SN74AHCT7541-Q1 TI | Alldatasheet
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Technical content
SN74AHCT7541-Q1 Automotive Octal Buffers With Open-Drain Outputs
1 Features
- AEC-Q100 qualified for automotive applications: – Device temperature grade 1: -40°C to +125°C – Device HBM ESD classification level 2 – Device CDM ESD classification level C4B
- Available in wettable flank QFN package
- Supply operating range 2V to 5.5V
- Low delay, 11.2ns at 5V, 50pF
- Latch-up performance exceeds 100mA per JESD 17
2 Applications
- Drive an indicator LED
- Level-shift using open-drain outputs
3 Description
The SN74AHCT7541-Q1 is an octal buffer with open- drain outputs.
Package Information
NUMBER PACKAGE(1) PACKAGE SIZE(2) BODY SIZE(3) SN74AHCT754 1-Q1 PW (TSSOP, 20) 6.5mm × 6.4mm 6.5mm x 4.4mm DGS (VSSOP, 20) 5.1mm × 4.9mm 5.1mm × 3.0mm RKS (VQFN, 20) 4.5mm × 2.5mm 4.5mm × 2.5mm (1) For more information, see Mechanical, Packaging, and Orderable Information. (2) The package size (length × width) is a nominal value and includes pins, where applicable. (3) The body size (length × width) is a nominal value and does not include pins. Ax Yx One of Eight Buffers OE2 OE1 Shared Control Logic Functional Block Diagram SN74AHCT7541-Q1 SLVSKE9 – DECEMBER 2025 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
11 Mechanical, Packaging, and Orderable
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4 Pin Configuration and Functions
Figure 4-1. SN74AHCT7541-Q1 RKS Package (Top View) GND VCC OE1 OE2 Figure 4-2. SN74AHCT7541-Q1 PW , DGS Package (Top View) Pin Functions PIN TYPE(1) DESCRIPTION NAME NO. OE1 1 I Output enable 1, active low A1 2 I Input for channel 1 A2 3 I Input for channel 2 A3 4 I Input for channel 3 A4 5 I Input for channel 4 A5 6 I Input for channel 5 A6 7 I Input for channel 6 A7 8 I Input for channel 7 A8 9 I Input for channel 8 GND 10 G Ground Y8 11 O Output for channel 8 Y7 12 O Output for channel 7 Y6 13 O Output for channel 6 Y5 14 O Output for channel 5 Y4 15 O Output for channel 4 Y3 16 O Output for channel 3 Y2 17 O Output for channel 2 Y1 18 O Output for channel 1 OE2 19 I Output enable 2, active low VCC 20 P Postive supply Thermal Pad(2) — The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply. (1) Signal Types: I = Input, O = Output, G = Ground, P = Power. (2) RKS package only. www.ti.com SN74AHCT7541-Q1 SLVSKE9 – DECEMBER 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: SN74AHCT7541-Q1
5 Specifications
5.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT VCC Supply voltage range –0.5 7 V VI Input voltage range(2) –0.5 7 V VO Output voltage range(2) –0.5 7 V IIK Input clamp current VI < -0.5V -20 mA IOK Output clamp current VO < -0.5V or VO > VCC + 0.5V -20 mA IO Continuous output current VO = 0 to VCC 25 mA Continuous output current through VCC or GND ±75 mA TJ Junction temperature 150 °C Tstg Storage temperature -65 150 °C (1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute maximum ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If briefly operating outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not sustain damage, but it may not be fully functional. Operating the device in this manner may affect device reliability, functionality, performance, and shorten the device lifetime. (2) The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
5.2 ESD Ratings
V(ESD) Electrostatic discharge Human body model (HBM), per AEC Q100-002 HBM ESD Classification Level 2(1) ±2000 VCharged device model (CDM), per AEC Q100-011 CDM ESD Classification Level C4B ±1000 (1) AEC Q100-002 indicate that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
