BZ1A5001GM

BZ1A5001GM ROHM | Alldatasheet

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Technical content

C ○Structure：SiliconCmonolithicCintegratedCcircuit ○ ThisCproductChasCnoCprotectionCagainstCradioactiveCraysC C 1/11C TSZ02201-0RGR0A100010-1- 2©C2013CROHMCCo.,CLtd.CAllCrightsCreserved.C 2013.02.15 Rev.002 www.rohm.comC TSZ22111・14・001C Datasheet Single-Package Regulator series 0.175A/0.19A Output Fully Integrated Step Up/Down Charge pump regulator BZ1A5001GM C

• ● ●●General Description BZ1A5001GMC isC aC SinglekPackageC RegulatorC withC integratedCperipheralCparts.CTheCtimeCandCeffortCofCtheC designCcanCbeCsaved.CItCcanCcontributeCinCshorteningCtheC designCtimeCofCportableCdevicesCandCindustrialCapparatus,C partsCcountCreduction,CandCminiaturization.CBZ1A5001GMC isCbasedConCDualCPhaseCStepCUp/DownCChargeCpumpC RegulatorC IC.C OutputC VoltageC andC CurrentC RatingC ofC Additionally,C OscillationC frequencyC ofC 642KHzC andC 238KHzCcanCbeCchosenCbyCFSEL.CItCisCtheCbestCpowerC supplyCforCHDMI,CUSBConCtheCgo,CandCLEDCtorchCLightCforC mobileCphone.CBrightnessCcanCbeCadjustedCbyCEN.C C
• ● ●●Features /square6C NoCexternalCpartsCneededC /square6C ReverseCcurrentCpreventionCfromCanCoutputC /square6C SelectableCOutputCVoltageC /square6C SelectableCOscillationCFrequencyC /square6C 0uACtypicalCstandbyCcurrentC /square6C BuiltkinCOverCCurrentCProtectionC(OCP)CC /square6C BuiltkinCThermalCShutCDownCcircuitC(TSD)C /square6C UltraCsmallCpackageC C
• ● ●●Pin Configuration (Top View) C C C C C C C C C C C C C C C C C
• ApplicationC SmartCPhone,CMobileCPhone,CPortableCAudioCPlayer,C PortableCDevices,CPOLCRegulatorC HDMICDevices,CUSBConCtheCgoCDevices,C LEDCtorchCLightCDevicesC C
• PackageC C W(Typ.)CxCD(Typ.)CxCH(Max.)C BGAkMD CCCCCCCCCCCC2.30mmCxC2.40mmCxC1.00mmC C TOPCVIEW BOTTOMCVIEWC C C C
• Typical Application CircuitC C C C C C C C C C C C C C C Pin description C C C C C C PinCNoC Symbol C NameC FunctionC 1C A1C VINC PowerCsupplyCInputCPinC 2C A2C VINC PowerCsupplyCInputCPinC 3C A3C VSELC OutputCSelectCPinC 4C B1C GNDC GNDCPinC 5C B2C GNDC GNDCPinC 6C B3C ENC EnableCPinC 7C C1C VOUT C OutputCpinC 8C C2C VOUT C OutputCPinC 9C C3C FSELC FrequencyCSelectCPinC FigureC2.CTypicalCApplicationCCircuitC FigureC1. PinCConfigurationC (PleaseCcheckCp.6/11CforCdetails)C VOUT VOUT EN VSEL FSEL㪞ND 㪞ND VIN VIN A1 A2 C2 Vin=2.7～5.5V 㪞ND Vout=4.5V㪆5.0V PinC1C PIN1CMarkC (PinCA1)C PIN1C(PinCA1)C CC C BC C A C C 3 2 1C C CF1CCF2C CoutC CinC

C C 2/11C DatasheetBZ1A5001GM C TSZ02201-0RGR0A100010-1- 2©C2013CROHMCCo.,CLtd.CAllCrightsCreserved.C 2013.02.15 Rev.002 www.rohm.comC TSZ22111・15・001C

