C4520X7R3A471K

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Technical content

Type: C4520 [EIA CC1808] C4532 [EIA CC1812] Issue date: January 2011 TDK MLCC US Catalog Version A11

Please read before using this product SAFETY REMINDERS REMINDERS 1. If you intend to use a product listed in this catalog for a purpose that may cause loss of life or other damage, you must contact our company’s sales window. 2. We may modify products or discontinue production of a product listed in this catalog without prior notification. 3. We provide “Delivery Specification” that explain precautions for the specifications and safety of each product listed in this catalog. We strongly recommend that you exchange these delivery specifications with customers that use one of these products. 4. If you plan to export a product listed in this catalog, keep in mind that it may be a restricted item according to the “Foreign Exchange and Foreign Trade Control Law”. In such cases, it is necessary to acquire export permission in harmony with this law. 5. Any reproduction or transferring of the contents of this catalog is prohibited without prior permission from our company. 6. We are not responsible for problems that occur related to the intellectual property rights or other rights of our company or a third party when you use a product listed in this catalog. We do not grant license of these rights. 7. This catalog only applies to products purchased through our company or one of our company’s official agencies. This catalog does not apply to products that are purchased through other third parties.

• Advanced design provides improved withstand voltage characteristics.
• TDK’s proprietary internal electrode structure and the use of low-dielectric-strength material result in highly reliable performance in high-voltage applications.
• Complies with ISO8802-3 for LAN applications.
• Designed exclusively for reflow soldering. Applications • Inverter circuits with a liquid crystal backlight
• L A N c a r d
• General high voltage circuits.
• Noise bypass for power supply
• Transceiver for LAN
• H u b , e t c .

Features

Shape & Dimensions Cautions

• This product intended solely for reflow soldering.
• A slit of about 1mm on the circuit board is recommended to improve removal of the flux after soldering.
• Ensure that this product is completely dried following washing.
• Because this product w ill be subjected to high voltages, use only low-activity rosin flux (with 0.2% max. of chlorine).
• Using this product with aluminum circuit boards must be considered a special implementation because the high heat stress levels are involved. In case of using aluminum circuit boards, please contact TDK. Dimensions in mm Part Number Construction C Series High Voltage Application Type: C4520, C4532 Series Name C 4532 X7R 3D 222 K T XXXX Dimensions L x W (mm) Temperature Characteristic Rated Voltage (DC) Nominal Capacitance (pF) Capacitance Tolerance Packaging Style Internal Codes The capacitance is expressed in three digit codes and in units of pico Farads (pF). The first and second digits identify the first and second significant figures of the capacitance. The third digit identifies the multiplier. R designates a decimal point. Capacitance Code Capacitance 0R5 0.5pF 010 1pF 102 1,000pF (1nF) 105 1,000,000pF (1 μF) Case Code Length Width C4520 4.50 ± 0.40 2.00 ± 0.30 C4532 4.50 ± 0.40 3.20 ± 0.40 Temperature Characteristics Capacitance Change Temperature Range C0G 0±30 ppm/ºC -55 to +125ºC X7R ±15% -55 to +125ºC US Catalog // C Series — High Voltage Application // Version A11 L Body Length W Body Width TB o d y H e i g h t B Terminal Width Voltage Code Voltage(DC) 3A 1,000V 3D 2,000V 3F 3,000V Packaging Code Style T Tape and Reel Tolerance Code Tolerance F ± 1pF K ± 10%
• All specifications are subject to change without notice. Please read the precautions before using the product.