5.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) Spec Description Condition MIN MAX UNIT VCC Supply voltage 4.5 5.5 V VIH High-level input voltage VCC = 5V 2 V VIL Low-Level input voltage VCC = 5V 0.8 V VI Input Voltage 0 5.5 V VO Ouptut Voltage 0 5.5 V IOL Low-level output current VCC = 5V ± 0.5V 8 mA ∆t/∆v Input transition rise or fall rate VCC = 5V ± 0.5V 20 ns/V TA Operating free-air temperature –40 125 °C
5.4 Thermal Information
THERMAL METRIC(1) UNIT RθJA RθJC(top) RθJB ΨJT ΨJB RθJC(bot) SN74AHCT7541-Q1 SLVSKE9 – DECEMBER 2025 www.ti.com
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THERMAL METRIC(1) UNIT RθJA RθJC(top) RθJB ΨJT ΨJB RθJC(bot) (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
5.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC -40°C to 125°C UNIT MIN TYP MAX VOL IOL = 50μA 4.5V 0.01 0.1 V IOL = 8mA 4.5V 0.2 0.44 II VI = 5.5V or GND and VCC = 0V to 5.5V 0V to 5.5V ±0.001 ±1 µA IOZ VO = VCC or GND and VCC = 5.5V 5.5V 0.2 ±2.5 µA ICC VI = VCC or GND, IO = 0, and VCC = 5.5V 5.5V 0.3 40 µA ΔICC One input at 3.4V, Other inputs at VCC or GND 5.5V 0.2 1.5 mA CI VI = VCC or GND 5V 4 10 pF CO VO = VCC or GND 5V 5 pF CPD No load, F = 1MHz 5V 13 pF
5.6 Switching Characteristics
Over operating free-air temperature range; typical values measured at TA = 25°C (unless otherwise noted). See Parameter Measurement Information. PARAMETER FROM (INPUT) TO (OUTP UT) LOAD CAPACITANCE VCC TA = 25°C -40°C to 85°C -40°C to 125°C UNIT MIN TYP MAX MIN TYP MAX MIN TYP MAX tPZL A Y CL = 15pF 5V tPZL OE Y CL = 15pF 5V 4 5.7 3 7 3 4.9 7 ns tPZL A Y CL = 50pF 5V tPZL OE Y CL = 50pF 5V tsk(o) CL = 50pF 5V 0.2 0.3 0.3 ns
5.7 Noise Characteristics
VCC = 5V, CL = 50pF, TA = 25°C PARAMETER DESCRIPTION MIN TYP MAX UNIT VOL(P) Quiet output, maximum dynamic VOL 0.8 V VOL(V) Quiet output, minimum dynamic VOL -0.2 V VOH(V) Quiet output, minimum dynamic VOH 3.8 V VIH(D) High-level dynamic input voltage 2 V VIL(D) Low-level dynamic input voltage 0.8 V www.ti.com SN74AHCT7541-Q1 SLVSKE9 – DECEMBER 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: SN74AHCT7541-Q1
5.8 Typical Characteristics
TA = 25°C (unless otherwise noted) V C C ( V ) ICC(nA) 1 0 2 0 3 0 4 0 5 0 6 0 7 0 8 0 2 5 ° C 1 2 5 ° C - 4 0 ° C Figure 5-1. Supply Current Across Supply Voltage IOL (mA) VOL (V) 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5 -40°C 25°C 125°C Figure 5-2. Output Voltage vs Current in LOW State; 5V Supply SN74AHCT7541-Q1 SLVSKE9 – DECEMBER 2025 www.ti.com
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6 Parameter Measurement Information
Phase relationships between waveforms were chosen arbitrarily for the examples listed in the following table. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1MHz, ZO = 50Ω, tt < 2.5ns. The outputs are measured individually with one input transition per measurement. TEST S1 RL CL ΔV VCC tPLZ, tPZL CLOSED 1kΩ 15pF, 50pF 0.15V ≤ 2.5V tPLZ, tPZL CLOSED 1kΩ 15pF, 50pF 0.3V > 2.5V CL (1) RLFrom Output Under Test VCCTest Point (1) CL includes probe and test-fixture capacitance. Figure 6-1. Load Circuit for Open-Drain Outputs Input 50% VOH VOL tPLZ (1) tPZL (2) VOH VOL tPZL (2) tPLZ (1) 50% 50% 50% VCC 0 V 10% VCC Output Output 10% (1) tPLZ is the same as tdis. (2) tPZL is the same as ten. Figure 6-2. Voltage Waveforms Propagation Delays Quiet Output VOH(P), VOL(P) VOL(V) Noise values measured with all other outputs simultaneously switching. Figure 6-3. Voltage Waveforms, Noise www.ti.com SN74AHCT7541-Q1 SLVSKE9 – DECEMBER 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 7 Product Folder Links: SN74AHCT7541-Q1
7 Detailed Description
7.1 Overview
The SN74AHCT7541-Q1 contains eight buffers with open-drain outputs. The active low output enable pins ( OE1 and OE2) control all eight channels, and are configured so that both must be low for the outputs to be active. When the outputs are enabled, the outputs are actively driven low or set into the high-impedance state. When the outputs are disabled, the outputs are set into the high-impedance state.