• Block Diagram C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C
• DescriptionCofCBlockC 1.CON/OFFCControlC TheCvoltageClevelCofCENCPinCcontrolsCwhetherCtheCdeviceCisCturnedCONCorCOFF.C ENC=C“H”C:CActiveC ENC=C“L”C:CStandbyCCircuitCcurrentCisC0uAC C 2.CLowCRippleCvoltageCbyCDualCPhaseCChargeCpumpC LowCRippleCoutputCvoltageCisCpossibleCthroughCtheCuseCofCDualCPhaseCChargeCpumpC&CFixedCfrequency.C RippleChasCsignificantlyCreducedCcomparedCtoCpreviousCChargekPumpCregulators.C C 3.CSelectableCFrequencyC TheCvoltageClevelCofCFSELCpinCselectsCtheCoscillationCfrequency.C FSEL=”H”:642kHzC FSEL=”L”:238kHzC C 4.CPowerCDissipationC PowerCDissipationCisCcalculatedCasCfollows.C C P DC=CPIN－POUTC =C(VINC×CIIN)－(VOC×CIO)C[w]C C PleaseCsetCupCVinC&CIoCnotCtoCexceedCtheCallowableCpowerCdissipation.C SinceCitCisCgreatlyCdependentCalsoConCtheCPCBClayout,CtheCallowableCpowerCdissipationCshouldCconsiderCtheCheatCdissipationC characteristicCofCtheCPCBClayoutCdesign.C C 5.CShortCcircuitCprotectionC ProtectsCtheCdeviceCwhenCtheCoutputCisCshortkcircuitedCtoCtheCgroundCbyClimitingCtheCoutputCcurrent.(TYP:150mA)C CCOnceCshortkcircuitCisCcleared,CnormalCLSICoperationCisCresumedC(automaticCreturn).C OCPCpointCisC800mA(Typ).C C FigureC3.CBlockCDiagramC CoutC：C1608CC2.2uFCCC10VC CinC：C0603CC0.22uFCC6.3VC CF1C：C0603CC1uFCCCCC6.3VC CF2C：C0603CC1uFCCCCC6.3VC 1MΩC 1MΩC 1MΩC orC5.0VC ~10CLEDC

C C 3/11C DatasheetBZ1A5001GM C TSZ02201-0RGR0A100010-1- 2©C2013CROHMCCo.,CLtd.CAllCrightsCreserved.C 2013.02.15 Rev.002 www.rohm.comC TSZ22111・15・001C 6.C ThermalCshutdownC WhenCtheCchipCsettingCtemperatureCisC185ºCC(typ)CorCmore,CtheCthermalCshutdownCfunctionCisCactivatedCtoCturnCoffCtheC chargeCpumpCcircuit.C WhenCthisCtemperatureCfallsCbelowCtheCthermalCdetectionCtemperature,CnormalCLSICoperationCisCresumed.CAccordingly,C theCfollowingCONCandCOFFCoperationsCareCrepeatedCasCthermalCoperationsCunlessCtheCprimaryCcauseCisCresolved.C C C C C C C Fig.4CThermalCdetectionCloopC 7.C SettingCtheCLEDCcurrentC TheCLEDCcurrentCisCsetCasCfollows.C TheCconstantCmustCbeCdetermined,CconsideringCvariationsCinCresistanceCandCLED.C C C I LEDC=CCCCCCCCCCC[A]C C VOUTCC:CBZ1A5001GMCOutputCVoltageC VFCCCC:CLED’sCVFC R C:CLEDCsettingCregisterC C C C C C C C Fig.5CLEDcurrentCSettingC 8.C BrightnessCcontrolC BrightnessCcontrolCtakesCplaceCinCthisCLSICasCfollows.C a)CPWMC TheCENCpinCisCturnedCONCorCOFFCrepeatedlyCviaCtheCPWMCsignal.C ItCisCrecommendedCthatCtheCPWMCfrequencyCisC100HzCorCbelow.CThisCfrequencyCmustCbeCdetermined,CfullyCevaluatingC theClinearityCofCbrightnessCtoCtheCPWMCduty.CIfCtheCrushCcurrentCcausesCaCproblemCwhenCtheCENCpinCisCturnedCON,C brightnessCcontrolCmustCbeCcarriedCoutCbyCswitchingCtheCLEDCcurrentCasCdiscussedConCtheCnextCsection.C C C C C C C C C C C CCCCCCFig.6 PWMCBrightnessCcontrolC C b)CSwitchingCtheCLEDCCurrentC SwitchingCtheCLEDCcurrentCtakesCplaceCviaCtheCexternalCswitch.C TheCconstantCmustCbeCdetermined,CconsideringCtheCONCresistanceCofCtheCswitchCtransistor.C C C C C C C C C C C C C Fig.9 BrightnessCcontrolCbyCMOSFETC RC VOUT－VFC C BD1603NUVC CENC PWM信号C C BD1603NUVC C VOUTC C BD1603NUVC VOUTC VFC RC ENCSignalC VOUTCVoltageC VINCCurrentC ENCSignalC VOUTCVoltageC VINCCurrentC CFig.7CCVIN=4.5V100HzCON/OFFC Fig.8CCVIN=5.0V100HzCON/OFFC BZ1A5001GMC BZ1A5001GMC BZ1A5001GMC TemperatureC ThermalCdetection CircuitCOFFC TemperatureCdrop CircuitCONCCCCCCCCC