Temperature Characteristics: C0G (0 ± 30ppm/ºC), X7R (± 15%) Rated Voltage: 3,000 (3F), 2,000V (3D), 1,000V (3A) Standard Thickness C4520 [EIA CC1808] US Catalog // High Voltage C4520 Series // Version A11 1.30 ± 0.20 mm 1.60 ± 0.20 mm 2.00 ± 0.20 mm Capacitance Range Table Class 1 (Temperature Compensating) Temperature Characteristics: C0G (0 ± 30 ppm/ºC) Class 2 (Temperature Stable) Temperature Characteristics: X7R (± 15%) TDK Part Number (Ordering Code) Temperature Characteristics Rated Voltage Capacitance (pF) Capacitance Tolerance Thickness (mm) C4520X7R3A471K X7R 1000V 470 ± 10% 1.30 ± 0.20 C4520X7R3A102K X7R 1000V 1,000 ± 10% 1.30 ± 0.20 C4520X7R3D471K X7R 2000V 470 ± 10% 1.30 ± 0.20 C4520X7R3D102K X7R 2000V 1,000 ± 10% 1.30 ± 0.20 TDK Part Number (Ordering Code) Temperature Characteristics Rated Voltage Capacitance (pF) Capacitance Tolerance Thickness (mm) C4520C0G3F100F C0G 3000V 10 ± 1 pF 0.85 ± 0.15 C4520C0G3F120K C0G 3000V 12 ± 10% 0.85 ± 0.15 C4520C0G3F150K C0G 3000V 15 ± 10% 1.10 ± 0.20 C4520C0G3F180K C0G 3000V 18 ± 10% 1.10 ± 0.20 C4520C0G3F220K C0G 3000V 22 ± 10% 1.10 ± 0.20 C4520C0G3F270K C0G 3000V 27 ± 10% 1.60 ± 0.20 C4520C0G3F330K C0G 3000V 33 ± 10% 1.60 ± 0.20 C4520C0G3F390K C0G 3000V 39 ± 10% 1.60 ± 0.20 C4520C0G3F470K C0G 3000V 47 ± 10% 1.60 ± 0.20 C4520C0G3F560K C0G 3000V 56 ± 10% 2.00 ± 0.20 C4520C0G3F680K C0G 3000V 68 ± 10% 2.00 ± 0.20 C4520C0G3F820K C0G 3000V 82 ± 10% 2.00 ± 0.20 C4520C0G3F101K C0G 3000V 100 ± 10% 2.00 ± 0.20 1.10 ± 0.20 mm 0.85 ± 0.15 mm C0G (3,000V) (2,000V) (1,000V) 10 100 F: ± 1 pF 12 120 15 150 18 180 22 220 27 270 33 330 39 390 47 470 56 560 68 680 82 820 100 101 470 471 1,000 102 X7R K: ± 10% Capacitance (pF) Cap Code Tolerance

• All specifications are subject to change without notice. Please read the precautions before using the product.

Temperature Characteristics: C0G (0 ± 30ppm/ºC), X7R (± 15%) Rated Voltage: 3,000 (3F), 2,000V (3D), 1,000V (3A) C4532 [EIA CC1812] US Catalog // High Voltage C4532 Series // Version A11 1.30 ± 0.20 mm 1.60 ± 0.20 mm 2.00 ± 0.20 mm 2.30 ± 0.20 mm 2.50 ± 0.30 mm Capacitance Range Table Class 1 (Temperature Compensating) Temperature Characteristics: C0G (0 ± 30 ppm/ºC) Class 2 (Temperature Stable) Temperature Characteristics: X7R (± 15%) TDK Part Number (Ordering Code) Temperature Characteristics Rated Voltage Capacitance (pF) Capacitance Tolerance Thickness (mm) C4532C0G3F101K C0G 3000V 100 ± 10% 1.60 ± 0.20 C4532C0G3F121K C0G 3000V 120 ± 10% 1.60 ± 0.20 C4532C0G3F151K C0G 3000V 150 ± 10% 1.60 ± 0.20 C4532C0G3F181K C0G 3000V 180 ± 10% 1.60 ± 0.20 C4532C0G3F221K C0G 3000V 220 ± 10% 2.00 ± 0.20 C4532C0G3F271K C0G 3000V 270 ± 10% 2.30 ± 0.20 C4532C0G3F331K C0G 3000V 330 ± 10% 2.50 ± 0.30 TDK Part Number (Ordering Code) Temperature Characteristics Rated Voltage Capacitance (pF) Capacitance Tolerance Thickness (mm) C4532X7R3A472K X7R 1000V 4,700 ± 10% 1.60 ± 0.20 C4532X7R3A103K X7R 1000V 10,000 ± 10% 2.00 ± 0.20 C4532X7R3D222K X7R 2000V 2,200 ± 10% 1.30 ± 0.20 Standard Thickness C0G (3,000V) (2,000V) (1,000V) 100 101 120 121 150 151 180 181 220 221 270 271 330 331 2,200 222 4,700 472 10,000 103 K: ± 10% Capacitance (pF) Cap Code Tolerance X7R

• All specifications are subject to change without notice. Please read the precautions before using the product.