7.2 Functional Block Diagram
Figure 7-1. Logic Diagram (Positive Logic) SN74AHCT7541-Q1 SLVSKE9 – DECEMBER 2025 www.ti.com
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7.3 Feature Description
7.3.1 Open-Drain CMOS Outputs
This device includes open-drain CMOS outputs. Open-drain outputs can only drive the output low. When in the high logical state, open-drain outputs are in a high-impedance state. The drive capability of this device can create fast edges into light loads, so consider routing and load conditions to prevent ringing. Additionally, the outputs of this device are capable of driving larger currents than the device can sustain without being damaged. Limit the device output power to avoid damage due to overcurrent. Follow the electrical and thermal limits defined in the Absolute Maximum Ratings at all times. When placed into the high-impedance state, the output neither sources nor sinks current, with the exception of minor leakage current as defined in the Electrical Characteristics table. In the high-impedance state, the output voltage is not controlled by the device and is dependent on external factors. If no other drivers are connected to the node, then this is known as a floating node and the voltage is unknown. A pull-up resistor can be connected to the output to provide a known voltage at the output while it is in the high-impedance state. The value of the resistor depends on multiple factors, including parasitic capacitance and power consumption limitations. Typically, use a 10kΩ resistor to meet these requirements. Leave unused open-drain CMOS outputs disconnected. www.ti.com SN74AHCT7541-Q1 SLVSKE9 – DECEMBER 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 9 Product Folder Links: SN74AHCT7541-Q1
7.3.2 Standard CMOS Inputs
This device includes standard CMOS inputs. Standard CMOS inputs are high impedance and are typically modeled as a resistor in parallel with the input capacitance given in the Electrical Characteristics . The worst case resistance is calculated with the maximum input voltage, given in the Absolute Maximum Ratings, and the maximum input leakage current, given in the Electrical Characteristics, using Ohm's law (R = V ÷ I). Standard CMOS inputs require that input signals transition between valid logic states quickly, as defined by the input transition time or rate in the Recommended Operating Conditions table. Failing to meet this specification will result in excessive power consumption and could cause oscillations. More details can be found in Implications of Slow or Floating CMOS Inputs. Do not leave standard CMOS inputs floating at any time during operation. Unused inputs must be terminated at VCC or GND. If a system will not be actively driving an input at all times, then a pull-up or pull-down resistor can be added to provide a valid input voltage during these times. The resistor value will depend on multiple factors; a 10kΩ resistor, however, is recommended and will typically meet all requirements. SN74AHCT7541-Q1 SLVSKE9 – DECEMBER 2025 www.ti.com
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7.3.3 Wettable Flanks
This device includes wettable flanks for at least one package. See the Features section on the front page of the data sheet where packages include this feature. Package We able Flank Lead PCB Pad Standard Lead Package Solder Figure 7-2. Simplified Cutaway View of Wettable-Flank QFN Package and Standard QFN Package After Soldering Wettable flanks help improve side wetting after soldering, which makes QFN packages easier to inspect with automatic optical inspection (AOI). As shown in Figure 7-2 , a wettable flank can be dimpled or step-cut to provide additional surface area for solder adhesion which assists in reliably creating a side fillet. See the mechanical drawing for additional details. www.ti.com SN74AHCT7541-Q1 SLVSKE9 – DECEMBER 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 11 Product Folder Links: SN74AHCT7541-Q1
7.3.4 Clamp Diode Structure
Figure 7-3 shows the inputs and outputs to this device have negative clamping diodes only. CAUTION Voltages beyond the values specified in the Absolute Maximum Ratings table can cause damage to the device. The input and output voltage ratings may be exceeded if the input and output clamp- current ratings are observed. Figure 7-3. Electrical Placement of Clamping Diodes for Each Input and Output
7.4 Device Functional Modes
Table 7-1. Function Table INPUTS(1) OUTPUT(2) OE1 OE2 A Y L L L L L L H Z H X X Z X H X Z (1) L = input low, H = input high, X = don't care (2) L = output low, Z = high impedance SN74AHCT7541-Q1 SLVSKE9 – DECEMBER 2025 www.ti.com
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8 Application and Implementation
Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.