C C 4/11C DatasheetBZ1A5001GM C TSZ02201-0RGR0A100010-1- 2©C2013CROHMCCo.,CLtd.CAllCrightsCreserved.C 2013.02.15 Rev.002 www.rohm.comC TSZ22111・15・001C

• AbsoluteCMaximumCRating（Ta＝25℃）C Parameter Symbol Ratings Unit Power supply voltage VIN 6.3 V Power Dissipation Pd 0.75(*1) W Operating Temperature Topr -30 ～ +85 ℃ Storage Temperature Tstg -55 ～ +125 ℃ Junction Temperature Tjmax +125 ℃ (*1) ReducedCbyC7.6mW/°CCforCeachCincreaseCinCTaCofC1°CCoverC25°C.C(DuringCROHMCstandardCboardCimplementation) Parameter Symbol Limits Unit Min Typ Max Power supply voltage VIN 2.7 - 5.5 V Max Current（t=500ms Duty=20%） Io(pulse) - - 200 ｍA Start up Time（EN⇒Vo to 80％） Tr - 150 300 us Off Time（EN⇒Vo to20%）(*2) Tf - - 1 ms (*2) Value when a 200Ω discharge resistor is connected.
• Electrical Characteristics (Ta=25℃，VIN = 3.6V, unless specified） Parameter Symbol Limits Unit Condition Min Typ Max 【Regulator block】 Output Voltage 1 VOUT1 4.80 5.00 5.20 V VSEL=High Output Voltage 2 VOUT2 4.27 4.50 4.73 V VSEL=Low Output Current 1 IOUT1 - - 175 mA VSEL=VIN, 3.2＜VIN Output Current 2 IOUT2 - - 190 mA VSEL=0V, 3.2V＜VIN Output Current 3 IOUT3 - - 60 mA VSEL=VIN, 3.2V＞VIN Output Current 4 IOUT4 - - 120 mA VSEL=0V, 3.2V＞VIN 【Oscillator Brock】 Frequency 1 fosc1 - 238 - kHz FSEL=Low Frequency 2 fosc2 - 642 - kHz FSEL=High 【Control Pin Block】 EN Pin Control Voltage Active VENH 1.3 - VIN V ON OFF VENL 0 - 0.4 V OFF VSEL Pin Control Voltage 5.0V VSELH 1.3 - VIN V Vout=5V 4.5V VSELL 0 - 0.4 V Vout=4.5V FSEL Pin Control Voltage High Freq FSELH 1.3 - VIN V OSC=642kHz Low Freq FSELL 0 - 0.4 V OSC=238kHz 【Efficiency】 Efficiency 1 Eff1 - 75 - ％ FSEL=Low : Iout=60mA Efficiency 2 Eff2 - 74.5 - ％ FSEL=High : Iout=60mA 【Circuit Current】 Circuit Current 1 IINS1 - 1.4 2.0 mA FSEL=Low Circuit Current 2 IINS2 - 3.0 4.2 mA FSEL=High Shut down Current SHD - 0 2 uA EN=0V ◎ThisCproductCisCnotCdesignedCtoCprotectCitselfCagainstCradioactiveCrays.C *1)CPleaseCdesignCaCVINCconditionCandCaCloadCcurrentCnotCtoCexceedCPdCofCtheCLSI.C

C C 5/11C DatasheetBZ1A5001GM C TSZ02201-0RGR0A100010-1- 2©C2013CROHMCCo.,CLtd.CAllCrightsCreserved.C 2013.02.15 Rev.002 www.rohm.comC TSZ22111・15・001C

