SN74AHCT244-EP TI1 | Alldatasheet
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SCLS493A – MAY 2003 – REVISED JUNE 2003 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 /C0068 Controlled Baseline – One Assembly/Test Site, One Fabrication Site /C0068 Extended Temperature Performance of –55°C to 125°C /C0068 Enhanced Diminishing Manufacturing Sources (DMS) Support /C0068 Enhanced Product-Change Notification /C0068 Qualification Pedigree† /C0068 EPIC (Enhanced-Performance Implanted CMOS) Process /C0068 Inputs Are TTL-Voltage Compatible /C0068 Latch-Up Performance Exceeds 250 mA Per JESD 17 /C0068 ESD Protection Exceeds 1000 V Per MIL-STD-833, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0) † Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits. description/ordering information This octal buffer/driver is designed specifically to improve both the performance and density of 3-state memory-address drivers, clock drivers, and bus-oriented receivers and transmitters. The SN74AHCT244 is organized as two 4-bit buffers/line drivers with separate output-enable (OE) inputs. When OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
TA PACKAGE ‡ ORDERABLE PART NUMBER TOP-SIDE MARKING 55°Ct o1 2 5°C SOIC – D Tape and reel SN74AHCT244MDWREP AHCT244MEP –55°C to 125°C TSSOP – PW Tape and reel SN74AHCT244MPWREP AHT244EP ‡ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Copyright 2003, Texas Instruments IncorporatedPRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. EPIC is a trademark of Texas Instruments. 1OE 1A1 2Y4 1A2 2Y3 1A3 2Y2 1A4 2Y1 GND V CC 2OE 1Y1 2A4 1Y2 2A3 1Y3 2A2 1Y4 2A1 DW OR PW PACKAGE (TOP VIEW)
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(each 4-bit buffer/driver) INPUTS OUTPUT OE A Y L H H L LL H X Z logic symbol† 1A1 1A2 1A3 1A4 EN 1Y1 1Y2 1Y3 1Y4 2A1 2A2 2A3 2A4 EN 2Y1 2Y2 2Y3 2Y4 1OE 2OE † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. logic diagram (positive logic) 21 8 1Y1 1OE 1A1 41 6 1Y21A2 61 4 1Y31A3 81 2 1Y41A4 11 9 2Y1 2OE 2A1 13 7 2Y22A2 15 5 2Y32A3 17 3 2Y42A4
SCLS493A – MAY 2003 – REVISED JUNE 2003 3POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7 recommended operating conditions (see Note 3) MIN MAX UNIT VCC Supply voltage 4.5 5.5 V VIH High-level input voltage 2 V VIL Low-level input voltage 0.8 V VI Input voltage 0 5.5 V VO Output voltage 0 VCC V IOH High-level output current –8 mA IOL Low-level output current 8 mA TA Operating free-air temperature –55 125 °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC TA = 25°C MIN MAX UNITPARAMETER TEST CONDITIONS VCC MIN TYP MAX MIN MAX UNIT VOH IOH = –50 /C0109 A 45V 4.4 4.5 4.4 VVOH IOH = –8 mA 4.5 V 3.94 3.8 V VOL IOL = 50 /C0109 A 45V 0.1 0.1 VVOL IOL = 8 mA 4.5 V 0.36 0.44 V IOZ VO = VCC or GND 5.5 V ±0.25 ±2.5 /C0109 A II VI = 5.5 V or GND 0 V to 5.5 V ±0.1 ±1 /C0109 A ICC VI = VCC or GND, IO = 0 5.5 V 4 40 /C0109 A ∆ICC ‡ One input at 3.4 V, Other inputs at VCC or GND 5.5 V 1.35 1.5 mA C i VI = VCC or GND 5 V 2.5 10 pF C o VO = VCC or GND 5 V 3 pF ‡ This is the increase in supply current for each input at one of the specified TTL voltage levels rather than 0 V or VCC .
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switching characteristics over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1) PARAMETER FROM TO LOAD TA = 25°C MIN MAX UNITPARAMETER (INPUT) (OUTPUT) CAPACITANCE MIN TYP MAX MIN MAX UNIT tPLH A Y C L =1 5pF 5.4 7.4 1 8.5 nstPHL A Y C L = 15 pF 5.4 7.4 1 8.5 ns tPZH OE Y C L =1 5pF 7.7 10.4 1 12 ns tPZL OE Y C L = 15 pF 7.7 10.4 1 12 ns tPHZ OE Y C L =1 5pF 5 9.4 1 10 ns tPLZ OE Y C L = 15 pF 5 9.4 1 10 ns tPLH A Y C L =5 0pF 5.9 8.4 1 9.5 ns tPHL A Y C L = 50 pF 5.9 8.4 1 9.5 ns tPZH OE Y C L =5 0pF 8.2 11.4 1 13 ns tPZL OE Y C L = 50 pF 8.2 11.4 1 13 ns tPHZ OE Y C L =5 0pF 8.8 11.4 1 13 ns tPLZ OE Y C L = 50 pF 8.8 11.4 1 13 ns tsk(o) C L = 50 pF 1 ns noise characteristics, VCC = 5 V, CL = 50 pF, TA = 25°C (see Note 4) PARAMETER MIN TYP MAX UNIT VOH(V) Quiet output, minimum dynamic VOH 4.1 V VIH(D) High-level dynamic input voltage 2 V VIL(D) Low-level dynamic input voltage 0.8 V NOTE 4: Characteristics are for surface-mount packages only. operating characteristics, VCC = 5 V, TA = 25°C PARAMETER TEST CONDITIONS TYP UNIT C pd Power dissipation capacitance No load, f = 1 MHz 8.2 pF
NOTES: A. C L includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω , tr ≤ 3 ns, tf ≤ 3 ns. D. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms
Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) CAHCT244MPWREPG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT244MDWREP ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT244MPWREP ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM V62/03657-01XE ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM V62/03657-01YE ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN74AHCT244-EP :
- Catalog:SN74AHCT244
- Automotive:SN74AHCT244-Q1
- Military:SN54AHCT244 NOTE: Qualified Version Definitions:
- Catalog - TI's standard catalog product
- Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
- Military - QML certified for Military and Defense Applications PACKAGE OPTION ADDENDUM www.ti.com 18-Jan-2010 Addendum-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74AHCT244MDWREP SOIC DW 20 2000 367.0 367.0 45.0 SN74AHCT244MPWREP TSSOP PW 20 2000 367.0 367.0 38.0 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 Pack Materials-Page 2
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