C0630X104JMGECAUTO

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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C 1091_C0G_ESD • 12/5/2016 One world. One KEMET Benefits

• AEC–Q200 automotive qualified ESD Qualified per HBM AEC Q200–002 A vailable in package size EIA 0603 (1608) D C Voltage ratings of 25V – 200V C apacitance range from 1nF to 15nF
• −55°C to +125°C operating temperature range
• Lead (Pb)-Free, RoHS and REACH compliant
• Available capacitance tolerances of ±1%, ±2%, ±5%, ±10%, and ±20% N o piezoelectric noise
• Extremely low ESR and ESL
• High thermal stability
• High ripple current capability Overview KEMET’s ESD Rated Commercial and Automotive Grade Series surface mount capacitors in C0G dielectric are suited for a variety of

applications

(ESD Electro Static Dischar ge). These ESD rated capacitors provide the ability t o design to a given ESD criteria per the Human Body Model (HBM) AEC Q200–002 criteria. KEMET's automotive gr ade series capacitors also meet the other demanding A utomotive Electronics Council's AEC–Q200 qualification r equirements. The C0G dielectric features a 125°C maximum operating temper ature and is considered “stable.” The Electronics Industries Alliance (EIA) characterizes C0G dielectric as a Class I material. Components of this classification are temper ature compensating and are suited for resonant circuit Q and stability of capacitance char acteristics are required. The C0G dielectric exhibits no change in capacitance with respect to time and voltage and boasts a negligible change in capacitance compared to its v alue at 25°C. Capacitance change is limited to ±30ppm/°C fr om −55°C to +125°C. Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)

Ordering Information

C 0603 C 104 J 3 R E C AUTO Ceramic Case Size (L" x W") Specification/ Series Capacitance Code (pF) Capacitance Tolerance1 Rated Voltage (VDC) Dielectric Failure Rate/ Design Termination Finish2 Packaging/ Grade (C-Spec)

0603 C = Standard

X Flexible T ermination Two significant d igits and n umber of zeros F = ±1% G ±2% J ±5% K ±10% M ±20% 3 = 25 M 100 200 G = C0G E = ESD C = 100% M atte Sn See "Packaging C-Spec Ordering Options Table" below 1 Additional capacitance tolerance offerings may be available. Contact KEMET for details. 2 Additional termination finish options may be available. Contact KEMET for details.

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C 1091_C0G_ESD • 12/5/2016 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade) Benefits (cont'd)

• Preferred capacitance solution at line frequencies and i nto the MHz range
• No capacitance changes with respect to applied DC v oltage
• Negligible capacitance change with respect to temperature fr om −55°C to +125°C
• No capacitance decay with time
• Non-polar devices, minimizing installation concerns
• 100% pure matte tin-plated termination finish allowing for ex cellent s olderability
• F lexible Termination option available
• EIA 0805 and 1206 Case Sizes Under Development

Typical applications include: ESD (Electrostatic discharge), Integrated Circuit (IC) Protection, RF filtering function, input and output automotive like: controllers, navigation systems, airbags and keyless systems Table 1 – Capacitance Range/Selection Waterfall (0603 Case Size) Capacitance Cap Code Case Size/ Series C0603C Rated Voltage (VDC) 25 50 63 100 200 Voltage Code 3 5 M 1 2 Cap Tolerance ESD Level per AEC–Q200 1.0nF 102 F ±1% G ±2% J ±5% K ±10% M ±20% 6KV 6KV 6KV 6KV 6KV 1.5nF 152 8KV 8KV 8KV 8KV 8KV 2.2nF 222 12KV 12KV 12KV 12KV 12KV 3.3nF 332 16KV 16KV 16KV 16KV 4.7nF 472 16KV 16KV 16KV 16KV 6.8nF 682 25KV 25KV 10nF 103 25KV 15nF 153 25KV

