STC6NF30V_07 STMICROELECTRONICS | Alldatasheet

Document overview

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  • PDF pages: 13

Technical content

Datasheet sections

  • 1 Electrical ratings
  • 2 Electrical characteristics
  • 2.1 Electrical characteristics (curves)
  • 3 Test circuit
  • 4 Package mechanical data
  • 5 Revision history

N-channel 30V - 0.020Ω - 6A - TSSOP8 2.5V-drive STripFET™ II Power MOSFET General features ■ Ultra low threshold gate drive (2.5V) ■ Standard outline for easy automated surface mount assembly ■ Double dice in common drain configuration

Description

This Power MOSFET is the latest development of STMicroelectronics unique "Single Feature Size™" strip-based process. The resulting transistor shows extremely high packing density for low on-resistance.

Applications

■ Switching application Internal schematic diagram Type V DSS RDS(on) ID STC6NF30V 30V < 0.025 Ω (@ 4.5 V) TSSOP8 Order code Part number Marking Package Packaging STC6NF30V C6NF30V TSSOP8 Tape & reel

1 Electrical ratings

Table 1. Absolute maximum ratings

  1. Pulse width limited by safe operating area

Table 2. Thermal data

  1. When Mounted on FR-4 board with 1 inch 2 pad, 2 oz. of Cu. and t = 10 sec.
  2. When Mounted on minimum recommended footprint

2 Electrical characteristics

Table 3. On/off states Table 4. Dynamic

  1. Pulsed: pulse duration=300µs, duty cycle 1.5%

Table 5. Switching times

Table 6. Source drain diode

  1. Pulse width limited by safe operating area
  2. Pulsed: pulse duration=300µs, duty cycle 1.5%

2.1 Electrical characterist ics (curves)

Figure 1. Safe operating area Figure 2. Thermal impedance Figure 3. Output characteristics Figure 4. Transfer characteristics Figure 5. Transconductance Figure 6. Static drain-source on resistance

Figure 13. Thermal resistance and max power

3 Test circuit

Figure 14. Switching times test circuit for Figure 15. Gate charge test circuit Figure 16. Test circuit for inductive load

4 Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com

5 Revision history

Table 7. Revision history