; radius jig: 340 mm; 2 mm warp on FR4 board of 90 mm length no visible damage 4.10 20 (Tb) resistance to soldering heat 260 ±5 °C for 10 ±0.5 s in a static solder bath the terminations shall be well tinned after recovery; center frequency shift within ±6% resistance to leaching 260 ±5 °C for 30 ±1s i n a s t a t i c solder bath using visual enlargement of ×10; dissolution of the terminations shall not exceed 10% 4.11 20 (Ta) solderability zero hour test and test after storage (20 to 24 months) in original packing in normal atmosphere; unmounted chips completely immersed for 2 ±0.5 s in a solder bath at 235 ±5 °C the terminations must be well tinned for at least 75% 4.12 4 (Na) rapid change of temperature −55 °C (30 minutes) to +125 °C (30 minutes); 100 cycles no visual damage; center frequency shift within ±6% 4.14 3 (Ca) damp heat 500 ±12 hours at 60 °C; 90 to 95% RH no visual damage; 2 hours recovery; center frequency shift within ±6% 4.15 endurance 500 ±12 hours at 125 °C no visual damage; 2 hours recovery; center frequency shift within ±6%

2001 Sep 27 Rev.1 9 www.phycomp-components.com Phycomp Product specification Surface-mount ceramic multilayer antennas Bluetooth and WLAN IEEE 802.11b PACKING Tape and reel specifications Tape and reel specifications are in accordance with “IEC 60286-3”. Basic dimensions are given in Figs 7 and 8, and Tables 4 and 5. Peel-off force Peel-off force of the blister tape is in accordance with “IEC 60286-3”; that is, at a peel-off speed of 300 ±10 mm/minute, 0.1 N to 1.3 N for 16 mm tape. The peel-off angle should be between 165° and 180°. Blister tape ENVIRONMENTAL CONSIDERATIONS

  • Cover tape, carrier tape and reel do not contain environmentally-harmful PVC materials.
  • Tape and reel are antistatic.
  • Because the carrier tape is made of polycarbonate, a homogeneous material (mono-plastic), it is ideally suited for recycling.
  • Compared to other PVC-free materials polycarbonate shows excellent stiffness and very little deformation with temperature. Blister tape specifications handbook, full pagewidth MBG516 E F W A0 D 1 direction of unreeling K T cover tape T 1 Fig.7 Blister tape. Cumulative pitch error: 0.2 mm over 10 pitches. Cumulative tolerance over 10 holes: ±0.2 mm. K0: chosen so that the orientation of the component cannot change. For dimensions see Table 4.

2001 Sep 27 Rev.1 10 www.phycomp-components.com Phycomp Product specification Surface-mount ceramic multilayer antennas Bluetooth and WLAN IEEE 802.11b Table 4 Dimensions of blister tape; see Fig.7 Notes 1. Possible product displacement in pocket. 2. P 0 pitch tolerance over any 10 pitches is ±0.2 mm. SYMBOL DIMENSION TOL. UNIT A0 nominal clearance; note 1 5.85 ±0.10 mm B0 nominal clearance; note 1 7.60 ±0.10 mm K0 minimum clearance; note 1 1.70 ±0.10 mm W1 6 . 0 ±0.3 mm E1 . 7 5 ±0.10 mm F7 . 5 0 ±0.10 mm D0 1.55 ±0.10 mm D1 1.50 ±0.10 mm P0; note 2 4.0 ±0.1 mm P1 8.0 ±0.1 mm P2 2.0 ±0.1 mm T0 . 3 0 ±0.10 mm

2001 Sep 27 Rev.1 11 www.phycomp-components.com Phycomp Product specification Surface-mount ceramic multilayer antennas Bluetooth and WLAN IEEE 802.11b Reel specifications Table 5 Reel dimensions; see Fig.8 QUANTITY PER REEL TAPE WIDTH (mm) A (mm) C (mm) N (mm) (mm) (mm) NCA HBK039 Fig.8 Reel. Dimensions in mm. For reel dimensions see Table 5.

2001 Sep 27 Rev.1 12 www.phycomp-components.com Phycomp Product specification Surface-mount ceramic multilayer antennas Bluetooth and WLAN IEEE 802.11b

REVISION HISTORY

Rev.0 2001 Feb 05 – - First issue of this specification Rev.1 2001 Sep 27 – - Specification status changed from “Preliminary” to “Product specification” - Product range expanded with 2.60 and 2.70 GHz devices - Revised antenna dimensions (see Table 1) - 180 mm tape-and-reel and bulk packing options added - Blister tape-and-reel specifications added - Clear-text code ordering information added