• All specifications are subject to change without notice. Please read the precautions before using the product. US Catalog // C Series — High Voltage Application // Version A11 C Series — High Voltage ApplicationGeneral Specifications Reflow solder the capacitors on P.C. board (shown in Appendix 1) and apply a pushing force of 5N with 10±1s. No sign of termination coming off, breakage of ceramic, or other abnormal signs. Robustness of Terminations Capacitance shall be measured by the steps shown in the following table after thermal equilibrium is obtained for each step. ∆C be calculated ref. STEP3 reading Capacitance Change (%)Temperature Characteristics of Capacitance (Class 2) Temperature coefficient shall be calculated based on values at 25ºC and 85ºC temperature. Measuring temperature below 20ºC shall be -10ºC and -25ºC. Capacitance drift within ± 0.2% or ± 0.05pF, whichever larger. Temperature Characteristics of Capacitance (Class 1) Inspect with magnifying glass (3×).No defects which may affect performance. External Appearance Apply 500V DC for 60s.10,000MΩ min.Insulation Resistance Test or Inspection MethodPerformanceItemNo. See No.4 in this table for measuring condition.Dissipation Factor (Class 2) See No.4 in this table for measuring condition. C : Rated capacitance (pF) Q (Class 1) Within the specified tolerance.Capacitance4 1.2 × rated voltage (DC) shall be applied for 1 to 5s. Charge / discharge current shall not exceed 50mA. Withstand test voltage without insulation breakdown or other damage. Voltage Proof3 1.0±0.2Vrms1kHz±10% Class 2 0.5 - 5 Vrms1MHz±10%Class 1 Measuring Voltage Measuring FrequencyClass 0.03 max.X7R D.F.T.C. 400+20×C min.Under 30pF 1,000 min.30pF and over QRated Capacitance 0 ± 30 (ppm/ºC)C0G Temperature CoefficientT.C. X7R: ± 15% No Voltage Applied Temperature (ºC)Step Max. operating temp. ± 24 Reference temp. ± 23 Min. operating temp. ± 22 Reference temp. ± 21 Pushing force P.C. board Capacitor

• All specifications are subject to change without notice. Please read the precautions before using the product. US Catalog // C Series — High Voltage Application // Version A11 C Series — High Voltage ApplicationGeneral Specifications No insulation breakdown or other damage. Voltage Proof Meet the initial spec.Insulation Resistance Reflow solder the capacitor on P.C. board (shown in Appendix 1) before testing. Expose the capacitor in the conditions step1 through step 4 and repeat 5 times consecutively. Leave the capacitor in ambient conditions for 6 to 24h (Class 1) or 24±2h (Class 2) before measurement. Temperature cycle12 No mechanical damage.External appearance Capacitance C : Rated capacitance (pF) Q (Class 1) Meet the initial spec.D.F. (Class 2) Meet the initial spec.D.F. (Class 2) C : Rated capacitance (pF) Q (Class 1) Capacitance No mechanical damage.External appearance Completely soak both terminations in solder at 235±5ºC for 2±0.5s. Solder: H63A (JIS Z 3282) Flux: Isopropyl alcohol (JIS K 8839) Rosin (JIS K 5902) 25% solid solution. New solder to cover over 75% of termination. 25% may have pin holes or rough spots but not concentrated in one spot. Ceramic surface of “A sections” shall not be exposed due to melting or shifting of termination material. Solderability10 Completely soak both terminations in solder at 260±5ºC for 5±1s. Preheating condition Temp.: 150±10ºC Time: 1 to 2min. Flux: Isopropyl alcohol (JIS K 8839) Rosin (JIS K 5902) 25% solid solution. Solder: H63A (JIS Z 3282) Leave the capacitor in ambient conditions for 6 to 24h (Class 1) or 24±2h (Class 2) before measurement. Vibration11 Test or Inspection MethodPerformanceItemNo. A section X7R C0G ± 7.5 %Class 2 ±2.5 %Class 1 Change from the value before testCharacteristics 400+20×C min.Under 30pF 1,000 min.30pF and over QRated Capacitance X7R C0G ± 7.5 %Class 2 ±2.5 %Class 1 Change from the value before testCharacteristics 400+20×C min.Under 30pF 1,000 min.30pF and over QRated Capacitance 2 - 5 30 ± 2 2 — 5 30 ± 3 Time (min.)Temperature (ºC)Step Reference Temp.4 Max. operating temp. ± 23 Reference Temp.2 Min. operating temp. ±31

