SN74AHCT1G04-Q1 TI | Alldatasheet
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Technical content
SN74AHCT1G04-Q1 Automotive Single 4.5V To 5.5V Inverter With TTL-compatible CMOS Inputs
1 Features
- Qualified for automotive applications
- ESD protection exceeds 1500V per MIL-STD-883, method 3015
- Operating range of 4.5V to 5.5V
- Max tpd of 7.5ns at 5V
- Low power consumption, 10µA max ICC
- 8mA output drive at 5V
- Inputs are TTL-voltage compatible
2 Applications
- Hybrid, Electric, and Powertrain Systems
- Advanced Driver Assistance Systems (ADAS)
- Body Electronics and Lighting
- Infotainment and Cluster
3 Description
The SN74AHCT1G04-Q1 contains one gate. The device performs the Boolean function Y = A.
Package Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2) BODY SIZE(3) SN74AHCT1G04-Q1 DCK (SOT-SC70, 5) 2 mm × 1.25 mm 2 mm × 1.25 mm DTX (X2SON, 5) 1.1mm x 0.85mm 1.1mm x 0.85mm (1) For more information, see Mechanical, Packaging, and Orderable Information. (2) The package size (length × width) is a nominal value and includes pins, where applicable. (3) The body size (length × width) is a nominal value and does not include pins. Simplified Schematic SN74AHCT1G04-Q1 SCLS510D – JUNE 2003 – REVISED OCTOBER 2024 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
10 Mechanical, Packaging, and Orderable
SCLS510D – JUNE 2003 – REVISED OCTOBER 2024 www.ti.com
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4 Pin Configuration and Functions
Figure 4-1. DBV Package, 5-Pin SOT-23; DCK Package (Top View) 1NC GND 4 Y
5 VCC
NC − No internal connection Figure 4-2. DTX Package, 5-Pin X2SON (Top View) Table 4-1. Pin Functions PIN TYPE DESCRIPTION NO. NAME
1 NC — No Connection
2 A I Input A
3 GND — Ground Pin
4 Y O Output Y
5 VCC — Power Pin
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5 Specifications
5.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT VCC Supply voltage –0.5 7 V VI Input voltage range(2) –0.5 7 V VO Output voltage range –0.5 VCC + 0.5 V IIK Input clamp current VI < 0 –20 mA IOK Output clamp current VO < 0 or VO > VCC . ±20 mA IO Continuous output current VO = 0 to VCC ±25 mA Continuous current through VCC or GND ±50 mA Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Section 5.3 is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
5.2 ESD Ratings
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±1500 V (1) AEC Q100-002 indicates that HBM stressing must be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
5.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT VCC Supply voltage 4.5 5.5 V VIH High-level input voltage 2 V VIL Low-level Input voltage 0.8 V VI Input voltage 0 5.5 V VO Output voltage 0 VCC V IOH High-level output current –8 mA IOL Low-level output current 8 mA Δt/Δv Input Transition rise or fall rate 20 ns/V TA Operating free-air temperature –40 125 °C (1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs.
5.4 Thermal Information
THERMAL METRIC(1) DCK (SOT- SC70) DTX (X2SON) UNIT
5 PINS 5 PINS
RθJA Junction-to-ambient thermal resistance 293.4 184.7 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. SN74AHCT1G04-Q1 SCLS510D – JUNE 2003 – REVISED OCTOBER 2024 www.ti.com
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5.5 Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC TA = 25°C –40°C to +125°C UNIT MIN TYP MAX MIN MAX VOH IOH = –50 µA 4.5 V 4.4 4.5 4.4 V IOH = −8 mA 4.5 V 3.94 3.8 VOL IOL = 50 µA 4.5 V 0.1 0.1 V IOL = 8 mA 4.5 V 0.36 0.44 II VI = 5.5 V or GND 0 V to 5.5 V ± 0.1 ±1 µA ICC VI = VCC or GND, IO = 0 5.5 V 1 10 µA ∆ICC 1 One input at 3.4 V, Other inputs at VCC or GND 5.5 V 1.35 1.5 mA Ci VI = VCC or GND 5 V 4 10 10 pF
5.6 Switching Characteristics
over recommended operating free-air temperature rangee, VCC = 5 V ± 0.5 V (unless otherwise noted) (see load circuit and voltage wave forms) PARAMETER FROM (INPUT) TO (OUTPUT) TEST CONDITIONS TA = 25°C MIN MAX UNIT MIN TYP MAX tPLH A Y CL = 15 pF 4.7 6.7 1 7.5 ns tPHL A Y CL = 15 pF 4.7 6.7 1 7.5 tPLH A Y CL = 50 pF 5.5 7.7 1 8.5 ns tPHL A Y CL = 50 pF 5.5 7.7 1 8.5
5.7 Operating Characteristics
VCC = 5 V, TA = 25°C PARAMETER TEST CONDITIONS TYP UNIT Cpd Power dissipation capacitance No load, f = 1 MHz 14 pF
5.8 Typical Characteristics
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6 Parameter Measurement Information
6.1 Figure 6-1. Load Circuit and Voltage Waveforms SN74AHCT1G04-Q1 SCLS510D – JUNE 2003 – REVISED OCTOBER 2024 www.ti.com
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7 Detailed Description
7.1 Functional Block Diagram
7.2 Device Functional Modes
Table 7-1. Function Table INPUT OUTPUT A Y H L L H www.ti.com SN74AHCT1G04-Q1 SCLS510D – JUNE 2003 – REVISED OCTOBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 7 Product Folder Links: SN74AHCT1G04-Q1
8 Device and Documentation Support
8.1 Documentation Support
8.1.1 Related Documentation
The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 8-1. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY SN74AHCT1G04-Q1 Click here Click here Click here Click here Click here
8.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Notifications to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.
