STC5NF20V_07 STMICROELECTRONICS | Alldatasheet

Document overview

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Technical content

Datasheet sections

  • 1 Electrical ratings
  • 2 Electrical characteristics
  • 2.1 Electrical characteristics (curves)
  • 3 Test circuit
  • 4 Package mechanical data
  • 5 Revision history

N-channel 20V - 0.030Ω - 5A - TSSOP8 2.7V-drive STripFET™ II Power MOSFET General features ■ Ultra low threshold gate drive (2.7V) ■ Standard outline for easy automated surface mount assembly

Description

This Power MOSFET is the latest development of STMicroelectronics unique "Single Feature Size™" strip-based process. The resulting transistor shows extremely high packing density for low on-resistance, rugged avalanche characteristics and less critical alignment steps therefore a remarkable manufacturing reproducibility.

Applications

■ Switching application Internal schematic diagram Type V DSS RDS(on) ID STC5NF20V 20V < 0.040 Ω (@ 4.5 V) TSSOP8 Order codes Part number Marking Package Packaging STC5NF20V C5NF20V TSSOP8 Tape & reel

1 Electrical ratings

Table 1. Absolute maximum ratings

  1. Pulse width limited by safe operating area

Table 2. Thermal data

  1. When Mounted on FR-4 board with 1 inch 2 pad, 2 oz. of Cu. and t = 10 sec.
  2. When Mounted on minimum recommended footprint

2 Electrical characteristics

Table 3. On/off states Table 4. Dynamic

  1. Pulsed: pulse duration=300µs, duty cycle 1.5%

Table 5. Switching times

Table 6. Source drain diode

  1. Pulse width limited by safe operating area
  2. Pulsed: pulse duration=300µs, duty cycle 1.5%

2.1 Electrical characterist ics (curves)

Figure 1. Safe operating area Figure 2. Thermal impedance Figure 3. Output characteristics Figure 4. Transfer characteristics Figure 5. Transconductance Figure 6. Static drain-source on resistance

3 Test circuit

Figure 13. Switching times test circuit for Figure 14. Gate charge test circuit Figure 15. Test circuit for inductive load Figure 16. Unclamped Inductive load test Figure 17. Unclamped inductive waveform

4 Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com

5 Revision history

Table 7. Revision history 01-Feb-2007 5 Typo mistake on Table 1.