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C 1091_C0G_ESD • 12/5/2016 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade) Packaging C-Spec Ordering Options Table Packaging Type Packaging/Grade Ordering Code (C-Spec) Commercial Grade1 Bulk Bag Not required (Blank) 7" Reel/Unmarked TU 13" Reel/Unmarked 7411 (EIA 0603 and smaller case sizes) 7210 (EIA 0805 and larger case sizes) 7" Reel/Unmarked/2mm pitch 2 7081 13" Reel/Unmarked/2mm pitch 2 7082 Automotive Grade3 7" Reel AUTO 13" Reel / Unmarked AUTO7411 (EIA 0603 and smaller case sizes) AUTO7210 (EIA 0805 and larger case sizes) 7" Reel/Unmarked/2mm pitch 2 3190 13" Reel/Unmarked/2mm pitch 2 3191 1 Default packaging is "Bulk Bag". An ordering code C-Spec is not required for "Bulk Bag" packaging. 1 The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain capacitors that have not been laser marked. The option to laser mark is not available on these devices. For more information see "Capacitor Marking". 2 The 2mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case size devices. For more information regarding 2mm pitch option see "Tape & Reel Packaging Information". 3 Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L" x W") and thickness dimension. See "Chip Thickness/Tape & Reel Packaging Quantities" and "Tape & Reel Packaging Information". 3 For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information". 3 All Automotive packaging C-Specs listed exclude the option to laser mark components. The option to laser mark is not available on these devices. For more information see "Capacitor Marking". Dimensions – Millimeters (Inches) L B W S T EIA Size Code Metric Size Code L Length W Width T Thickness B Bandwidth S Separation Minimum Mounting Technique Without Flexible Termination 0603 1608 1.60 (0.063) ±0.15 (0.006) 0.80 (0.032) ±0.15 (0.006) See Table 2 for Thickness 0.35 (0.014) Wave or Solder Reflow With Flexible Termination 0603 1608 1.60 (0.063) ±0.17 (0.007) 0.80 (0.032) ±0.15 (0.006) See Table 2 for Thickness 0.45 (0.018) Wave or Solder Reflow

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C 1091_C0G_ESD • 12/5/2016 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade) Automotive C-Spec Information KEMET Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualifi cation for Passive Components. These products are supported by a Product Change Notifi cation (PCN) and Production Part Approval Process warrant (PPAP). Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “9170”. This C-Spec was developed in order to better serve small and medium sized companies that prefer an automotive grade component without the requirement to submit a customer Source Controlled Drawing (SCD) or specifi cation for review by a KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET’s OEM Automotive customers and are not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited (see details below). Product Change Notifi cation (PCN) The KEMET Product Change Notifi cation system is used to communicate primarily the following types of changes:

• Product/process changes that affect product form, fi t, function, and/or reliability
• Changes in manufacturing site
• Product obsolescence KEMET Automotive C-Spec Customer Notifi cation due to: Days prior to implementationProcess/Product change Obsolescence* KEMET assigned1 Yes (with approval and sign off) Yes 180 days Minimum AUTO Yes (without approval) Yes 90 days Minimum 1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specifi cation for review. For additional information contact KEMET. Production Part Approval Process (PPAP) The purpose of the Production Part Approval Process is:
• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.
• To provide the evidence that all customer engineering design record and specifi cation requirements are properly understood and fulfi lled by the manufacturing organization.
• To demonstrate that the established manufacturing process has the potential to produce the part KEMET Automotive C-Spec PPAP (Product Part Approval Process) Level 1 2 3 4 5 KEMET assigned1 ● ● ● ● ● AUTO ○ ○ 1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specifi cation for review. For additional information contact KEMET.
• Part Number specifi c PPAP available ○ Product family PPAP only

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C 1091_C0G_ESD • 12/5/2016 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade) Qualification/Certification Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are r eferenced in T able Performance Reliability. Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details r egarding test methods and conditions are referenced in document AEC–Q200, Stress T est Qualification for Passive Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their website at www .aecouncil.com. Environmental Compliance Lead (Pb)-free, RoHS, and REACH compliant without exemptions. Electrical Parameters/Characteristics Item Parameters/Characteristics Operating Temperature Range − 55°C to +125°C C apacitance Change with Reference to +25°C and VDC Applied (TCC) ±30 ppm/ºC Aging Rate (Maximum Capacitance Loss/Decade Hour) 0% 1Dielectric Withstanding Voltage (DWV) 250% of rated voltage (5±1 seconds and charge/discharge not exceeding 50mA)" 2Dissipation Factor (DF) Maximum Limit at 25°C 0 .1% 3Insulation Resistance (IR) Minimum Limit at 25°C 1,000 megohm microfarads or 100 GΩ (Rated voltage applied for 120±5 seconds at 25°C) 1 DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the capacitor.

