BZA462A NEXPERIA | Alldatasheet

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Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. use http://www.nexperia.com salesaddresses@nexperia.com (email) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: reserved Should be replaced with: - © Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e -mail or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia

Supersedes data of 1998 Oct 30

1999 May 25

Quadruple ESD transient voltage suppressor dbook, halfpage M3D302

1999 May 25 2

NXP Semiconductors Product data sheet Quadruple ESD transient voltage suppressor BZA462A

FEATURES

  • ESD rating >15 kV, according to IEC1000-4-2
  • SOT457 surface mount package
  • Common anode configuration
  • Non-clamping range −0.5 to 6.2 V
  • Maximum reverse peak power dissipation:

24 W at tp = 1 ms

  • Maximum clamping voltage at peak pulse current: 9 V at IZSM = 2.66 A.

APPLICATIONS

  • Computers and peripherals
  • Audio and video equipment
  • Communication systems
  • Medical equipment.

DESCRIPTION

Monolithic transient voltage suppressor diode in a six lead SOT457 (SC-74) package for 4-bit wide ESD transient suppression at 6.2 V level. PINNING PIN DESCRIPTION 1 cathode 1 2 common 3 cathode 2 4 cathode 3 5 common 6 cathode 4 Fig.1 Simplified outline (SOT457) and symbol. handbook, halfpage 13 2 456 Top view MAM357 Marking code: Z2t. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). Notes 1. T s is the temperature at the soldering point of the anode pin. 2. DC working current limited by P tot max. SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT Per diode IZ working current Ts = 60 °C; note 1 − note 2 mA IF continuous forward current Ts = 60 °C − 100 mA IFSM non-repetitive peak forward current tp = 1 ms; square pulse − 3.75 A IZSM non-repetitive peak reverse current tp = 1 ms; square pulse; see Fig.2 − 2.66 A Ptot total power dissipation Ts = 60 °C; see Fig.3 − 720 mW PZSM non repetitive peak reverse power dissipation square pulse; tp = 1 ms; see Fig.4 − 24 W Tstg storage temperature −65 +150 °C Tj junction temperature −65 +150 °C

1999 May 25 3

NXP Semiconductors Product data sheet Quadruple ESD transient voltage suppressor BZA462A THERMAL CHARACTERISTICS

ELECTRICAL CHARACTERISTICS

Tj = 25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-s thermal resistance from junction to soldering point one or more diodes loaded 125 K/W SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Per diode VZ working voltage IZ = 1 mA 5.89 6.2 6.51 V VF forward voltage IF = 200 mA − − 1.3 V VZSM non-repetitive peak reverse voltage IZSM = 3.5 A; tp = 1 ms − − 9 V IR reverse current VR = 4 V − − 700 nA rdif differential resistance IZ = 1 mA − − 300 Ω SZ temperature coefficient of working voltage IZ = 5 mA − 1.2 − mV/K Cd diode capacitance see Fig.5 VR = 0; f = 1 MHz − − 200 pF VR = 4 V; f = 1 MHz − − 110 pF

1999 May 25 4

NXP Semiconductors Product data sheet Quadruple ESD transient voltage suppressor BZA462A Fig.2 Maximum non-repetitive peak reverse current as a function of pulse time. handbook, halfpage MBK479 10−1 1 IZSM (A) tp (ms) 10 Fig.3 Power derating curve. All diodes loaded. handbook, halfpage 0 50 100 200 1000 Ptot (mW) Ts (oC) 800 150 600 400 200 MDA198 Fig.4 Maximum non-repetitive peak reverse power dissipation as a function of pulse duration (square pulse). PZSM = VZSM × IZSM. VZSM is the non-repetitive peak reverse voltage at IZSM. handbook, halfpage 102 PZSM (W) tp (ms) MBK481 10−1 11 0 Fig.5 Diode capacitance as a function of reverse voltage; typical values. Tj = 25 °C; f = 1 MHz. handbook, halfpage 06 5 200 Cd (pF) VR (V) 120 160 1234 MBK480

