C1458C

UPC1458 NEC | Alldatasheet

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GENERAL PURPOSE DUAL OPERATIONAL AMPLIFIER DESCRIPTION FEATURES The uPC1458 is a dual general purpose opera- + Internally frequency compensated tional amplifier having internal frequency compen- + Short circuit protection sating circuits. It is intended for a wide range of analog applications. High common mode voltage range and nolatch up tendencies make this amplifier ideal for use as a voltage follower. EQUIVALENT CIRCUIT (1/2 Circuit) CONNECTION DIAGRAM (Top View) ovt HPC1458C, 145862 Foto oft, trou S C1] . Qu out ela . ast tos} tes AN woos 30.0 hn — 7] our» ~) i Rs ‘On —+—O 39 kQ Ry {Rw OUT Qs Qs 50K ont} 325.2 inn le a] CQ . Qao Qre Q | po Os J vi PB] tne Qs Qs On _ oe — UL | Te nigh | ane Rn ort hee 1kQ SR: SR: FER ska] 50ko _oy- 50kQ 1kQ 502

ORDERING INFORMATION

PART NUMBER PACKAGE QUALITY GRADE HPC1458C 8 PIN PLASTIC DIP (300 mil) __| Standard HPC1458G2 8 PIN PLASTIC SOP (225 mil) Standard Please refer to "Quality grade on NEC Semiconductor Devices" (Document number IE|-1209) published by NEC Corporation to know the specification of quality grade on the devices and its recommended applications. Document No. IC-19734 (0.0. No. IC-6306B) Date Published March 1993P Printed in Japan

ABSOLUTE MAXIMUM RATINGS (Ta = 25 ‘C) Input Voltage (Note 2) vu v G2 Peckage ote wa Output Short Circuit Duration (Note 6) Note 1. Reverse connection of supply voltage can cause destruction. Note 2. The input voltage should be allowed to input without damage or destruction. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The normal operation will establish when the both inputs are within the Common Mode Input Voltage Range of electrical characteristics. Note 3. This specification is the voltage which should be allowed to supply to the output terminal from external without damage or destruction. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The output voltage of normal operation will be the Output Voltage Swing of electrical characteristics. Note 4. Thermal derating factor is -5.0 mW/C when ambient temperature is higher than 55 °C. Note 5. Thermal derating factor is -4.4 mW/‘C when ambient temperature is higher than 25 °C. Note 6. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Notes 4 and 5, RECOMMENDED OPERATING CONDITIONS [__eraracrensn Sins an [eto] [Sevvomeesom SPs |e Supply Voltage (V~ = GND) ve +15 [| +32 v Ao a ee]

ELECTRICAL CHARACTERISTICS (V* = +15V, Ta = 25 °C) Prewroreetvowse [ve [| so | sso | wv [mown | Fail a adn Drift [irostOfee Covert own | ie | | aw [me fm [id [ieutinpence «|e | os | ve |e [sveei coment |e P| a8 | 88 | mA [on oA mannii | [Sconce am_| esp aan [sin vor enionnane [sm [| » [we [ww [Rewxa | Output Voltage Swing Vom p= fet of RL> 10 kQ -12 -11 jeer fe et P| Range Vr#2 [conns Spmrion || |e [oe | Note 7. Input bias currents flow into IC. Because each currents are base current of NPN-transistor on input stage.

