C1411VOA | DigiCamel IC Datasheet

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TC1411_06 MICROCHIP | Alldatasheet

Document overview

Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
PDF pages: 18

Technical content

Features

Latch-Up Protected: Will Withstand 500 mA Reverse Current
Input Will Withstand Negative Inputs Up to 5V
ESD Protected: 4 kV
High Peak Output Current: 1A
Wide Input Supply Voltage Operating Range: - 4.5V to 16V
High Capacitive Load Drive Capability: - 1000 pF in 25 nsec
Short Delay Time: 30 nsec Typ.
Matched Delay Times
Low Supply Current - With Logic ‘1’ Input: 500 µA - With Logic ‘0’ Input: 100 µA
Low Output Impedance: 8Ω
Available in Space-Saving 8-pin MSOP Package
Pinout Same as TC1410/TC1412/TC1413

Applications

Switch Mode Power Supplies
Pulse Transformer Drive
Line Drivers
Relay Driver

Description

The TC1411/TC1411N are 1A CMOS buffers/drivers. They will not latch-up under any conditions within their power and voltage ratings. They are not subject to damage when up to 5V of noise spiking of either polarity occurs on the ground pin. They can accept, without damage or logic upset, up to 500 mA of current of either polarity being forced back into their output. All terminals are fully protected against up to 4 kV of electrostatic discharge. As MOSFET drivers, the TC1411/TC1411N can easily charge a 1000 pF gate capacitance in 25 nsec with matched rise and fall times, and provide low enough impedance in both the ON and the OFF states to ensure the MOSFET’s intended state will not be affected, even by large transients. The leading and trailing edge propagation delay times are also matched to allow driving short-duration inputs with greater accuracy. Package Types VDD IN NC GND VDD OUT GND OUT 8-Pin MSOP/PDIP/SOIC VDD OUT GND VDD IN NC GND OUT TC1411 NC = No Internal Connection 6,7 Inverting 6,7 Non-Inverting TC1411N Note: Duplicate pins must be connected together for proper operation. 1A High-Speed MOSFET Drivers

© 2006 Microchip Technology Inc. DS21390D-page 3 TC1411/TC1411N 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Power Dissipation (TA ≤ 70°C) † Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. DC CHARACTERISTICS Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V ≤ VDD ≤ 16V. Typical values are measured at TA = +25°C, VDD = 16V. Parameters Sym Min Typ Max Units Conditions Input Logic ‘1’, High Input Voltage VIH 2.0 V Logic ‘0’, Low Input Voltage VIL 0.8 V Input Current IIN -1.0 1.0 µA 0V ≤ VIN ≤ VDD, TA = +25°C -10 -40°C ≤ TA ≤ +85°C Output High Output Voltage VOH VDD – 0.025 V DC Test Low Output Voltage VOL 0.025 V DC Test Output Resistance RO Ω VDD = 16V, IO = 10 mA, TA = +25°C 0°C ≤ TA ≤ +70°C -40°C ≤ TA ≤ +85°C Peak Output Current IPK 1.0 A VDD = 16V Latch-Up Protection Withstand Reverse Current IREV 0.5 A Duty cycle ≤ 2%, t ≤ 300 µs, VDD = 16V Switching Time (Note 1) Rise Time tR ns TA = +25°C 0°C ≤ TA ≤ +70°C -40°C ≤ TA ≤ +85°C, Figure 4-1 Fall Time tF ns TA = +25°C 0°C ≤ TA ≤ +70°C -40°C ≤ TA ≤ +85°C, Figure 4-1 Delay Time tD1 ns TA = +25°C, 0°C ≤ TA ≤ +70°C -40°C ≤ TA ≤ +85°C, Figure 4-1 Delay Time tD2 ns TA = +25°C 0°C ≤ TA ≤ +70°C -40°C ≤ TA ≤ +85°C, Figure 4-1 Power Supply Power Supply Current IS 0.5 1.0 mA VIN = 3V, VDD = 16V 0.1 0.15 VIN = 0V Note 1: Switching times ensured by design.

