CA10 LITTELFUSE | Alldatasheet

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Technical content

PULSEGUARD® SUPPRESSOR SURFACE MOUNT ESD SUPPRESSORS 8-Line CA10 PRODUCT OVERVIEW PulseGuard ESD Suppressors help protect sensitive elec- tronic equipment against electrostatic discharge (ESD). They supplement the on-chip protection of integrated cir- cuitry and are best suited for low-voltage, high-speed applications where low capacitance is important. Applications such as computer I/O ports (eg. video dis- plays), network hardware, cell phone data ports, point-of- sale terminals, and industrial controls will benefit from this new technology. PulseGuard suppressors use polymer composite materials to suppress fast-rising ESD transients (as specified in IEC 61000-4-2 and MIL-STD- 883E).

FEATURES

  • Ultra-low capacitance
  • Low leakage current
  • Fast response time
  • Bi-directional
  • Withstands multiple ESD strikes
  • Packaged in chip array (capacitor/resistor) format
  • Compatible with pick-and-place processes
  • Available on 2,000 piece reels (EIA-RS481) TYPICAL APPLICATIONS
  • Computer I/O ports (e.g. video displays)
  • Computer peripherals
  • Network hardware/ports (e.g. Gigabit Ethernet)
  • Point-of-Sale terminals
  • Cell phone data ports
  • Audio/video components
  • Test Equipment
  • Medical Equipment

ELECTRICAL CHARACTERISTICS

Notes: 1. 8 kV direct discharge method, per IEC 61000-4-2. 2. Measured at 1 MHz. 3. Measured at 6 VDC. Testing at fast ESD pulse rates (1-20Hz) may cause a change in leakage current performance (6µA, max). PHYSICAL SPECIFICATIONS Materials: Body: Glass Epoxy Terminations: Tin-Lead Soldering Parameters: Wave solder -- 260oC, 10 seconds maximum Reflow solder -- 260oC, 30 seconds maximum Operating Temperature Range: -65oC to +125oC

ORDERING INFORMATION

Catalog Number Pieces per Reel PGB008CA10PR 2,000 DESIGN CONSIDERATION Because of the fast rise-time of the ESD transient, place- ment of PulseGuard suppressors is a key design consider- ation. To achieve optimal ESD suppression, the devices should be placed on the circuit board as close to the source of the ESD transient as possible. Install PulseGuard suppressors directly behind the connector so that they are the first board-level circuit component encountered by the ESD transient. They are connected from signal/data line to ground. Trigger Voltage1 Clamping Voltage1 Rated Voltage Capacitance2 Response Time1 Leakage Current3 ESD Pulse Withstand1 1,000V, typical 150V, typical 24VDC, max 0.055pF <1ns <1nA 1,000 pulses, minimum

PULSEGUARD® SUPPRESSOR SURFACE MOUNT ESD SUPPRESSORS 8-Line CA10 DEFINITIONS Trigger Voltage: The measured peak voltage across the ESD suppressor before it transitions from high to low resistance. It is manifested as a “spike” before the clamping voltage is achieved. This voltage is typically well below the damage threshold of on-chip IC protection. Clamping Voltage: The voltage level to which the ESD impulse voltage is reduced. This is the voltage that the sup- pressor holds at, until the ESD transient energy is dissipat- ed. ESD Impulse Voltage: Also known as the ESD Threat Voltage. This is the voltage that is “zapped” into the circuit. Voltages generated by people can exceed 15 kV. The IEC 61000-4-2 defines four levels of impulse voltage for testing purposes: SEVERITY LEVEL AIR DISCHARGE 2 kV 4 kV 8 kV 15 kV DIRECT DISCHARGE 2 kV 4 kV 6 kV 8 kV ++++ +++ Tw Ds Ph Dd Ps Pw Pd Ct Tt Carrier Tape Specifications Parts are delivered on 7” (178mm) reel, plastic carrier tape

Description

Tt - Carrier tape thickness Tw - Carrier tape width Measurement (mm) 0.06 1.50 4.00 1.02 5.38 4.00 2.44 0.30 12.00 Trigger Voltage Clamping Voltage Time (ns) Voltage (V) Trigger Voltage Clamping Voltage Voltage (V) Current (A) ** Note: 1,000 fF = 1 pF Frequency (GHz) Capacitance (fF) 1.0 2.01.50.5 Generalized PulseGuard Response to ESD (Positive and Negative Polarity ESD Pulses) Generalized I-V Curve (Positive and Negative Polarity ESD Pulses) Capacitance vs. Frequency

PULSEGUARD® SUPPRESSOR SURFACE MOUNT ESD SUPPRESSORS 8-Line CA10 a 0.036 0.025 b 0.060 0.050 c 0.119 0.101 d 0.047 0.051 e 0.043 0.043 f 0.030 0.030 g 0.198 0.191 Solder Method Wave Solder Reflow Solder Pad Dimensions (in.) Note: Pins 5 and 10 (Common) are typ- ically connected to chassis ground. However since PulseGuard suppres- sors are bi-directional, the system volt- age bus can also be used as the ESD “dump”. Device under test Tek P6156 Probe (Voltage measurement) Faraday cage KeyTek pulser Brown tip (x100) 2,000- 15,000 V x10 Tektronic TDS 684B Ground return x10 Blue tip (x10) .5 ohm shunt (10-5 ohms in parallel) Tek P6156 Probe (Current measurement) 0.043" a 0.083" 0.007 0.198" 0.008 b *Dimension 'a' is: 0.026" *Dimension 'b' is: 0.015" a b f c g e d Test Set-up for IEC 61000-4-2 Waveform, 2kV-15kV Recommended Pad Layout: Device Dimensions: Equivalent Circuit: Reference Schematics: