BZ201M BENCENT | Alldatasheet

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DC Breakdown Voltage 1)2) 100V/s 160-240 V Impulse Spark-over Voltage At 1kV/μs for 99 % of measured values  800 V At 1kV/μs Typical values of distribution  700 V Impulse Discharge Voltage 3) 10/700μs Impulse Discharge Current 3) 8/20μs Arc Voltage At 1A ~10 V Insulation Resistance DC=100V ≥1 G Ω C(1MHz) V DC=0.5V ≤0.5 pF Weight ~0.094 g Operating And Storage Temperature -40-90 ℃ Marking Without 1) At delivery AQL 0.65 level II ISO 2859 2) In ionized mode 3) Terms and waveforms in accordance with ITU-T Rec. K. 12; IEC 61643-21 Icon Description Compliance with 2011/65/EU Compliance with IEC61249-2-21:2003 Mean lead free

Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications www .bencent.com.cn Order Code: BZ201M Gas Discharge Tube Version: A1 2016-10-24 B Z 2 0 1 M (1) (2) (3) (1)Bencent Gas Discharge Tube (2) Series: DC Breakdown Voltage, (3) Tolerance of DC Breakdown Voltage, M=+-20%, N=+-30%,the Specific tolerance is decided by the table of᱑Electrical Parameter᱒ Part Numbering System Recommended Soldering Pad Product Dimensions Environmental Reliability Characteristics A B C Lead Material Copper Body Material Ceramics Terminal Finish 100% Matte-Tin Plated Product Characteristics Testing items Technical standards High Temperature Storage Test Temperature: 90℃ Time:2H Low Temperature Storage Test Temperature: -40℃ Time:2H Vibration Frequency：10-500Hz Amplitude：0.15mm Time：45min Resistance of soldering heat Temperature: 260±5℃ Time of dip soldering：10s，1time REF mm inch REF mm inch A 4.5 0.177 B 2.0 0.079 C 2.8 0.110 Note: Up-screen program can be specified by customer’s request via contacting Bencent service A B C D Solderability Test Solderability Solder Pot Temperature: 245 ℃±5℃ Solder Dwell Time: 4-6 seconds

Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications www .bencent.com.cn Order Code: BZ201M Gas Discharge Tube Version: A1 2016-10-24 Reflow Condition Pb-Free assembly Pre Heat Temperature Min 150°C Temperature Max 200°C Time ˄min to max˅ 60 – 180 secs Average ramp up rate˄Liquids˅Tamp ˄TL˅ to peal 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquids) 217°C - Temperature (TL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) ~10 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C REF mm inch D0 Φ1.5±0.1 Φ0.059±0.004 P0 4.0 ±0.1 0.157 ±0.004 P2 2.0 ±0.1 0.079 ±0.004 P1 8.0 ±0.1 0.315 ±0.004 W 12.0 ±0.2 0.472 ±0.008 D Φ330.0 Φ13.0 D1 Φ50Min Φ1.97Min D2 Φ13±0.15 0.512 ±0.006 W1 16.8 ±2.0 0.661 ±0.079 Reflow Profile Outline Reel (PCS) Per Carton (PCS) Reel Diameter (mm) Carton Size(mm) L W H TAPING 2,000 32,000 330 360 360 380 Package Reel Information tP Ramp-down TP TL TS(max) TS(min) time to peak temper ature Time Temperature Critical Zone T L to TP TL Preheat Ramp-up tS