CAM-55G0 STM | Alldatasheet

Document overview

  • Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
  • PDF pages: 5

Technical content

Features

  • “Promodules”: turnkey camera modules for evaluation: – Including VD55G0 image sensor, lens holder, lens, and plug-and-play flex connection. – Lens focused, glued, and tested in cleanroom environment using specialized equipment. – Small footprint down to 5.0 mm square.
  • Various lens options: – Ultra-wide-angle lens for wide scene capture (158° DFOV). – General purpose lens enabling various system setups (79° DFOV) and a thin design.
  • Plug-and-play connector to change promodules at any time: – FPC-to-board 30-pin connector. – Same connector for all ST promodules.
  • Ready for evaluation and integration: – On computer with a USB output using the EVK Main hardware tool and the Evaluation GUI free software. – On embedded processing platforms with a MIPI CSI-2 output using the P-Board hardware tool and free Linux software tools.

Description

The CAM-55G0 promodules are a full range of sample camera modules made for a seamless evaluation and integration of the VD55G0 0.38-megapixel monochrome image sensor. These ready-to-use vision extensions integrate VD55G0 image sensor, lens holder, lens, and plug-and-play flex connection in a tiny format down to 5.0 mm square. The CAM-55G0 line leverages the complete toolbox of on-chip features of the VD55G0 image sensor embedded, such as binning, autoexposure, or context management. Multiple GPIOs enable users to synchronize the modules with triggers and illumination. Featuring a single lane MIPI CSI-2 output, the promodules are perfectly suited for embedded low-power setups. Multiple promodule references are available, featuring various lenses to best match the needs of every application in terms of optical setup and mechanical constraints. All camera modules are equipped with the same FPC-to-board connector and pinout. This plug-and-play architecture allows users to change promodule instantly, and reuse the same setup with different lenses, color options and even different image sensors in the ST BrightSense portfolio. CAM-55G0 promodules can be tested and integrated on computers or embedded processing boards using hardware and software tools from STMicroelectronics. The compatible EVK Main and P-Board hardware kits enable straight connection to PC and embedded processing platforms respectively. Evaluation GUI software and Linux drivers are available for download from the Imaging Software section of the website. Order code Description CAM-5G0-079CLR VD55G0 promodule with 79° FoV lens CAM-5G0-158CLR VD55G0 promodule with 158° FoV lens VD55G0 promodules: Camera module evaluation samples for instant integration of VD55G0 sensor CAM-55G0 Data brief DB5266 - Rev 1 - May 2024 For further information contact your local STMicroelectronics sales office.

Figure 1. Common connector to all ST promodules Table 1. Evaluation & development setup with CAM-55G0 promodules

1 Technical specifications

Table 2. Technical specifications

Electrical characteristics

Connector type FPC-to-board Connector reference Hirose BM28 B0.6-30DP/2-0.35V Pinout 30 pins Output interface MIPI CSI-2 | 1 lane Control interface I²C Output format RAW8, RAW10 Supply voltages 2.8 V – 1.8 V – 1.15 V External clock frequency 6 to 27 MHz Embedded features Image quality optimization

  • Autoexposure
  • Automatic dark calibration
  • Defective pixel correction
  • Analog and digital gains Power and data optimization
  • Cropping
  • Binning
  • Subsampling
  • Context management with up to 4 contexts Others
  • Mirror/Flip
  • Test pattern generation
  • Temperature sensor
  • GPIOs x4 Category Parameter CAM-5G0-079CLR CAM-5G0-158CLR Optical characteristics Aperture – f/# F/2.0 F/2.0 Field of view – D | H | V 79° | 62° | 59° 158° | 116° | 108° EFL 1.348 mm 0.825 mm Depth of field 20 cm -> ∞ 40 cm -> ∞ TV distortion ≤ 1 % < 37 % Filter Clear Clear Mechanical characteristics Distance from connector to optical center 7.45 mm 7.45 mm CAM-55G0 Technical specifications DB5266 - Rev 1 page 3/5

Revision history

Table 3. Document revision history

IMPORTANT NOTICE – READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgment. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2024 STMicroelectronics – All rights reserved CAM-55G0 DB5266 - Rev 1 page 5/5