8.1 Application Information
Open-drain outputs like those available in the SN74AHCT7541-Q1 provide the ability to discharge a voltage node to ground without otherwise loading the node significantly. It is recommended to add a series resistor between the output and any capacitance larger than 50pF as shown in the Typical Application Block Diagram to prevent damage to the device. The required resistor value can be determined using the maximum capacitor voltage and the maximum continuous current for the output from the equation: R ≥ VC/IO(max). For any given RC combination, the discharge time can be determined using the discharge plot provided in the Application Timing Diagram and the equation τ = R × C. For example, to discharge a capacitor to 10% of the starting value, it takes approximately 2.303 × τ = 2.303 × R × C seconds.
8.2 Typical Application
R C VC Figure 8-1. Typical Application Block Diagram www.ti.com SN74AHCT7541-Q1 SLVSKE9 – DECEMBER 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 13 Product Folder Links: SN74AHCT7541-Q1
8.2.1 Design Requirements
8.2.1.1 Power Considerations
Ensure that the desired supply voltage is within the range specified in the Electrical Characteristics. The supply voltage sets the device electrical characteristics of the device, as described in the Electrical Characteristics section. The positive voltage supply must be capable of sourcing current equal to the maximum static supply current, I CC, listed in the Electrical Characteristics, and any transient current required for switching. The ground must be capable of sinking current equal to the total current to be sunk by all outputs of the SN74AHCT7541-Q1 plus the maximum supply current, I CC, listed in the Electrical Characteristics , and any transient current required for switching. The logic device can only sink as much current that can be sunk into its ground connection. Ensure the maximum total current through GND listed in the Absolute Maximum Ratings is not exceeded. The SN74AHCT7541-Q1 can drive a load with a total capacitance less than or equal to 50pF while still meeting all of the data sheet specifications. Larger capacitive loads can be applied; however, it is not recommended to exceed 50pF. The SN74AHCT7541-Q1 can drive a load with total resistance described by R L ≥ VO / IO, with the output voltage and current defined in the Electrical Characteristics table with VOL. When outputting in the HIGH state, the output voltage in the equation is defined as the difference between the measured output voltage and the supply voltage at the VCC pin. Total power consumption can be calculated using the information provided in the CMOS Power Consumption and Cpd Calculation application note. Thermal increase can be calculated using the information provided in the Thermal Characteristics of Standard Linear and Logic (SLL) Packages and Devices application note. CAUTION The maximum junction temperature, TJ(max) listed in the Absolute Maximum Ratings, is an additional limitation to prevent damage to the device. Do not violate any values listed in the Absolute Maximum Ratings. These limits are provided to prevent damage to the device.
8.2.1.2 Input Considerations
Input signals must cross VIL(max) to be considered a logic LOW, and VIH(min) to be considered a logic HIGH. Do not exceed the maximum input voltage range found in the Absolute Maximum Ratings. Unused inputs must be terminated to either V CC or ground. The unused inputs can be directly terminated if the input is completely unused, or they can be connected with a pull-up or pull-down resistor if the input will be used sometimes, but not always. A pull-up resistor is used for a default state of HIGH, and a pull-down resistor is used for a default state of LOW. The drive current of the controller, leakage current into the SN74AHCT7541-Q1 (as specified in the Electrical Characteristics), and the desired input transition rate limits the resistor size. A 10k Ω resistor value is often used due to these factors. The SN74AHCT7541-Q1 has CMOS inputs and thus requires fast input transitions to operate correctly, as defined in the Electrical Characteristics table. Slow input transitions can cause oscillations, additional power consumption, and reduction in device reliability. Refer to the Feature Description for additional information regarding the inputs for this device.