• All specifications are subject to change without notice. Please read the precautions before using the product. US Catalog // C Series — High Voltage Application // Version A11 C Series — High Voltage ApplicationGeneral Specifications *As for the initial measurement of capacitors (Class 2) on number 8, 11, 12 and 13, leave capacitors at 150 —10, 0°C for 1 hour and measure the value after leaving capacitor for 24±2h in ambient condition. 1,000MΩ min.Insulation Resistance Characteristics X7R: 200% of initial spec. max. D.F. (Class 2) C : Rated capacitance (pF) Q (Class 1) Capacitance No mechanical damage.External appearance 1,000MΩ min.Insulation Resistance Characteristics X7R: 200% of initial spec. max. D.F. (Class 2) C : Rated capacitance (pF) Q (Class 1) Capacitance No mechanical damage.External appearance Reflow solder the capacitors on P.C. board (shown in Appendix 1) before testing. Leave at temperature 40±2ºC, 90 to 95%RH for 500 +24,0h. Leave the capacitors in ambient conditions for 6 to 24h (Class 1) or 24±2h (Class 2) before measurement. Moisture Resistance (Steady State)13 Reflow solder the capacitors on P.C. board (shown in Appendix 1) before testing. Apply rated voltage at maximum operating temperature ±2ºC for 1,000 +48, 0h. Charge/discharge current shall not exceed 50mA. Leave the capacitor in ambient conditions for 6 to 24h (Class1) or 24±2h (Class2) before measurement. Voltage conditioning: Voltage treat the capacitors under testing temperature and voltage for 1 hour. Leave the capacitors in ambient conditions for 24±2h before measurement. Use this measurement for initial value. Life14 Test or Inspection MethodPerformanceItemNo. X7R C0G ±12.5 %Class 2 ±5 %Class 1 Change from the value before testCharacteristics 275+5/2×C min.10pF and over to under 30pF 350 min.30pF and over QRated Capacitance X7R C0G ±15 %Class 2 ±3 %Class 1 Change from the value before testCharacteristics 275+5/2×C min.10pF and over to under 30pF 350 min.30pF and over QRated Capacitance

• All specifications are subject to change without notice. Please read the precautions before using the product. US Catalog // C Series — High Voltage Application // Version A11 C Series — High Voltage ApplicationGeneral Specifications Appendix - 1 P.C. Board for reliability test CopperSolder ResistSlit 40 mm 100 mmc b a Material : Glass Epoxy (As per JIS C6484 GE4) P.C. Board thickness : 1.6mm Copper (thickness 0.035mm) Solder resist 3.7 2.5 c 7.03.5CC1812C4532 7.03.5CC1808C4520 baEIAJIS Dimensions (mm)Case Code

• All specifications are subject to change without notice. Please read the precautions before using the product. US Catalog // C Series — High Voltage Application // Version A11 1.0 — 1.3 1.2 — 1.4 3.1 — 3.7 C4532 [CC1812] Unit: mm C4520 [CC1808] Type Symbol 1.2 — 1.4B 1.0 — 1.3D 3.1 — 3.7A Reflow Soldering
• Recommended Soldering Land Pattern • Recommended Soldering Profile Small solder fillet may cause contact failure or failure to hold the chip capacitor to the P.C. board. Insufficient solder Adequate solder Higher tensile force on the chip capacitor may cause cracking. Excessive solder
• Recommended Solder Amount Maximum amount Minimum amount Reflow SolderingTemp./ Dura. Solder Recommended solder compositions Sn-37Pb (Sn-Pb solder) Sn-3.0Ag-0.5Cu (Lead Free Solder) Duration (sec.) Peak temp (°C) 260 max. 230 max. 10 max. 20 max. Recommended soldering duration Lead-Free Solder Sn-Pb Solder ∆T ≤ 130 ∆T ≤ 130 Temp. (ºC) Preheating Condition Manual soldering Reflow soldering Soldering Soldering Information D A B C Chip capacitor Solder land Solder resist Slit
• This product intended solely for reflow soldering.
• A slit of about 1mm on the circuit board is recommended to improve removal of the flux after soldering.
• Ensure that this product is completely dried following washing.
• Because this product w ill be subjected to high voltages, use only low-activity rosin flux (with 0.2% max. of chlorine).
• Using this product with aluminum circuit boards must be considered a special implementation because the high heat stress levels are involved. In case of using aluminum circuit boards, please contact TDK. C Series — High Voltage Application Reflow Soldering Manual soldering (Solder iron) Preheating 3sec. (As short as possible) 300 Temp (ºC) Temp (ºC) Soldering Natural coolingPreheating Peak Temp Over 60 sec. Peak Temp time