© 2006 Microchip Technology Inc. TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V ≤ VDD ≤ 16V. Parameters Sym Min Typ Max Units Conditions Temperature Ranges Specified Temperature Range (C) TA +70 ºC Specified Temperature Range (E) TA -40 +85 ºC Specified Temperature Range (V) TA -40 +125 ºC Maximum Junction Temperature TJ +150 ºC Storage Temperature Range TA -65 +150 ºC Package Thermal Resistances Thermal Resistance, 8L-MSOP θJA 206 ºC/W Thermal Resistance, 8L-PDIP θJA 125 ºC/W Thermal Resistance, 8L-SOIC θJA 155 ºC/W

© 2006 Microchip Technology Inc. DS21390D-page 7 TC1411/TC1411N 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE 3.1 Supply Input (VDD) The VDD input is the bias supply for the MOSFET driver and is rated for 4.5V to 16V with respect to the ground pin. The VDD input should be bypassed to ground with a local ceramic capacitor. The value of the capacitor should be chosen based on the capacitive load that is being driven. A value of 1.0 µF is suggested. 3.2 Control Input (INPUT) The MOSFET driver input is a high-impedance, TTL/CMOS-compatible input. The input has 300 mV of hysteresis between the high and low thresholds that prevents output glitching even when the rise and fall time of the input signal is very slow. 3.3 CMOS Push-pull Output (OUTPUT) The MOSFET driver output is a low impedance, CMOS push-pull style output, capable of driving a capacitive load with 1A peak currents. 3.4 Ground (GND) The ground pins are the return path for the bias current and for the high peak currents which discharge the load capacitor. The ground pins should be tied into a ground plane or have very short traces to the bias supply source return. 3.5 No Connect (NC) No internal connection. Pin No. Symbol Supply input, 4.5V to 16V INPUT Control input NC No connection GND Ground GND Ground OUTPUT CMOS push-pull output, common to pin 7 OUTPUT CMOS push-pull output, common to pin 6 VDD Supply input, 4.5V to 16V

APPLICATION INFORMATION

FIGURE 4-1: Switching Time Test Circuit. CL = 1000 pF 0.1 µF 4.7 µF Inverting Driver Non-Inverting Driver Input VDD = 16V Input Output tD1 tF tR tD2 Input: 100 kHz, square wave, tRISE = tFALL ≤ 10 nsec Output Input Output tD1 tF tR tD2 +5V 10% 90% 10% 90% 10% 90% VDD 90% 10% 10% 10% 90% +5V VDD 90% 4, 5 6, 7 1, 8 TC1411 TC1411N TC1411N TC1411

© 2006 Microchip Technology Inc. DS21390D-page 9 TC1411/TC1411N 5.0 PACKAGING INFORMATION 5.1 Package Marking Information XXXXXXXX XXXXXNNN YYWW 8-Lead PDIP (300 mil) Example: TC1411 CPA^^256 0635 8-Lead SOIC (150 mil) Example: XXXXXXXX XXXXYYWW NNN TC1411C OA^^0635 256 8-Lead MSOP Example: XXXXXXX YWWNNN 1411NE 635256 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. e e e e

© 2006 Microchip Technology Inc. 8-Lead Plastic Micro Small Outline Package (UA) (MSOP) D A L c α E p B n φ β F Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. .037 REF F Footprint (Reference) Notes: Revised 07-21-05 * Controlling Parameter Mold Draft Angle Top Mold Draft Angle Bottom Foot Angle Lead Width Lead Thickness β α c B φ .003 .009 .006 .012 Dimension Limits Overall Height Molded Package Thickness Molded Package Width Overall Length Foot Length Standoff Overall Width Number of Pins Pitch A L D E .016 .024 .118 BSC .118 BSC .000 .030 .193 BSC .033 MIN p n Units .026 BSC NOM INCHES

0.95 REF

.009 .016 0.08 0.22 0.23 0.40 MILLIMETERS*

0.65 BSC

0.85

3.00 BSC

0.60

4.90 BSC

.043 .031 .037 .006 0.40 0.00 0.75 MIN MAX NOM 1.10 0.80 0.15 0.95 MAX 15° 15° JEDEC Equivalent: MO-187 15° 15° BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. See ASME Y14.5M See ASME Y14.5M Drawing No. C04-111 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