2 Capacitance and dissipation factor (DF) measured under the following conditions:

Hz ±100 kHz and 1.0 ±0.2 Vrms if capacitance ≤ 1,000 pF 1 k Hz ±50 Hz and 1.0 ±0.2 Vrms if capacitance > 1,000 pF 3 To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits. Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as Automatic Level Control (ALC). The ALC feature should be switched to "ON." Post Environmental Limits Post Environmental Limits Dielectric Rated DC V oltage Capacitance Dissipation Factor (Maximum %) Capacitance Shift I nsulation Resistance C0G All All 0.5 0.3% or ±0.25 pf 10% of Initial Limit

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C 1091_C0G_ESD • 12/5/2016 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade) Table 2 – Capacitance Range/Selection Waterfall (0603 Case Size) Capacitance Cap Code Case Size / Series C0603C Voltage Code 3 5 M 1 2 Rated Voltage (VDC) 100 200 Capacitance Tolerance Product Availability and Chip Thickness Codes – See Packaging Specs for Chip Thickness Dimensions 1,000 pF 102 F G J K M CF CF CF CF CF 1,500 pF 152 F G J K M CF CF CF CF CF 2,200 pF 222 F G J K M CF CF CF CF CF 3,300 pF 332 F G J K M CF CF CF CF 4,700 pF 472 F G J K M CF CF CF CF 6,800 pF 682 F G J K M CF CF 10,000 pF 103 F G J K M CF 15,000 pF 153 F G J K M CF Capacitance Cap Code Rated Voltage (VDC) 3 5 M 1 2 Voltage Code 100 200 Case Size /Series C0603C These products are protected under US Patent 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts. Table 3 – Chip Thickness/Tape & Reel Packaging Quantities Thickness Code Case Size1 Thickness ± Range (mm) Paper Quantity1 Plastic Quantity 7" Reel 13" Reel 7" Reel 13" Reel CF 0603 0.80 ± 0.07* 4,000 15,000 0 0

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C 1091_C0G_ESD • 12/5/2016 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade) Table 4 – Land Pattern Design Recommendations per IPC–7351 EIA Size Code Metric Size Code Density Level A: Maximum (Most) Land Protrusion (mm) Density Level B: Median (Nominal) Land Protrusion (mm) Density Level C: Minimum (Least) Land Protrusion (mm) C Y X V1 V2 C Y X V1 V2 C Y X V1 V2 Without Flexible Termination With Flexible Termination Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351). Y C C X X Grid Placement Courtyard Y

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C 1091_C0G_ESD • 12/5/2016 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade) Soldering Process Recommended Soldering Technique: Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 All other EIA case sizes are limited to solder reflow only Recommended Reflow Soldering Profile: KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), conv ection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal str ess. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J- STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions. Profile Feature Termination Finish 100% Matte Sn Preheat/Soak Temperature Minimum (T Smin) 150°C Temperature Maximum (T Smax) 200°C Time (tS) from TSmin to TSmax 60 – 120 seconds Ramp-Up Rate (TL to TP) 3°C/second m aximum Liquidous Temperature (TL) 217°C Time Above Liquidous (tL) 60 – 150 seconds Peak Temperature (T P) 260°C Time Within 5°C of Maximum Peak T emperature (t P) 30 seconds maximum Ramp-Down Rat e ( TP to TL) 6°C/second m aximum Time 25°C to Peak Temperature 8 minutes maximum Note 1: All temperatures refer to the center of the package, measured on the capacitor body surface that is facing up during assembly reflow. Time Temperature Tsmin Tsmax TL TP Maximum Ramp Up Rate = 3ºC/sec Maximum Ramp Down Rate = 6ºC/sec tP tL ts 25ºC to Peak