1999 May 25 5

NXP Semiconductors Product data sheet Quadruple ESD transient voltage suppressor BZA462A Fig.6 ESD clamping test set-up and waveforms. MBK478 450 Ω 50 Ω Note 1: attenuator is only used for open socket high voltage measurements IEC 1000-4-2 network CZ = 150 pF; RZ = 330 Ω 1/4 BZA462A RG 223/U 50 Ω coaxRZ CZ ESD TESTER DIGITIZING OSCILLOSCOPE10× ATTENUATOR note 1 GND unclamped +1 kV ESD voltage waveform (IEC 1000−4−2 network) clamped +1 kV ESD voltage waveform (IEC 1000−4−2 network) unclamped −1 kV ESD voltage waveform (IEC 1000−4−2 network) clamped −1 kV ESD voltage waveform (IEC 1000−4−2 network) GND GND GND vertical scale = 100 V/Div horizontal scale = 50 ns/Div vertical scale = 10 V/Div horizontal scale = 50 ns/Div vertical scale = 100 V/Div horizontal scale = 50 ns/Div vertical scale = 10 V/Div horizontal scale = 50 ns/Div

1999 May 25 6

NXP Semiconductors Product data sheet Quadruple ESD transient voltage suppressor BZA462A

APPLICATION INFORMATION

Typical common anode application A quadruple transient suppressor in a SOT457 package makes it possible to protect four separate lines using only one package. Two simplified examples are shown in Figs 7 and 8. Fig.7 Computer interface protection. handbook, full pagewidth GND keyboard, terminal, printer, etc. I/O BZA462A A B C D FUNCTIONAL DECODER MBK476 Fig.8 Microprocessor protection. handbook, full pagewidth MBK477 I/O ROMRAM CPU CLOCK GND VDD VGG data bus control bus address bus BZA462A

1999 May 25 7

NXP Semiconductors Product data sheet Quadruple ESD transient voltage suppressor BZA462A Device placement and printed-circuit board layout Circuit board layout is of extreme importance in the suppression of transients. The clamping voltage of the BZA462A is determined by the peak transient current and the rate of rise of that current (di/dt). Since parasitic inductances can further add to the clamping voltage = L di/dt) the series conductor lengths on the printed-circuit board should be kept to a minimum. This includes the lead length of the suppression element. In addition to minimizing conductor length the following printed-circuit board layout guidelines are recommended: 1. Place the suppression element close to the input terminals or connectors. 2. Keep parallel signal paths to a minimum. 3. Avoid running protection conductors in parallel with unprotected conductors. 4. Minimize all printed-circuit board loop areas including power and ground loops. 5. Minimize the length of th e transient return path to ground. 6. Avoid using shared transient return paths to a common ground point.

1999 May 25 8

NXP Semiconductors Product data sheet Quadruple ESD transient voltage suppressor BZA462A PACKAGE OUTLINE REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ SOT457 SC-74 wBMbp D e pin 1 index A Lp Q detail X HE E v M A AB y 0 1 2 mm scale c X 13 2 456 Plastic surface mounted package; 6 leads SOT45 7 UNIT A1 bp cD E HE Lp Qy wv mm 0.1 0.013 0.40 0.25 3.1 2.7 0.26 0.10 1.7 1.3 e 0.95 3.0 2.5 0.2 0.10.2 DIMENSIONS (mm are the original dimensions) 0.6 0.2 0.33 0.23 A 1.1 0.9 97-02-28 01-05-04

1999 May 25 9

NXP Semiconductors Product data sheet Quadruple ESD transient voltage suppressor BZA462A DATA SHEET STATUS Notes 1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. DISCLAIMERS General ⎯ Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes ⎯ NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use ⎯ NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications ⎯ Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values ⎯ Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale ⎯ NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license ⎯ Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control ⎯ This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data ⎯ The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.

For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com © NXP B.V. 2009 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. Printed in The Netherlands 115002/00/03/pp10 Date of release: 1999 May 25 Document order number: 9397 750 05926