© 2006 Microchip Technology Inc. DS21390D-page 11 TC1411/TC1411N 8-Lead Plastic Dual In-line (PA) – 300 mil (PDIP) B A L p α E eB β c n D Units INCHES* MILLIMETERS Dimension Limits MIN NOM MAX MIN NOM MAX Number of Pins n Pitch p .100 2.54 Top to Seating Plane A .140 .155 .170 3.56 3.94 4.32 Molded Package Thickness .115 .130 .145 2.92 3.30 3.68 Base to Seating Plane .015 0.38 Shoulder to Shoulder Width E .300 .313 .325 7.62 7.94 8.26 Molded Package Width .240 .250 .260 6.10 6.35 6.60 Overall Length D .360 .373 .385 9.14 9.46 9.78 Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43 Lead Thickness c .008 .012 .015 0.20 0.29 0.38 Upper Lead Width .045 .058 .070 1.14 1.46 1.78 Lower Lead Width B .014 .018 .022 0.36 0.46 0.56 Overall Row Spacing eB .310 .370 .430 7.87 9.40 10.92 Mold Draft Angle Top α Mold Draft Angle Bottom β * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018 § Significant Characteristic Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

© 2006 Microchip Technology Inc. 8-Lead Plastic Small Outline (OA) – Narrow, 150 mil (SOIC) Foot Angle φ β Mold Draft Angle Bottom α Mold Draft Angle Top 0.51 0.42 0.33 .020 .017 .013 B Lead Width 0.25 0.23 0.20 .010 .009 .008 c Lead Thickness 0.76 0.62 0.48 .030 .025 .019 L Foot Length 0.51 0.38 0.25 .020 .015 .010 h Chamfer Distance 5.00 4.90 4.80 .197 .193 .189 D Overall Length 3.99 3.91 3.71 .157 .154 .146 Molded Package Width 6.20 6.02 5.79 .244 .237 .228 E Overall Width 0.25 0.18 0.10 .010 .007 .004 Standoff 1.55 1.42 1.32 .061 .056 .052 Molded Package Thickness 1.75 1.55 1.35 .069 .061 .053 A Overall Height 1.27 .050 p Pitch n Number of Pins MAX NOM MIN MAX NOM MIN Dimension Limits MILLIMETERS INCHES* Units D n p B E h L β c 45° φ α A * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057 § Significant Characteristic Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

REVISION HISTORY

Revision D (September 2006)

Added -40°C to +125°C temperature range to Temperature Characteristics table and Product Information System page.
Added disclaimer to package outline drawings. Revision C (March 2003)
Added 8-Lead MSOP Package. Revision B (May 2002)
Converted TELCOM data sheet for Embedded Control Handbook Revision A (March 2001)
Original Release of this Document.

© 2006 Microchip Technology Inc. DS21390D-page 15 TC1411/TC1411N PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Device: TC1411:

1 A Single MOSFET Driver, Inverting

TC1411N: 1 A Single MOSFET Driver, Non-Inverting Temperature Range: C 0°C to +70°C E -40°C to +85°C V -40°C to +125°C Package: OA = Plastic SOIC, (150 mil Body), 8-lead OA713 = Plastic SOIC, (150 mil Body), 8-lead (Tape and Reel) UA = Plastic Micro Small Outline (MSOP), 8-lead * UA713 = Plastic Micro Small Outline (MSOP), 8-lead * (Tape and Reel) PA = Plastic DIP (300 mil Body), 8-lead * MSOP package is only available in E-Temp. PART NO. X /XX Package Temperature Range Device Examples: TC1411COA: 1A Single MOSFET driver, 8LD SOIC pkg, 0°C to +70°C. TC1411CPA: 1A Single MOSFET driver, 8LD PDIP package, 0°C to +70°C. TC1411EUA713: Tape and Reel, 1A Single MOSFET driver, 8LD MSOP package, -40°C to +85°C. TC1411VOA713: Tape and Reel, 1A Single MOSFET driver, 8LD SOIC pkg, -40°C to +125°C. TC1411NCPA: 1A Single MOSFET driver, 8LD PDIP package, 0°C to +70°C. TC1411NEPA: 1A Single MOSFET driver, 8LD PDIP package, -40°C to +85°C. TC1411NEUA: 1A Single MOSFET driver, 8LD MSOP package, -40°C to +85°C. TC1411NVPA: 1A Single MOSFET driver, 8LD PDIP package, -40°C to +125°C

© 2006 Microchip Technology Inc. DS21390D-page 17 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2006, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Note the following details of the code protection feature on Microchip devices: Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

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Product Information

C1411VOA specifications and overview.

Summary

1A High-Speed MOSFET Drivers 2006

Description

1A High-Speed MOSFET Drivers 2006

Source title C1411VOA Datasheet(PDF) - Microchip Technology

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