8.2.1.3 Output Considerations
The ground voltage is used to produce the output LOW voltage. Sinking current into the output will increase the output voltage as specified by the VOL specification in the Electrical Characteristics. Open-drain outputs can be connected together directly to produce a wired-AND configuration or for additional output drive strength. SN74AHCT7541-Q1 SLVSKE9 – DECEMBER 2025 www.ti.com
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Unused outputs can be left floating. Do not connect outputs directly to VCC or ground. Refer to the Feature Description section for additional information regarding the outputs for this device. www.ti.com SN74AHCT7541-Q1 SLVSKE9 – DECEMBER 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 15 Product Folder Links: SN74AHCT7541-Q1
8.2.2 Detailed Design Procedure
- Add a decoupling capacitor from VCC to GND. The capacitor needs to be placed physically close to the device and electrically close to both the VCC and GND pins. An example layout is shown in the Layout section. 2. Verify that the capacitive load at the output is ≤ 50pF. This is not a hard limit; by design, however, it will optimize performance. This can be accomplished by providing short, appropriately sized traces from the SN74AHCT7541-Q1 to one or more of the receiving devices. 3. Verify that the resistive load at the output is larger than (VCC / IO(max))Ω. Doing this prevents the maximum output current from the Absolute Maximum Ratings from being violated. Most CMOS inputs have a resistive load measured in MΩ; much larger than the minimum calculated previously. 4. Thermal issues are rarely a concern for logic gates; the power consumption and thermal increase, however, can be calculated using the steps provided in the CMOS Power Consumption and Cpd Calculation application note. SN74AHCT7541-Q1 SLVSKE9 – DECEMBER 2025 www.ti.com
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8.3 Power Supply Recommendations
The power supply can be any voltage between the minimum and maximum supply voltage rating located in the Recommended Operating Conditions. Each VCC terminal should have a good bypass capacitor to prevent power disturbance. A 0.1 μF capacitor is recommended for this device. It is acceptable to parallel multiple bypass capacitors to reject different frequencies of noise. The 0.1 μF and 1μF capacitors are commonly used in parallel. The bypass capacitor should be installed as close to the power terminal as possible for best results.
8.4 Layout
8.4.1 Layout Guidelines
- Bypass capacitor placement – Place near the positive supply terminal of the device – Provide an electrically short ground return path – Use wide traces to minimize impedance – Keep the device, capacitors, and traces on the same side of the board whenever possible
- Signal trace geometry – 8mil to 12mil trace width – Lengths less than 12cm to minimize transmission line effects – Avoid 90° corners for signal traces – Use an unbroken ground plane below signal traces – Flood fill areas around signal traces with ground – Parallel traces must be separated by at least 3x dielectric thickness – For traces longer than 12cm
- Use impedance controlled traces
- Source-terminate using a series damping resistor near the output
- Avoid branches; buffer each signal that must branch separately
8.4.2 Layout Example
≥ W W W ≥ 5W WORST BETTER BEST Figure 8-2. Example Trace Corners for Improved Signal Integrity www.ti.com SN74AHCT7541-Q1 SLVSKE9 – DECEMBER 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 17 Product Folder Links: SN74AHCT7541-Q1
0.1 F Figure 8-3. Example Bypass Capacitor Placement for TSSOP and Similar Packages 0.1 F VCC GND 1 20 10 11 9 12 GNDVCC GND Figure 8-4. Example Bypass Capacitor Placement for WQFN and Similar Packages GND GND VCC 0.1 F VCC Figure 8-5. Example Bypass Capacitor Placement for SOT, SC70 and Similar Packages Long controlled-impedance trace Receiving PortTransmitting Port Figure 8-6. Example Damping Resistor Placement for Improved Signal Integrity SN74AHCT7541-Q1 SLVSKE9 – DECEMBER 2025 www.ti.com
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9 Device and Documentation Support
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed below.
9.1 Documentation Support
9.1.1 Related Documentation
For related documentation, see the following:
- Texas Instruments, CMOS Power Consumption and Cpd Calculation application note
- Texas Instruments, Designing With Logic application note
- Texas Instruments, Thermal Characteristics of Standard Linear and Logic (SLL) Packages and Devices application note
9.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Notifications to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.
9.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
9.4 Trademarks
TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners.