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C 1091_C0G_ESD • 12/5/2016 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade) Table 5 – Performance & Reliability: Test Methods and Conditions Stress Reference Test or Inspection Method Terminal S trength JIS–C–6429 Appendix 1, Note: Force of 1.8 kg for 60 seconds. Board Flex JIS–C–6429 Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G. Flexible termination system – 3.0 mm (minimum). Solderability J–STD–002 Magnification Conditions: Method hours at 155°C, dry heat at 235°C Method B at 215°C category Method category at 260°C Temperature Cycling JESD22 Method JA–104 1,000 Cycles (−55°C to +125°C). Measurement at hours +/− hours after test conclusion. Biased Humidity MIL–STD–202 Method Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor. Measurement at 24 hours +/− 4 hours after test conclusion. Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor. Measurement at 24 hours +/− 4 hours after test conclusion. Moisture Resistance MIL–STD–202 Method 106 t = 24 hours/cycle. Steps 7a and 7b not required. Measurement at 24 hours +/− 4 hours after test conclusion. Thermal Shock M IL–STD–202 Method 1 07 −55°C/+125°C. Note: Number of cycles required – 300. Maximum transfer time – 20 seconds. Dwell time – 15 minutes. Air – Air. High Temperature Life M IL–STD–202 Method 1 08/EIA–198 1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 2 X rated voltage applied. Storage Life MIL–STD–202 Method 108 150°C, 0 VDC for 1,000 hours. V ibration MIL–STD–202 Method g's for minutes, cycles each of orientations. Note: Use X PCB 0.031" thick secure points on one long side and secure points at corners of opposite sides. Parts m ounted within from any secure point. Test from 2,000 Hz Mechanical S hock MIL–STD–202 Method 213 Figure 1 of Method 213, Condition F. R esistance to Solvents MIL–STD–202 Method 215 Add aqueous wash chemical, OKEM Clean or equivalent. Storage and Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum st orage humidity not exceed 70% relative humidity. T emperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of receipt.

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C 1091_C0G_ESD • 12/5/2016 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade) Construction – Standard Termination Detailed Cross Section Barrier Layer (Ni) Dielectric Material (CaZrO3) End Termination/ External Electrode (Cu) Dielectric Material (CaZrO3) Barrier Layer (Ni) End Termination/ External Electrode (Cu) Termination Finish (100% Matte Sn) Inner Electrodes (Ni) Inner Electrodes (Ni) Termination Finish (100% Matte Sn) Construction – Flexible Termination Dielectric Material (CaZrO3) Detailed Cross Section Inner Electrodes (Ni) Barrier Layer (Ni) Termination Finish (100% Matte Sn) Inner Electrodes (Ni) Dielectric Material (CaZrO3) Epoxy Layer (Ag) End Termination/ External Electrode (Cu) Barrier Layer (Ni) Termination Finish (100% Matte Sn) Epoxy Layer (Ag) End Termination/ External Electrode (Cu)

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C 1091_C0G_ESD • 12/5/2016 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade) Capacitor Marking (Optional): Laser marking option is not available on: C0G, Ultra Stable X8R and Y5V dielectric devices EIA 0402 case size devices EIA 0603 case size devices w ith Flexible Termination option.

• KPS Commercial and Automotive grade stacked devices. These capacitors are supplied unmarked only.

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C 1091_C0G_ESD • 12/5/2016 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade) Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips. 8 mm, 12 mm or 16 mm Carrier Tape 178 mm (7.00") or 330 mm (13.00") Anti-Static Reel Embossed Plastic* or Punched Paper Carrier. Embossment or Punched Cavity Anti-Static Cover T ape (.10 mm (.004") Maximum Thickness) Chip and KPS Orientation in Pocket (except 1825 Commercial, and 1825 and 2225 Military) *EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only. KEMET Bar Code Label Sprocket Holes Table 5 – Carrier Tape Confi guration, Embossed Plastic & Punched Paper (mm) EIA Case Size Tape Size (W)* Embossed Plastic Punched Paper 7" Reel 13" Reel 7" Reel 13" Reel Pitch (P1)* Pitch (P1)* 01005 – 0402 8 2 2 0603 8 2/4 2/4 0805 8 4 4 4 4 1206 – 1210 8 4 4 4 4 1805 – 1808 12 4 4 ≥ 1812 12 8 8 KPS 1210 12 8 8 KPS 1812 & 2220 16 12 12 Array 0508 & 0612 8 4 4 *Refer to Figures 1 & 2 for W and P 1 carrier tape reference locations. *Refer to Tables 6 & 7 for tolerance specifi cations. New 2 mm Pitch Reel Options* Packaging Ordering Code (C-Spec) Packaging Type/Options C-3190 Automotive grade 7" reel unmarked C-3191 Automotive grade 13" reel unmarked C-7081 Commercial grade 7" reel unmarked C-7082 Commercial grade 13" reel unmarked * 2 mm pitch reel only available for 0603 EIA case size. 2 mm pitch reel for 0805 EIA case size under development. Benefi ts of Changing from 4 mm to 2 mm Pitching Spacing

• Lower placement costs
• Double the parts on each reel results in fewer reel changes and increased effi ciency
• Fewer reels result in lower packaging, shipping and storage costs, reducing waste

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C 1091_C0G_ESD • 12/5/2016 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade) Figure 2 – Punched (Paper) Carrier Tape Dimensions User Direction of Unreeling Top Cover Tape T Center Lines of Cavity ØDo Po E1 F W G Cavity Size, See Note 1, Table 7 Bottom Cover Tape Bottom Cover Tape [10 pitches cumulative tolerance on tape ± 0.2 mm] Table 7 – Punched (Paper) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size D0 E1 P0 P2 T1 Maximum G Minimum R Reference Note 2 1.75 ±0.10 (0.069 ±0.004) 4.0 ±0.10 (0.157 ±0.004) 2.0 ±0.05 (0.079 ±0.002) 0.10 (0.004) Maximum 0.75 (0.030) (0.984) Variable Dimensions — Millimeters (Inches) Tape Size Pitch E2 Minimum F P1 T Maximum W Maximum A0 B0 8 mm Half (2 mm) 6.25 (0.246) 3.5 ±0.05 (0.138 ±0.002) 2.0 ±0.05 (0.079 ±0.002) 1.1 (0.098) 8.3 (0.327) Note 1 8 mm Single (4 mm) 4.0 ±0.10 (0.157 ±0.004) 8.3 (0.327) 1. The cavity defi ned by A0, B0 and T shall surround the component with suffi cient clearance that: a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. c) rotation of the component is limited to 20° maximum (see Figure 3). d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4). e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements. 2. The tape with or without components shall pass around R without damage (see Figure 6).

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C 1091_C0G_ESD • 12/5/2016 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade) Figure 6 – Reel Dimensions A D (See Note) Full Radius, See Note B (see Note) Access Hole at Slot Location (Ø 40 mm minimum) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth W3 (Includes flange distortion at outer edge) W2 (Measured at hub) W1 (Measured at hub) C (Arbor hole diameter) Note: Drive spokes optional; if used, dimensions B and D shall apply. N Table 8 – Reel Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size A B Minimum C D Minimum 8 mm 178 ±0.20 (7.008 ±0.008) or 330 ±0.20 (13.000 ±0.008) 1.5 (0.059) 13.0 +0.5/-0.2 20.2 (0.795)12 mm 16 mm Variable Dimensions — Millimeters (Inches) Tape Size N Minimum W1 W2 Maximum W3 8 mm (1.969) 8.4 +1.5/-0.0 14.4 (0.567) Shall accommodate tape width without interference12 mm 12.4 +2.0/-0.0 18.4 (0.724) 22.4 (0.882)

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C 1091_C0G_ESD • 12/5/2016 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade) KEMET Electronic Corporation Sales Offi ces For a complete list of our global sales offi ces, please visit www.kemet.com/sales. Disclaimer All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. KEMET is a registered trademark of KEMET Electronics Corporation.