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Technical content
Features
- ±2.0% Detection Thresholds
- Small Packages: 3-Pin SOT-23A, SOT-89, and TO-92
- Low Current Drain: 1 µA, typical
- Wide Detection Range: 1.1V to 6.0V
- Wide Operating Voltage Range: 0.7V to 10V
Applications
- Battery Voltage Monitoring
- Microprocessor Reset
- System Brown-Out Protection
- Switching Circuit in Battery Backup
- Level Discriminator Functional Block Diagram General Description The TC54 series are CMOS voltage detectors that are especially well suited for battery-powered applications because of their extremely low 1 µA operating current and small surface-mount packaging. Each part is laser- trimmed to the desired threshold voltage, which can be specified from 1.4V to 6.0V with a 2% tolerance. The TC54 is available with either an open-drain or com- plementary output stage. During operation, the output OUT) remains in the logic-high state as long as VIN is greater than the specified threshold voltage (V DET –). When VIN falls below VDET –, the output is driven to a logic-low. V OUT remains low until V IN rises above VDET – by an amount VHYST, when it resets to a logic- high state. Package Types Device Features VOUT VSS VIN VREF TC54VC only TC54VN has open-drain output. TC54VC has complementary (push-pull) output. 1 32 VIN VSSVOUT TC54 3-Pin SOT-89 Note: 3-Pin SOT-23A is equivalent to the EIAJ SC-59. 3-Pin TO-92 12 3 VSSVINVOUT VIN VOUT VSS TC54 3-Pin SOT-23A VIN Device Output Reset Delay Std. Trip Points (1) (typical) Type State TC54VN Open-Drain Active Low No 1.4V, 2.1V, 2.7V, 2.9V TC54VC Push-Pull Active Low No 3.0V, 4.2V, 4.3V Note 1: Custom Trip Points available. Minimum order requirement. Information available upon request. Voltage Detector
DS21434J-page 2 2001-2011 Microchip Technology Inc.
1.0 ELECTRICAL
Absolute Maximum Ratings † Power Dissipation (TA 70°C): † Notice: Stresses above those listed under "Absolute Maxi- mum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. DC CHARACTERISTICS Electrical Specifications: Unless otherwise noted, TA = +25°C. Parameter Sym Min Typ Max Units Test Conditions Operating Voltage V IN 0.7 — 10.0 V (V DET –) 1.6V Quiescent Current I SS —0 . 82 . 7 µ A V IN = 2.0V —0 . 93 . 0 V IN = 3.0V —1 . 03 . 2 V IN = 4.0V —1 . 13 . 6 V IN = 5.0V Threshold Voltage (Note 1) VDET – 1.37 1.4 1.43 V TC54VX14 2.06 2.1 2.14 TC54VX21 2.65 2.7 2.75 TC54VX27 2.84 2.9 2.96 TC54VX29 2.94 3.0 3.06 TC54VX30 4.12 4.2 4.28 TC54VX42 4.21 4.3 4.39 TC54VX43 Hysteresis Voltage V HYST 28 70 112 mV V DET = 1.4V (typical) 42 105 168 V DET = 2.1V (typical) 54 135 216 V DET = 2.7V (typical) 58 145 232 V DET = 2.9V (typical) 60 150 240 V DET = 3.0V (typical) 84 210 336 V DET = 4.2V (typical) 86 215 344 V DET = 4.3V (typical) Output Current I OUT 3.0 7.7 — mA V OL = 0.5V, VIN = 2.0V 5.0 10.1 — V OL = 0.5V, VIN = 3.0V 6.0 11.5 — V OL = 0.5V, VIN = 4.0V 7.0 13.0 — V OL = 0.5V, VIN = 5.0V — -10.0 -2.0 TC54VC Only: VOH = VIN – 2.1V, VIN = 8.0V Tempco of (VDET –)T C (VDET –) — ±100 — ppm/°C -40°C TA 85°C Delay Time t DLY —— 0 . 2 m s V DET – VOUT inversion Note 1: For other voltage options, please contact your regional Microchip sales office.
2001-2011 Microchip Technology Inc. DS21434J-page 3 TC54 FIGURE 1-1: Timing Diagram. TEMPERATURE SPECIFICATIONS Electrical Characteristics: Unless otherwise indicated, all limits are specified for: VDD =+1.8V to +5.5V, VSS=GND. Parameters Sym Min Typ Max Units Conditions Temperature Ranges Operating Temperature Range T A -40 — +85 °C Storage Temperature Range T A -65 — +150 °C Thermal Package Resistances Thermal Resistance, 3L-SOT-23A JA —3 0 8— ° C / W Thermal Resistance, 3L-SOT-89 JA — 131.7 — °C/W Thermal Resistance, 3L-TO-92 JA —1 4 6— ° C / W VDD OUTPUT VOH tDLY VDET –+VHYST OUTPUT VDET
DS21434J-page 4 2001-2011 Microchip Technology Inc.
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE
2.1 Digital Output (V OUT)
VOUT goes low when V IN drops below V DET – and returns high when V IN rises above V DET – + V HYST. (See Figure 3-1).
2.2 Analog Input (V IN)
VIN can be used for power supply monitoring or a voltage level that requires monitoring.
2.3 Ground Terminal (V SS)
VSS provides the negative reference for the analog input voltage. Typically, the circuit ground is used. TC54 Symbol Description SOT-23A SOT-89 TO-92 11 1 V OUT Digital Output 32 2 V IN Analog Input 23 3 V SS Ground Terminal —T a b — V IN Analog Input
2001-2011 Microchip Technology Inc. DS21434J-page 5 TC54
3.0 DETAILED DESCRIPTION
In normal steady-state operation when V IN >V DET –, the output will be at a logic-high (see Figure 3-1). In the case of the TC54VN, this is an open-drain condition. If the input falls below V DET –, the output will pull down (Logic 0) to V SS. Generally, V OUT can pull down to within 0.5V of V SS at rated output current and input voltage. (See Section 1.0 “Electrical Characteristics”). The output (VOUT) will stay valid until the input voltage falls below the minimum operating voltage (V INMIN) of 0.7V. Below this minimum operating voltage, the output is undefined. During power-up (or anytime V IN has fallen below VINMIN), VOUT will remain undefined until VIN rises above V INMIN. When this occurs, the output will become valid. V OUT will be in its Active-low state, while VINMIN <V IN <V DET+ (therefore, VDET+ = VDET – + VHYST). If the input rises above VDET+, the output will assume its Inactive state (high for TC54VC, open-drain for TC54VN). FIGURE 3-1: Timing Diagram. VIN Detect Voltage VDET – Minimum Operating Voltage VHYST VDET + Output Voltage Release Voltage or RESET Voltage Ground Level Ground Level VOUT
DS21434J-page 6 2001-2011 Microchip Technology Inc.
4.0 APPLICATIONS INFORMATION
4.1 Modifying the Trip Point, V DET –
Although the TC54 has a pre-programmed VDET –, it is sometimes necessary to make adjustments during pro- totyping. This can be accomplished by connecting an external resistor divider to a TC54, which has a VDET – lower than that of VSOURCE (Figure 4-1). To maintain detector accuracy, the bleeder current through the divider should be significantly higher than the 1 µA operating current required by the TC54. A rea- sonable value for this bleeder current is 100 µA (100 times the 1 µA required by the TC54). For example, if V DET – = 2V and the desired trip point is 2.5V, the value of R 1 + R 2 is 25 k (2.5V/100 µA). The value of R1 +R 2 can be rounded to the nearest standard value and plugged into the equation of Figure 4-1 to calculate values for R 1 and R 2. 1% tolerance resistors are recommended. FIGURE 4-1: Modify Trip-Point of the TC54 using External Resistor Divider.
4.2 Other Applications
Low operating power and small physical size make the TC54 series ideal for many voltage detector applica- tions, such as those shown in Figures 4-2, 4-3 and 4-4. Figure 4-2 shows a low-voltage gate drive protection circuit that prevents the overheating of the logic-level MOSFET due to insufficient gate voltage. When the input signal is below the threshold of the TC54VN, its output grounds the gate of the MOSFET. Figures 4-3 and 4-4 show the TC54 in conventional voltage monitoring applications. FIGURE 4-2: MOSFET Low Drive Protection. FIGURE 4-3: Battery Voltage Monitor. FIGURE 4-4: Power Good Monitor. Note: In this example, V SOURCE must be greater than (VDET –) VSOURCE VIN VOUT VSS VSOURCE Where: VSOURCE = Voltage to be monitored VDET – = Threshold Voltage setting of TC54 TC54 VIN VOUT VSS 270 MTP3055EL VCC RL 4.3V TC54VX VIN VOUT VSS BATLOW TC54VX VIN VOUT VSS Power Good Pwr Sply TC54VX
2001-2011 Microchip Technology Inc. DS21434J-page 7 TC54
5.0 PACKAGING INFORMATION
5.1 Package Marking Information
Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.
DS21434J-page 8 2001-2011 Microchip Technology Inc. Symbol Output Voltage BC M O S1 . CC M O S2 . DC M O S3 . EC M O S4 . FC M O S5 . HC M O S6 . IC M O S 7 . Symbol Output Voltage LN c h 1 . MN c h2 . NN c h3 . PN c h4 . RN c h5 . SN c h6 . TN c h7 . Symbol Voltage Symbol Voltage 0. 06. 6 1. 17. 7 2. 28. 8 3. 39. 9 4. 4 5. 5 3-Pin SOT-23A 3-Pin SOT-89 1 represents output configuration (CMOS or Nch) and first integer of voltage Ex: CMOS 3.x = D 2 represents first decimal of output voltage (0-9) Ex: CMOS 3.x = D 4 43 represents assembly lot code& Symbol Output CC M O S N N-Channel Symbol Voltage 22 . 33 . 44 . 55 . 66 . Symbol Voltage Symbol Voltage 0. 05. 5 1. 16. 6 2. 27. 7 3. 38. 8 4. 49. 9 Symbol Delay Time 0N o D e l a y Symbol Accuracy 1 ±1.0% (custom) 2 ±2.0% (standard) 3-Pin TO-92 = 54X (fixed)1 , 2 , & 3 4 represents output configuration (CMOS or Nch) Ex: CMOS 3.x = C 5 represents first integer of detect voltage 6 represents first decimal of detect voltage 7 represents the output delay time represents the device accuracy8
2001-2011 Microchip Technology Inc. DS21434J-page 9 TC54 /g22/g16/g47/g72/g68/g71/g3/g51/g79/g68/g86/g87/g76/g70/g3/g54/g80/g68/g79/g79/g3/g50/g88/g87/g79/g76/g81/g72/g3/g55/g85/g68/g81/g86/g76/g86/g87/g82/g85/g3/g11/g38/g37/g12/g3/g62/g54/g50/g55/g16/g21/g22/g36/g64 /g49/g82/g87/g72/g86/g29 /g20/g17 /g39/g76/g80/g72/g81/g86/g76/g82/g81/g86/g3/g39/g3/g68/g81/g71/g3/g40/g20/g3/g71/g82/g3/g81/g82/g87/g3/g76/g81/g70/g79/g88/g71/g72/g3/g80/g82/g79/g71/g3/g73/g79/g68/g86/g75/g3/g82/g85/g3/g83/g85/g82/g87/g85/g88/g86/g76/g82/g81/g86/g17/g3/g48/g82/g79/g71/g3/g73/g79/g68/g86/g75/g3/g82/g85/g3/g83/g85/g82/g87/g85/g88/g86/g76/g82/g81/g86/g3/g86/g75/g68/g79/g79/g3/g81/g82/g87/g3/g72/g91/g70/g72/g72/g71/g3/g19/g17/g20/g21/g26/g3/g80/g80/g3/g83/g72/g85/g3/g86/g76/g71/g72/g17 /g21/g17 /g39/g76/g80/g72/g81/g86/g76/g82/g81/g76/g81/g74/g3/g68/g81/g71/g3/g87/g82/g79/g72/g85/g68/g81/g70/g76/g81/g74/g3/g83/g72/g85/g3/g36/g54/g48/g40/g3/g60/g20/g23/g17/g24/g48/g17 /g37/g54/g38/g29 /g37/g68/g86/g76/g70/g3/g39/g76/g80/g72/g81/g86/g76/g82/g81/g17/g3/g55/g75/g72/g82/g85/g72/g87/g76/g70/g68/g79/g79/g92/g3/g72/g91/g68/g70/g87/g3/g89/g68/g79/g88/g72/g3/g86/g75/g82/g90/g81/g3/g90/g76/g87/g75/g82/g88/g87/g3/g87/g82/g79/g72/g85/g68/g81/g70/g72/g86/g17 /g49/g82/g87/g72/g29/g41/g82/g85/g3/g87/g75/g72/g3/g80/g82/g86/g87/g3/g70/g88/g85/g85/g72/g81/g87/g3/g83/g68/g70/g78/g68/g74/g72/g3/g71/g85/g68/g90/g76/g81/g74/g86/g15/g3/g83/g79/g72/g68/g86/g72/g3/g86/g72/g72/g3/g87/g75/g72/g3/g48/g76/g70/g85/g82/g70/g75/g76/g83/g3/g51/g68/g70/g78/g68/g74/g76/g81/g74/g3/g54/g83/g72/g70/g76/g73/g76/g70/g68/g87/g76/g82/g81/g3/g79/g82/g70/g68/g87/g72/g71/g3/g68/g87/g3 /g75/g87/g87/g83/g29/g18/g18/g90/g90/g90/g17/g80/g76/g70/g85/g82/g70/g75/g76/g83/g17/g70/g82/g80/g18/g83/g68/g70/g78/g68/g74/g76/g81/g74 /g56/g81/g76/g87/g86/g48/g44/g47/g47/g44/g48/g40/g55/g40/g53/g54 /g39/g76/g80/g72/g81/g86/g76/g82/g81/g3/g47/g76/g80/g76/g87/g86 /g48/g44/g49 /g49/g50/g48 /g48/g36/g59 /g49/g88/g80/g69/g72/g85/g3/g82/g73/g3/g51/g76/g81/g86/g49 /g22 /g47/g72/g68/g71/g3/g51/g76/g87/g70/g75 /g72 /g19/g17/g28/g24/g3/g37/g54/g38 /g50/g88/g87/g86/g76/g71/g72/g3/g47/g72/g68/g71/g3/g51/g76/g87/g70/g75 /g72/g20 /g20/g17/g28/g19/g3/g37/g54/g38 /g50/g89/g72/g85/g68/g79/g79/g3/g43/g72/g76/g74/g75/g87 /g36 /g19/g17/g27/g28 /g177 /g20/g17/g23/g24 /g48/g82/g79/g71/g72/g71/g3/g51/g68/g70/g78/g68/g74/g72/g3/g55/g75/g76/g70/g78/g81/g72/g86/g86 /g36/g21 /g19/g17/g28/g19 /g177 /g20/g17/g22/g19 /g54/g87/g68/g81/g71/g82/g73/g73 /g36/g20 /g19/g17/g19/g19 /g177 /g19/g17/g20/g24 /g50/g89/g72/g85/g68/g79/g79/g3/g58/g76/g71/g87/g75 /g40 /g21/g17/g20/g19 /g177 /g22/g17/g19/g19 /g48/g82/g79/g71/g72/g71/g3/g51/g68/g70/g78/g68/g74/g72/g3/g58/g76/g71/g87/g75 /g40/g20 /g20/g17/g21/g19 /g177 /g20/g17/g27/g19 /g50/g89/g72/g85/g68/g79/g79/g3/g47/g72/g81/g74/g87/g75 /g39 /g21/g17/g26/g19 /g177 /g22/g17/g20/g19 /g41/g82/g82/g87/g3/g47/g72/g81/g74/g87/g75 /g47 /g19/g17/g20/g24 /g177 /g19/g17/g25/g19 /g41/g82/g82/g87/g3/g36/g81/g74/g79/g72/g73 /g19/g131 /g177 /g22/g19/g131 /g47/g72/g68/g71/g3/g55/g75/g76/g70/g78/g81/g72/g86/g86 /g70 /g19/g17/g19/g28 /g177 /g19/g17/g21/g25 /g47/g72/g68/g71/g3/g58/g76/g71/g87/g75 /g69 /g19/g17/g22/g19 /g177 /g19/g17/g24/g20 D e 2 1 E N b A A2 c L φ /g48/g76/g70/g85/g82/g70/g75/g76/g83 /g55/g72/g70/g75/g81/g82/g79/g82/g74/g92 /g39/g85/g68/g90/g76/g81/g74 /g38/g19/g23/g16/g20/g22/g19/g37
DS21434J-page 10 2001-2011 Microchip Technology Inc. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
2001-2011 Microchip Technology Inc. DS21434J-page 11 TC54 /g22/g16/g47/g72/g68/g71/g3/g51/g79/g68/g86/g87/g76/g70/g3/g54/g80/g68/g79/g79/g3/g50/g88/g87/g79/g76/g81/g72/g3/g55/g85/g68/g81/g86/g76/g86/g87/g82/g85/g3/g43/g72/g68/g71/g72/g85/g3/g11/g48/g37/g12/g3/g62/g54/g50/g55/g16/g27/g28/g64 /g49/g82/g87/g72/g86/g29 /g20/g17 /g39/g76/g80/g72/g81/g86/g76/g82/g81/g86/g3/g39/g3/g68/g81/g71/g3/g40/g3/g71/g82/g3/g81/g82/g87/g3/g76/g81/g70/g79/g88/g71/g72/g3/g80/g82/g79/g71/g3/g73/g79/g68/g86/g75/g3/g82/g85/g3/g83/g85/g82/g87/g85/g88/g86/g76/g82/g81/g86/g17/g3/g48/g82/g79/g71/g3/g73/g79/g68/g86/g75/g3/g82/g85/g3/g83/g85/g82/g87/g85/g88/g86/g76/g82/g81/g86/g3/g86/g75/g68/g79/g79/g3/g81/g82/g87/g3/g72/g91/g70/g72/g72/g71/g3/g19/g17/g20/g21/g26/g3/g80/g80/g3/g83/g72/g85/g3/g86/g76/g71/g72/g17 /g21/g17 /g39/g76/g80/g72/g81/g86/g76/g82/g81/g76/g81/g74/g3/g68/g81/g71/g3/g87/g82/g79/g72/g85/g68/g81/g70/g76/g81/g74/g3/g83/g72/g85/g3/g36/g54/g48/g40/g3/g60/g20/g23/g17/g24/g48/g17 /g37/g54/g38/g29 /g37/g68/g86/g76/g70/g3/g39/g76/g80/g72/g81/g86/g76/g82/g81/g17/g3/g55/g75/g72/g82/g85/g72/g87/g76/g70/g68/g79/g79/g92/g3/g72/g91/g68/g70/g87/g3/g89/g68/g79/g88/g72/g3/g86/g75/g82/g90/g81/g3/g90/g76/g87/g75/g82/g88/g87/g3/g87/g82/g79/g72/g85/g68/g81/g70/g72/g86/g17 /g49/g82/g87/g72/g29/g41/g82/g85/g3/g87/g75/g72/g3/g80/g82/g86/g87/g3/g70/g88/g85/g85/g72/g81/g87/g3/g83/g68/g70/g78/g68/g74/g72/g3/g71/g85/g68/g90/g76/g81/g74/g86/g15/g3/g83/g79/g72/g68/g86/g72/g3/g86/g72/g72/g3/g87/g75/g72/g3/g48/g76/g70/g85/g82/g70/g75/g76/g83/g3/g51/g68/g70/g78/g68/g74/g76/g81/g74/g3/g54/g83/g72/g70/g76/g73/g76/g70/g68/g87/g76/g82/g81/g3/g79/g82/g70/g68/g87/g72/g71/g3/g68/g87/g3 /g75/g87/g87/g83/g29/g18/g18/g90/g90/g90/g17/g80/g76/g70/g85/g82/g70/g75/g76/g83/g17/g70/g82/g80/g18/g83/g68/g70/g78/g68/g74/g76/g81/g74 /g56/g81/g76/g87/g86/g48/g44/g47/g47/g44/g48/g40/g55/g40/g53/g54 /g39/g76/g80/g72/g81/g86/g76/g82/g81/g3/g47/g76/g80/g76/g87/g86 /g48/g44/g49 /g48/g36/g59 /g49/g88/g80/g69/g72/g85/g3/g82/g73/g3/g47/g72/g68/g71/g86/g49 /g22 /g51/g76/g87/g70/g75 /g72 /g20/g17/g24/g19/g3/g37/g54/g38 /g50/g88/g87/g86/g76/g71/g72/g3/g47/g72/g68/g71/g3/g51/g76/g87/g70/g75 /g72/g20 /g22/g17/g19/g19/g3/g37/g54/g38 /g50/g89/g72/g85/g68/g79/g79/g3/g43/g72/g76/g74/g75/g87 /g36 /g20/g17/g23/g19 /g20/g17/g25/g19 /g50/g89/g72/g85/g68/g79/g79/g3/g58/g76/g71/g87/g75 /g43 /g22/g17/g28/g23 /g23/g17/g21/g24 /g48/g82/g79/g71/g72/g71/g3/g51/g68/g70/g78/g68/g74/g72/g3/g58/g76/g71/g87/g75/g3/g68/g87/g3/g37/g68/g86/g72 /g40 /g21/g17/g21/g28 /g21/g17/g25/g19 /g48/g82/g79/g71/g72/g71/g3/g51/g68/g70/g78/g68/g74/g72/g3/g58/g76/g71/g87/g75/g3/g68/g87/g3/g55/g82/g83 /g40/g20 /g21/g17/g20/g22 /g21/g17/g21/g28 /g50/g89/g72/g85/g68/g79/g79/g3/g47/g72/g81/g74/g87/g75 /g39 /g23/g17/g22/g28 /g23/g17/g25/g19 /g55/g68/g69/g3/g47/g72/g81/g74/g87/g75 /g39/g20 /g20/g17/g23/g19 /g20/g17/g27/g22 /g41/g82/g82/g87/g3/g47/g72/g81/g74/g87/g75 /g47 /g19/g17/g26/g28 /g20/g17/g21/g19 /g47/g72/g68/g71/g3/g55/g75/g76/g70/g78/g81/g72/g86/g86 /g70 /g19/g17/g22/g24 /g19/g17/g23/g23 /g47/g72/g68/g71/g3/g21/g3/g58/g76/g71/g87/g75 /g69 /g19/g17/g23/g20 /g19/g17/g24/g25 /g47/g72/g68/g71/g86/g3/g20/g3/g9/g3/g22/g3/g58/g76/g71/g87/g75 /g69/g20 /g19/g17/g22/g25 /g19/g17/g23/g27 D E H N b e L A C /g48/g76/g70/g85/g82/g70/g75/g76/g83 /g55/g72/g70/g75/g81/g82/g79/g82/g74/g92 /g39/g85/g68/g90/g76/g81/g74 /g38/g19/g23/g16/g19/g21/g28/g37
DS21434J-page 12 2001-2011 Microchip Technology Inc. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
2001-2011 Microchip Technology Inc. DS21434J-page 13 TC54 /g22/g16/g47/g72/g68/g71/g3/g51/g79/g68/g86/g87/g76/g70/g3/g55/g85/g68/g81/g86/g76/g86/g87/g82/g85/g3/g50/g88/g87/g79/g76/g81/g72/g3/g11/g61/g37/g12/g3/g62/g55/g50/g16/g28/g21/g64 /g3 /g49/g82/g87/g72/g86/g29 /g20/g17 /g39/g76/g80/g72/g81/g86/g76/g82/g81/g86/g3/g36/g3/g68/g81/g71/g3/g40/g3/g71/g82/g3/g81/g82/g87/g3/g76/g81/g70/g79/g88/g71/g72/g3/g80/g82/g79/g71/g3/g73/g79/g68/g86/g75/g3/g82/g85/g3/g83/g85/g82/g87/g85/g88/g86/g76/g82/g81/g86/g17/g3/g48/g82/g79/g71/g3/g73/g79/g68/g86/g75/g3/g82/g85/g3/g83/g85/g82/g87/g85/g88/g86/g76/g82/g81/g86/g3/g86/g75/g68/g79/g79/g3/g81/g82/g87/g3/g72/g91/g70/g72/g72/g71/g3/g17/g19/g19/g24/g5/g3/g83/g72/g85/g3/g86/g76/g71/g72/g17 /g21/g17 /g39/g76/g80/g72/g81/g86/g76/g82/g81/g76/g81/g74/g3/g68/g81/g71/g3/g87/g82/g79/g72/g85/g68/g81/g70/g76/g81/g74/g3/g83/g72/g85/g3/g36/g54/g48/g40/g3/g60/g20/g23/g17/g24/g48/g17 /g37/g54/g38/g29 /g37/g68/g86/g76/g70/g3/g39/g76/g80/g72/g81/g86/g76/g82/g81/g17/g3/g55/g75/g72/g82/g85/g72/g87/g76/g70/g68/g79/g79/g92/g3/g72/g91/g68/g70/g87/g3/g89/g68/g79/g88/g72/g3/g86/g75/g82/g90/g81/g3/g90/g76/g87/g75/g82/g88/g87/g3/g87/g82/g79/g72/g85/g68/g81/g70/g72/g86/g17 /g49/g82/g87/g72/g29/g41/g82/g85/g3/g87/g75/g72/g3/g80/g82/g86/g87/g3/g70/g88/g85/g85/g72/g81/g87/g3/g83/g68/g70/g78/g68/g74/g72/g3/g71/g85/g68/g90/g76/g81/g74/g86/g15/g3/g83/g79/g72/g68/g86/g72/g3/g86/g72/g72/g3/g87/g75/g72/g3/g48/g76/g70/g85/g82/g70/g75/g76/g83/g3/g51/g68/g70/g78/g68/g74/g76/g81/g74/g3/g54/g83/g72/g70/g76/g73/g76/g70/g68/g87/g76/g82/g81/g3/g79/g82/g70/g68/g87/g72/g71/g3/g68/g87/g3 /g75/g87/g87/g83/g29/g18/g18/g90/g90/g90/g17/g80/g76/g70/g85/g82/g70/g75/g76/g83/g17/g70/g82/g80/g18/g83/g68/g70/g78/g68/g74/g76/g81/g74 /g56/g81/g76/g87/g86/g44/g49/g38/g43/g40/g54 /g39/g76/g80/g72/g81/g86/g76/g82/g81/g3/g47/g76/g80/g76/g87/g86 /g48/g44/g49 /g48/g36/g59 /g49/g88/g80/g69/g72/g85/g3/g82/g73/g3/g51/g76/g81/g86/g49 /g22 /g51/g76/g87/g70/g75 /g72 /g17/g19/g24/g19/g3/g37/g54/g38 /g37/g82/g87/g87/g82/g80/g3/g87/g82/g3/g51/g68/g70/g78/g68/g74/g72/g3/g41/g79/g68/g87 /g39 /g17/g20/g21/g24 /g17/g20/g25/g24 /g50/g89/g72/g85/g68/g79/g79/g3/g58/g76/g71/g87/g75 /g40 /g17/g20/g26/g24 /g17/g21/g19/g24 /g50/g89/g72/g85/g68/g79/g79/g3/g47/g72/g81/g74/g87/g75 /g36 /g17/g20/g26/g19 /g17/g21/g20/g19 /g48/g82/g79/g71/g72/g71/g3/g51/g68/g70/g78/g68/g74/g72/g3/g53/g68/g71/g76/g88/g86/g53 /g17/g19/g27/g19 /g17/g20/g19/g24 /g55/g76/g83/g3/g87/g82/g3/g54/g72/g68/g87/g76/g81/g74/g3/g51/g79/g68/g81/g72 /g47 /g17/g24/g19/g19 /g177 /g47/g72/g68/g71/g3/g55/g75/g76/g70/g78/g81/g72/g86/g86 /g70 /g17/g19/g20/g23 /g17/g19/g21/g20 /g47/g72/g68/g71/g3/g58/g76/g71/g87/g75 /g69 /g17/g19/g20/g23 /g17/g19/g21/g21 E A L b e c R D 1 2 3 /g48/g76/g70/g85/g82/g70/g75/g76/g83 /g55/g72/g70/g75/g81/g82/g79/g82/g74/g92 /g39/g85/g68/g90/g76/g81/g74 /g38/g19/g23/g16/g20/g19/g20/g37
DS21434J-page 14 2001-2011 Microchip Technology Inc. NOTES:
2001-2011 Microchip Technology Inc. DS21434J-page 15 TC54 APPENDIX A: REVISION HISTORY Revision J (June 2011) The following is the list of modifications: 1. Updated temperature values in Temperature Specifications table. 2. Corrected equation in Figure 4-1. 3. Added new examples layout in Section 5.1, Package Marking Information. Revision H (December 2007) The following is the list of modifications: 1. Updated Features section. 2. Removed 5-Pin SOT-23 related information. 3. Updated Output Current (I OUT) Electrical Specification. 4. Removed 7.7V (typical) Voltage Trip Point Option. Max Trip Point Voltage is now 6.0V. 5. Updated Pin Function Table. 6. Updated Packaging Specification Information. 7. Added Revision History section. 8. Updated Product Identification System page. Revision G (August 2004) Undocumented changes. Revision F (July 2004) Undocumented changes. Revision E (April 2003) Undocumented changes. Revision D (October 2002) Undocumented changes. Revision C (July 2002) Undocumented changes. Revision B (May 2002) Undocumented changes. Revision A (March 2001) Original Release of this Document.
DS21434J-page 16 2001-2011 Microchip Technology Inc. NOTES:
2001-2011 Microchip Technology Inc. DS21434J-page 17 TC54 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office . Device: TC54V: Voltage Detector Output Configuration: N = Nch Open-Drain C = CMOS Output Detected Voltage: 14 = 1.4V 21 = 2.1V 27 = 2.7V 29 = 2.9V 30 = 3.0V 42 = 4.2V 43 = 4.3V Extra Feature Code: 0 = Fixed Tolerance: 2 = 2% Temperature: E = -40°C to +85°C Package: CB = Plastic Small Outline Transistor, SOT-23A, 3-lead MB = Plastic Small Outline Transistor, SOT-89, 3-lead ZB = Plastic Transistor Outline, TO-92, 3-lead Taping Direction: 713 = Standard Taping PART NO. X XX PkgOutput Config. Device XX Detected Voltage X Extra Feature Code X Tolerance X Temp. XX Taping Direction Examples: a) TC54VC1402ECB713:Tape and Reel, 1.4V Voltage Detector, 2% Tol., SOT-23A-3. b) TC54VC1402EMB713:Tape and Reel, 1.4V Voltage Detector, 2% Tol., SOT-89-3. c) TC54VC1402EZB: 1.4V Voltage Detector, 2% Tol., TO-92. d) TC54VC2102ECB713: Tape and Reel, 2.1V Voltage Detector, 2% Tol., SOT-23A-3. e) TC54VC2102EMB713:Tape and Reel, 2.1V Voltage Detector, 2% Tol., SOT-89-3. f) TC54VC2102EZB: 2.1V Voltage Detector, 2% Tol., TO-92. g) TC54VC2702ECB713: Tape and Reel, 2.7V Voltage Detector, 2% Tol., SOT-23A-3. h) TC54VC3002ECB713: Tape and Reel, 3.0V Voltage Detector, 2% Tol., SOT-23A-3. i) TC54VN4202ECB713: Tape and Reel, 4.2V Voltage Detector,2% Tol., SOT-23A-3.
DS21434J-page 18 2001-2011 Microchip Technology Inc. NOTES:
2001-2011 Microchip Technology Inc. DS21434J-page 19 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY , PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE . Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2001-2011, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-61341-137-7 Note the following details of the code protection feature on Microchip devices:
- Microchip products meet the specification cont ained in their particular Microchip Data Sheet.
- Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions.
- There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
- Microchip is willing to work with the customer who is concerned about the integrity of their code.
- Neither Microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are co mmitted to continuously improvin g the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
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