TYPICAL PERFORMANCE CHARACTERISTICS (To = 25 °C, TYP.) POWER DISSIPATION OPEN LOOP FREQUENCY RESPONSE 600 120 [ [Ty TPT Tt no Wt ese] = oo 1] TTT Pr ee ee tL teaga [TT oN] | TT 8 iN 2 0 IN 2 wm NN S of | TNE 8 eee Nee 3 50 tf Aff PPE) SENS 8 3 NX ‘ PREEEEE ry 8 sf ET = 1 100 20 si TT TT [| o> 1 | tt NI 0 20 40 60 80 100 1 10 100 1k 10k 100 k 1M Ta~— Ambient Temperature ~ °C f - Frequency ~ Hz LARGE SIGNAL FREQUENCY RESPONSE OUTPUT VOLTAGE SWING 2 = rn a nr ee Se g 2 Pp Te = 25 CS £ 39 LE 00 > i | Ri>10kQ = Ae 2% 2 EHH = ee ee ee ee s EC & x 8 OA 3 | 3 20 oe EB is 2 Ee 2s gs Pt 00 z oe oo 3 2 8 ero oe 8 |_| \\ 2 oo OA oo 38 8 YAH : 7 OI ao § | XU 6 Se aol “4 ‘ 7 HE Et ° PN ° Ferree rt : ik 10k 100 k 1M 100 1k 10k 100 k | f - Frequency ~ Hz Ru — Load Resistance - Q OUTPUT VOLTAGE SWING POWER CONSUMPTION HH Ass | A ee £ oH EE ET TT] pezke = ol li try tT yy » LEP P PTT y ee EPP ETT PTT] e Lt ae se {][ TTT |_| Sees el Oa 8 | | jf TY | ge A oe on | | | Yr £ S g i | Ter é |_| ev I [| y | Lj eT TT Ti 0 +10 +20 0 £10 £20 V# ~ Supply Voltage - V V+ ~ Supply Voltage ~ V

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8PIN PLASTIC DIP (300 mil) ~ 8 5 A K P o lz | F mil cB M O~15° D P8C-100-300B,C we 1) Each lead centerline is located within 0.25 tem “K” to center of leads when forme: parallel. [> | osorore | 0.020 °8:888 32208 012620012 — 0.51 MIN. | 0.020 MIN. | earwac [ 00 mac Par [0258 | oorotta

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8 PIN PLASTIC SOP (225 mil)

P) ft Ty Ty Oa, Hoe se Bs Ch O OO 7 a A H a f. fo VELET ET LY TV —oe oT “ 8 [oN } D a S8GM-50-2258-2 NOTE ITEM| MILLIMETERS INCHES Each lead centerline is located within 0.12 F 1.8 MAX. 0.071MAX : [n | 018 0.006

RECOMMENDED SOLDERING CONDITIONS The following conditions (see table below) must be met when soldering this product. Please consult with our sales offices in case other soldering process is used, or in case soldering is done under different conditions. TYPES OF SURFACE MOUNT DEVICE For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL” (IEI-1207). [uPC1458G2] R ded conditi Soldering method Soldering conditions seommended condition symbol Infrared ray reflow Peak package's surface temperature: 230 °C or below, IR30 - 00-1 Reflow time: 30 seconds or below (210 °C or higher), | Number of reflow process: 1, Exposure limit °: None | vPs Peak package’s surface temperature: 215 °C or below, VP15 - 00-1 Reflow time: 40 seconds or below (200 °C or higher), | Number of reflow process: 1, Exposure limit *: None | Wave soldering Solder temperature: 260 °C or below, WS15 - 00-1 \\ Flow time: 10 seconds or below, | Number of flow process: 1, Exposure limit *; None i Partial heating Terminal temperature: 300 °C or below, oO | method Flow time: 10 seconds or below, Exposure limit *: None i * Exposure limit before soldering after dry-pack package is opened. | Storage conditions: 25 °C and relative humidity at 65 % or less. i Note Do not apply more than a single process at once, except for “Partial heating method”. i TYPES OF THROUGH HOLE DEVICE [uPC1458C] Soldering method Soldering conditions Recommended condition symbol Wave soldering Solder temperature: 260 °C or below, ie) Flow time: 10 seconds or below

[MEMO]

No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation, NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. The devices listed in this document are not suitable for use in aerospace equipment, submarine cables, nuclear reactor control systems and life support systems. If customers intend to use NEC devices for above applications or they intend to use "Standard" quality grade NEC devices for applications not intended by NEC, please contact our sales people in advance. Application examples recommended by NEC Corporation Standard: Computer, Office equipment, Communication equipment, Test and Measurement equipment, Machine tools, Industrial robots, Audio and Visual equipment, Other consumer products, etc. Special: Automotive and Transportation equipment, Traffic control systems, Antidisaster systems, Anticrime systems, etc. M4 92.6 Serene