8.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
8.4 Trademarks
TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners.
8.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
8.6 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
9 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision C (July 2023) to Revision D (October 2024) Page
- Added DTX package to Package Information table, Pin Configuration and Functions section, and Thermal Changes from Revision B (January 2023) to Revision C (July 2023) Page SN74AHCT1G04-Q1 SCLS510D – JUNE 2003 – REVISED OCTOBER 2024 www.ti.com
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10 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. www.ti.com SN74AHCT1G04-Q1 SCLS510D – JUNE 2003 – REVISED OCTOBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 9 Product Folder Links: SN74AHCT1G04-Q1
www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) CAHCT1G04QDCKRG4Q1 Active Production SC70 (DCK) | 5 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 BCS CAHCT1G04QDCKRG4Q1.A Active Production SC70 (DCK) | 5 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 BCS CAHCT1G04QDCKRQ1 Active Production SC70 (DCK) | 5 3000 | LARGE T&R Yes NIPDAU | NIPDAU Level-1-260C-UNLIM -40 to 125 BCS CAHCT1G04QDCKRQ1.A Active Production SC70 (DCK) | 5 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 BCS (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN74AHCT1G04-Q1 : Addendum-Page 1
www.ti.com 23-May-2025
- Catalog : SN74AHCT1G04 NOTE: Qualified Version Definitions:
- Catalog - TI's standard catalog product Addendum-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 25-Sep-2024 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 25-Sep-2024 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CAHCT1G04QDCKRQ1 SC70 DCK 5 3000 190.0 190.0 30.0 Pack Materials-Page 2
www.ti.com PACKAGE OUTLINE C 0.22
0.08 TYP
0.15 2.4 1.8 2X 0.65 1.3
1.1 MAX
0.1
0.0 TYP
5X 0.33 0.15 NOTE 5
0.1 C A B
0.46
0.26 TYP
0 TYP
1.3 4X 0 -12 4X 4 -15 A 2.15 1.85 B1.4 1.1 (0.9) (0.15) (0.1) SOT - 1.1 max heightDCK0005A SMALL OUTLINE TRANSISTOR 4214834/G 11/2024 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-203. 4. Support pin may differ or may not be present. 5. Lead width does not comply with JEDEC. 6. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.25mm per side 0.1 C SCALE 5.600
www.ti.com EXAMPLE BOARD LAYOUT
0.07 MAX
0.07 MIN
5X (0.95) 5X (0.4) (2.2) (1.3) 2X (0.65) (R0.05) TYP 4214834/G 11/2024 SOT - 1.1 max heightDCK0005A SMALL OUTLINE TRANSISTOR NOTES: (continued) 7. Publication IPC-7351 may have alternate designs. 8. Solder mask tolerances between and around signal pads can vary based on board fabrication site. SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:18X PKG 3 4 SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL METALSOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS EXPOSED METAL
www.ti.com EXAMPLE STENCIL DESIGN (2.2) (1.3) 2X(0.65) 5X (0.95) 5X (0.4) (R0.05) TYP SOT - 1.1 max heightDCK0005A SMALL OUTLINE TRANSISTOR 4214834/G 11/2024 NOTES: (continued) 9. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 10. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 THICK STENCIL SCALE:18X SYMM PKG 3 4
www.ti.com PACKAGE OUTLINE C 0.9 0.8 1.15 1.05
0.4 MAX
0.05 0.00 2X 0.78 4X 0.295 0.195 4X 0.27 0.17 0.35 0.05 0.605
0.51 MIN
0.1 MIN
(0.127) TYP(0.06) TYP (0.01) TYP 4X (0.225) X2SON - 0.4 mm max heightDTX0005A PLASTIC SMALL OUTLINE - NO LEAD 4229388/C 10/2024 0.08 C NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. PIN 1 INDEX AREA SEATING PLANE PIN 1 ID SYMM SYMM 0.05 C 4X (45 X 0.106) SCALE 11.000 SCALE 55.000 SIDE WALL PIN DETAIL TYPICAL AB
www.ti.com EXAMPLE BOARD LAYOUT (R0.05) TYP
0.05 MAX
0.05 MIN
4X (0.445) 4X (0.22) (0.805) 2X (0.78) (0.35) 4X (0.225) X2SON - 0.4 mm max heightDTX0005A PLASTIC SMALL OUTLINE - NO LEAD 4229388/C 10/2024 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). SYMM SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 40X SEE SOLDER MASK DETAIL 4X (45 X 0.106) METAL EDGE SOLDER MASK OPENING EXPOSED METAL METAL UNDER SOLDER MASK SOLDER MASK OPENING EXPOSED METAL NON SOLDER MASK DEFINED SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS
www.ti.com EXAMPLE STENCIL DESIGN 4X (0.445) 4X (0.22) (0.805) (R0.05) TYP 2X (0.78) (0.335) 4X (0.233) X2SON - 0.4 mm max heightDTX0005A PLASTIC SMALL OUTLINE - NO LEAD 4229388/C 10/2024 NOTES: (continued) 5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL SCALE: 40X PRINTED SOLDER PASTE COVERAGE BY AREA UNDER PACKAGE PAD 5: 92% SYMM SYMM 4X (45 X 0.106)
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