• All specifications are subject to change without notice. Please read the precautions before using the product. US Catalog // C Series — High Voltage Application // Version A11 Packaging Information
• Carrier Tape Configuration Drawing direction Leader 400mm min Bulk 160mm min. Chips Bulk 160mm min Plastic carrier tape Top cover tape Pitch hole
• Chip Quantity Per Reel and Structure of Reel 3,000 3,000 500 2.00 mm 1.60 mm 3.20 mm 2.30 mm 1.10 mm 1.30 mm 1.60 mm 2.00 mm 5,000 1,000 Plastic 1.30 mm CC1812C4532 5,000 1,000Plastic 0.85 mm CC1808C4520 Φ330mm (13”) reel φ178mm (7”) reelEIAJIS Chip quantity (pcs.) Taping Material Chip Thickness Case Code
• Peel Back Force (Top Tape) 0~15° Carrier tape Top cover tape Direction & angle of pull 0.05 — 0.7 N
• Carrier tape shall be flexible enough to be wound around a minimum radius of 30mm with components in tape.
• The missing of components shall be less than 0.1%
• Components shall not stick to the cover tape.
• The cover tape shall not protrude beyond the edges of the carrier tape not shall cover the sprocket holes. Plastic Carrier Tape & Reel C Series — High Voltage Application

• All specifications are subject to change without notice. Please read the precautions before using the product. US Catalog // C Series — High Voltage Application // Version A11 Additional Information
• Shape & Dimensions TDK Corporation established internal product environmental assurance standards that include the six hazardous substances banned by the EU RoHS Directive 1 enforced on July 1, 2006 along with additional substances independently banned by TDK and has successfully completed making general purpose electronic components conform to the RoHS Directive 2. L B G B W T Terminal electrode Ceramic dielectric Internal electrode 1 2 BaTiO3 Class 2Class 1 Copper (Cu) Termination (3) Nickel (Ni)(4) Internal Electrode Ceramic Dielectric NAME Tin (Sn) Nickel (Ni) CaZrO3 MATERIAL (5) (2) (1) No.
• Inside Structure & Material System
• Environmental Information 1. Abbreviation for Restriction on Hazardous Substances, which refers to the regulation EU Directive 2002/95/EC on hazardous substances by the European Union (EU) effective from July 1, 2006. The Directive bans the use of six specific hazardous substances in electric and electronic devices and products handled within the EU. The six substances are lead, mercury, cadmium, hexavalent chromium, PBB (polybrominated biphenyls), and PBDE (polybrominated diphenyl ethers). 2. This means that, in conformity with the EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. For REACH (SVHC : 15 substances according to ECHA / October 2008) : All TDK MLCC do not contain these 15 substances. For European Directive 2000/53/CE and 2005/673/CE : Cadmium, Hexavalent Chromium, Mercury, Lead are not contained in all TDK MLCC. For European Directive 2003/11/CE : Pentabromodiphenyl-ether, Octabromodiphenyl-ether are not contained in all TDK MLCC. 2.00 min 0.30 min 0.20 min 0.30 min.3.20 mm 2.00 min 2.00 min 0.30 min. 0.30 min 3.20 2.00 4.50 4.50 2.00 mm 1.60 mm 2.30 mm 1.30 mm 2.00 mm 1.60 mm 1.10 mm 1.30 mm CC1812C4532 0.85 mm CC1808C4520 Dimensions (mm)Case Code C Series — High Voltage Application