9.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
9.6 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions. NOTE: Page numbers for previous revisions may differ from page numbers in the current version. DATE REVISION NOTES December 2025 * Initial Release www.ti.com SN74AHCT7541-Q1 SLVSKE9 – DECEMBER 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 19 Product Folder Links: SN74AHCT7541-Q1
11 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. SN74AHCT7541-Q1 SLVSKE9 – DECEMBER 2025 www.ti.com
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www.ti.com 17-Dec-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) CAHCT7541QDGSRQ1 Active Production VSSOP (DGS) | 20 5000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM - B7541Q CAHCT7541QWRKSRQ1 Active Production VQFN (RKS) | 20 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM - HB7541Q SN74AHCT7541QPWRQ1 Active Production TSSOP (PW) | 20 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM - HB7541Q (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 18-Dec-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 18-Dec-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CAHCT7541QDGSRQ1 VSSOP DGS 20 5000 353.0 353.0 32.0 CAHCT7541QWRKSRQ1 VQFN RKS 20 3000 210.0 185.0 35.0 SN74AHCT7541QPWRQ1 TSSOP PW 20 3000 353.0 353.0 32.0 Pack Materials-Page 2
www.ti.com GENERIC PACKAGE VIEW This image is a representation of the package family, actual package may vary. Refer to the product data sheet for package details. VQFN - 1 mm max heightRKS 20 PLASTIC QUAD FLATPACK - NO LEAD2.5 x 4.5, 0.5 mm pitch 4226872/A
www.ti.com PACKAGE OUTLINE C 18X 0.65 5.85 20X 0.30 0.19 TYP6.6 6.2
1.2 MAX
0.15 0.05 0.25 GAGE PLANE -80 B NOTE 4 4.5 4.3 A NOTE 3 6.6 6.4 0.75 0.50 (0.15) TYP TSSOP - 1.2 mm max heightPW0020A SMALL OUTLINE PACKAGE 4220206/A 02/2017
0.1 C A B
0.1 C NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-153. SEATING PLANE A 20 DETAIL A TYPICAL SCALE 2.500
www.ti.com EXAMPLE BOARD LAYOUT
0.05 MAX
0.05 MIN
20X (1.5) 20X (0.45) 18X (0.65) (5.8) (R0.05) TYP TSSOP - 1.2 mm max heightPW0020A SMALL OUTLINE PACKAGE 4220206/A 02/2017 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X SYMM SYMM 10 11 15.000 METALSOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK OPENING EXPOSED METALEXPOSED METAL SOLDER MASK DETAILS NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED
www.ti.com EXAMPLE STENCIL DESIGN 20X (1.5) 20X (0.45) 18X (0.65) (5.8) (R0.05) TYP TSSOP - 1.2 mm max heightPW0020A SMALL OUTLINE PACKAGE 4220206/A 02/2017 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 10X SYMM SYMM 10 11
www.ti.com PACKAGE OUTLINE C 18X 0.5 2X 4.5 20X 0.275 0.165 5.1
4.7 TYP
0.15 0.05 0.25 GAGE PLANE 0 -8 4X (0 -15 ) 4X (7 -15 )
1.1 MAX
B 3.1 2.9 A 5.2 5.0 NOTE 3 0.7 0.4 (0.15) TYP VSSOP - 1.1 mm max heightDGS0020A SMALL OUTLINE PACKAGE 4226367/A 10/2020 10 11 0.1 C NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. No JEDEC registration as of September 2020. 5. Features may differ or may not be present. SEATING PLANE PowerPAD is a trademark of Texas Instruments. A 20 DETAIL A TYPICAL
www.ti.com EXAMPLE BOARD LAYOUT 20X (1.45) 20X (0.3) 18X (0.5) (4.4) (R0.05) TYP VSSOP - 1.1 mm max heightDGS0020A SMALL OUTLINE PACKAGE 4226367/A 10/2020 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. 8. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature 9. Size of metal pad may vary due to creepage requirement. 10. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged or tented. LAND PATTERN EXAMPLE SCALE: 16X SYMM SYMM 10 11 15.000 METALSOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK OPENING EXPOSED METALEXPOSED METAL SOLDER MASK DETAILS NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED
www.ti.com EXAMPLE STENCIL DESIGN (18X 0.5) 20X (1.45) 20X (0.3) (4.4) (R0.05) TYP VSSOP - 1.1 mm max heightDGS0020A SMALL OUTLINE PACKAGE 4226367/A 10/2020 NOTES: (continued) 11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 12. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 16X SYMM SYMM 10 11
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