C32725 | DigiCamel IC Datasheet

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BC807 NXP | Alldatasheet

Document overview

Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
PDF pages: 19

Technical content

1.1 General description

PNP general-purpose transistors. [1] Also available in SOT54A and SOT54 variant packages (see Section 2).

1.2 Features

1.3 Applications

1.4 Quick reference data

45 V, 500 mA PNP general-purpose transistors

Table 1. Product overview Table 2. Quick reference data

BC807_BC807W_BC327_6 © NXP B.V. 2009. All rights reserved. [1] Valid for all avail able selection groups. [2] Also available in SOT54A and SOT54 variant packages (see Section 2 and Section 9). Table 4. Ordering information Table 5. Marking codes

BC807_BC807W_BC327_6 © NXP B.V. 2009. All rights reserved. [1] Transistor mounted on an FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint. [2] Valid for all avail able selection groups. [1] Transistor mounted on an FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint. [2] Valid for all avail able selection groups. Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Table 7. Thermal characteristics

BC807_BC807W_BC327_6 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 06 — 17 November 2009 6 of 19 NXP Semiconductors BC807; BC807W; BC327 VCE = −1 V (1) T amb = 150 °C (2) T amb = 25 °C (3) T amb = −55 °C VCE = −1 V (1) T amb = 150 °C (2) T amb = 25 °C (3) T amb = −55 °C Fig 1. Selection -16: DC current gain as a function of collector current; typical values Fig 2. Selection -25: DC current gain as a function of collector current; typical values VCE = −1 V (1) T amb = 150 °C (2) T amb = 25 °C (3) T amb = −55 °C Fig 3. Selection -40: DC current gain as a function of collector current; typical values 006aaa119 200 100 300 hFE IC (mA) (1) (2) (3) 006aaa120 400 200 600 hFE IC (mA) (1) (2) (3) 006aaa121 400 200 600 800 hFE IC (mA) (1) (2) (3)

BC807_BC807W_BC327_6 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 06 — 17 November 2009 7 of 19 NXP Semiconductors BC807; BC807W; BC327 IC/IB = 10 (1) T amb = −55 °C (2) T amb = 25 °C (3) T amb = 150 °C IC/IB = 10 (1) T amb = −55 °C (2) T amb = 25 °C (3) T amb = 150 °C Fig 4. Selection -16: Base-emitter saturation voltage as a function of collector current; typical values Fig 5. Selection -25: Base-emitter saturation voltage as a function of collector current; typical values IC/IB = 10 (1) T amb = −55 °C (2) T amb = 25 °C (3) T amb = 150 °C Fig 6. Selection -40: Base-emitter saturation voltage as a function of collector current; typical values 006aaa122 IC (mA) −10 VBEsat (V) −10−1 (1) (2) (3) 006aaa123 IC (mA) −10 VBEsat (V) −10−1 (1) (2) (3) 006aaa124 IC (mA) −10 VBEsat (V) −10−1 (1) (2) (3)

BC807_BC807W_BC327_6 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 06 — 17 November 2009 8 of 19 NXP Semiconductors BC807; BC807W; BC327 IC/IB = 10 (1) T amb = 150 °C (2) T amb = 25 °C (3) T amb = −55 °C IC/IB = 10 (1) T amb = 150 °C (2) T amb = 25 °C (3) T amb = −55 °C Fig 7. Selection -16: Collector-emitter saturation voltage as a function of collector current; typical values Fig 8. Selection- 25: Collector-emitter saturation voltage as a function of collector current; typical values IC/IB = 10 (1) T amb = 150 °C (2) T amb = 25 °C (3) T amb = −55 °C Fig 9. Selection -40: Collector-emitter saturation volt age as a function of collector current; typical values 006aaa125 IC (mA) −10−1 VCEsat (V) −10−2 (1) (2) (3) 006aaa126 −10−1 −10−2 VCEsat (V) −10−3 IC (mA) (1) (2) (3) 006aaa127 −10−1 −10−2 VCEsat (V) −10−3 IC (mA) (1) (2)(3)

BC807_BC807W_BC327_6 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 06 — 17 November 2009 9 of 19 NXP Semiconductors BC807; BC807W; BC327 Tamb = 25 °C (1) I B = −16.0 mA (2) I B = −14.4 mA (3) I B = −12.8 mA (4) I B = −11.2 mA (5) I B = −9.6 mA (6) I B = −8.0 mA (7) I B = −6.4 mA (8) I B = −4.8 mA (9) I B = −3.2 mA (10) I B = −1.6 mA Tamb = 25 °C (1) I B = −13.0 mA (2) I B = −11.7 mA (3) I B = −10.4 mA (4) I B = −9.1 mA (5) I B = −7.8 mA (6) I B = −6.5 mA (7) I B = −5.2 mA (8) I B = −3.9 mA (9) I B = −2.6 mA (10) I B = −1.3 mA Fig 10. Selection -16: Collector current as a function of collector-emitter voltage; typical values Fig 11. Selection -25: Collector current as a function of collector-emitter voltage; typical values VCE (V) 006aaa128 −0.4 −0.8 −1.2 IC (A) (4) (5) (6) (7) (8) (9) (10) (1)(3) (2) VCE (V) 006aaa129 −0.4 −0.8 −1.2 IC (A) (1)(3) (4) (5) (6) (7) (8) (9) (10) (2)

BC807_BC807W_BC327_6 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 06 — 17 November 2009 10 of 19 NXP Semiconductors BC807; BC807W; BC327 Tamb = 25 °C (1) I B = −12.0 mA (2) I B = −10.8 mA (3) I B = −9.6 mA (4) I B = −8.4 mA (5) I B = −7.2 mA (6) I B = −6.0 mA (7) I B = −4.8 mA (8) I B = −3.6 mA (9) I B = −2.4 mA (10) I B = −1.2 mA Fig 12. Selection -40: Collector current as a func tion of collector-emitter voltage; typical values VCE (V) 006aaa130 −0.4 −0.8 −1.2 IC (A) (1)(2)(3)(4)(5) (6) (7) (8) (9) (10)

Package outline Fig 13. Package outline SOT23 (TO-236AB) UNIT A1 max. bp cD E e1 HE Lp Qw v REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE 04-11-04 06-03-16 IEC JEDEC JEITA mm 0.1 0.48 0.38 0.15 0.09 3.0 2.8 1.4 1.2 0.95 e 1.9 2.5 2.1 0.55 0.45 0.10.2 DIMENSIONS (mm are the original dimensions) 0.45 0.15 SOT23 TO-236AB bp D e A Lp Q detail X HE E w M v M A B AB 0 1 2 mm scale A 1.1 0.9 c X Plastic surface-mounted package; 3 leads SOT2 3

BC807_BC807W_BC327_6 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 06 — 17 November 2009 12 of 19 NXP Semiconductors BC807; BC807W; BC327 Fig 14. Package outline SOT323 (SC-70) UNIT max bp cD E e1 HE Lp Qw v REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.11.1 0.8 0.4 0.3 0.25 0.10 2.2 1.8 1.35 1.15 0.65 e 1.3 2.2 2.0 0.23 0.13 0.20.2 DIMENSIONS (mm are the original dimensions) 0.45 0.15 SOT323 SC-70 w Mbp D e A B Lp Q detail X c HE E v M A AB y 0 1 2 mm scale A X Plastic surface-mounted package; 3 leads SOT32 3 04-11-04 06-03-16

BC807_BC807W_BC327_6 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 06 — 17 November 2009 13 of 19 NXP Semiconductors BC807; BC807W; BC327 Fig 15. Package outline SOT54 (SC-43A/TO-92) UNIT A REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 5.2 5.0 b 0.48 0.40 c 0.45 0.38 D 4.8 4.4 d 1.7 1.4 E 4.2 3.6 L 14.5 12.7 e 2.54 1.27 (1) max. 2.5 0.66 0.55 DIMENSIONS (mm are the original dimensions) Note 1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities. SOT54 TO-92 SC-43A 04-06-28 04-11-16 A L 0 2.5 5 mm scale b c D b1 L1 d E Plastic single-ended leaded (through hole) package; 3 leads SOT5 4 e

BC807_BC807W_BC327_6 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 06 — 17 November 2009 14 of 19 NXP Semiconductors BC807; BC807W; BC327 Fig 16. Package outline SOT54A UNIT A REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 5.2 5.0 b 0.48 0.40 c 0.45 0.38 D 4.8 4.4 d 1.7 1.4 E 4.2 3.6 L 14.5 12.7 e 5.08 e1 L2 2.54 (1) max. 0.66 0.55 DIMENSIONS (mm are the original dimensions) Note 1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities. SOT54A 97-05-13 04-06-28 A L 0 2.5 5 mm scale b c D L2d E Plastic single-ended leaded (through hole) package; 3 leads (wide pitch) SOT54 A e

BC807_BC807W_BC327_6 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 06 — 17 November 2009 15 of 19 NXP Semiconductors BC807; BC807W; BC327 Fig 17. Package outline SOT54 variant UNIT A REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 5.2 5.0 b 0.48 0.40 c 0.45 0.38 D 4.8 4.4 d 1.7 1.4 E 4.2 3.6 L 14.5 12.7 e 2.54 1.27 L1(1) max max 2.5 2.5 0.66 0.55 DIMENSIONS (mm are the original dimensions) Note 1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities. SOT54 variant A L 0 2.5 5 mm scale b c D b1 L1 d E Plastic single-ended leaded (through hole) package; 3 leads (on-circle) SOT54 varia nt e 04-06-28 05-01-10

20091117 Product data sheet - BC807_BC807W_

Table 3 “Pinning”: updated
Figure 13 “Package outline SOT23 (TO-236AB)”: updated
Figure 14 “Package outline SOT323 (SC-70)”: updated BC807_BC807W_ BC327_5

20050221 Product data sheet CPCN200302007F

Legal information

11.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

11.2 Definitions

Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

11.3 Disclaimers

General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.

11.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 12. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This docu ment contains the product specification.

NXP Semiconductors BC807; BC807W; BC327 © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 17 November 2009 Document identifier: BC807_BC807W_BC327_6 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 13. Contents

Product Information

C32725 specifications and overview.

Summary

45 V, 500 mA PNP general-purpose transistors Rev. 06-17 November 2009

Description

45 V, 500 mA PNP general-purpose transistors Rev. 06-17 November 2009

Source title C32725 Datasheet(PDF) - NXP Semiconductors

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