• Reference dataReference dataReference dataReference dataC C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C Fig.10CQuiescentCCurrentC1C Fig.11CQuiescentCCurrentC2C Fig.12CQuiescentCCurrentC3C Fig.13CLineCRegulationC (VSELC=C0V)C Fig.16CLoadCRegulationC (VSELC=CV IN)C Fig.20CEfficiencyCvs.CLoadCCurrentC (VSELC=CVIN)C Fig.19CEfficiencyCvs.CLoadCCurrentC (VSELC=C0V)C Fig.15CLoadCRegulationC (VSELC=C0V)C Fig.14CLineCRegulationC (VSELC=CVIN)CC Fig.17CEfficiencyCvs.CInputCVoltageCC (VSELC=C0V)C Fig.18CEfficiencyCvs.CInputCVoltageCC (VSELC=CVIN)C 4.5 4.6 4.7 4.8 4.9 5.1 5.2 5.3 5.4 5.5 3 3.5 4 4.5 5 5.5 Input Voltage [V] Out put Voltage[V] Ta=25CoCC Io=150mAC 0.5 1.5 2.5 3.5 2.5 3 3.5 4 4.5 5 5.5 Input Voltage[V] Quiescent Current[mA] Ta=25CoCC C 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 2.5 3 3.5 4 4.5 5 5.5 Input Voltage[V] Quiescent Current[µA] Ta=25CoCC C 0.5 1.5 2.5 2.5 3 3.5 4 4.5 5 5.5 Input Voltage[V] Quiescent Current[mA] Ta=25CoCC 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 3 3.5 4 4.5 5 5.5 Input Voltage[V] Output Voltage[V] Ta=25CoCC Io=200mAC 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 0 50 100 150 200 Load Current [mA] Input Voltage [V] Ta=25CoCC VIN=3.8VC Input Voltage[V] Efficiency [%] Ta=25CoCC Io=150mAC Input Voltage [V] Efficiency [%] Ta=25CoCC Io=200mAC 4.5 4.6 4.7 4.8 4.9 5.1 5.2 5.3 5.4 5.5 0 40 80 120 160 200 Load Current [mA] Output Voltage [V] Ta=25CoCC VIN=3.8VC 0 50 100 150 200 Load Current [mA] Efficiency [%] Ta=25CoCC VIN=3.2VC 0 50 100 150 200 Load Current [mA] EfficiencyC[%] Ta=25CoCC VIN=3.2VC

C C 6/11C DatasheetBZ1A5001GM C TSZ02201-0RGR0A100010-1- 2©C2013CROHMCCo.,CLtd.CAllCrightsCreserved.C 2013.02.15 Rev.002 www.rohm.comC TSZ22111・15・001C

• External Dimensions（Unit：mm）

C C 7/11C DatasheetBZ1A5001GM C TSZ02201-0RGR0A100010-1- 2©C2013CROHMCCo.,CLtd.CAllCrightsCreserved.C 2013.02.15 Rev.002 www.rohm.comC TSZ22111・15・001C

• PCB layoutC C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C b3 Φ0.30 照合文字 寸法 （標準値） e 0.80 Fig..21CCRecommendedCPCBCLayoutCPatternC(TOPCVIEW)C ResistCOpeningC CopperCpatternC SymbolC TypicalCSizeC

C C 8/11C DatasheetBZ1A5001GM C TSZ02201-0RGR0A100010-1- 2©C2013CROHMCCo.,CLtd.CAllCrightsCreserved.C 2013.02.15 Rev.002 www.rohm.comC TSZ22111・15・001C

• ● ●●Operational Notes (1)CAbsoluteCMaximumCRatingsC OperatingCtheCICCoverCtheCabsoluteCmaximumCratingsCmayCdamageCtheCIC.CInCaddition,CitCisCimpossibleCtoCpredictCallC destructiveCsituationsCsuchCasCshortkcircuitCmodesCorCopenCcircuitCmodes.CTherefore,CitCisCimportantCtoCconsiderCcircuitC protectionCmeasures,ClikeCaddingCaCfuse,CinCcaseCtheCICCisCexpectedCtoCbeCoperatedCinCaCspecialCmodeCexceedingCtheC absoluteCmaximumCratings.C C (2)CReverseCconnectionCofCpowerCsupplyC ConnectingCtheCpowerCsupplyCinCreverseCpolarityCcanCdamageCtheCIC.CTakeCprecautionsCagainstCreverseCpolarityCwhenC connectingCtheCpowerCsupply,CsuchCasCmountingCanCexternalCdiodeCbetweenCtheCpowerCsupplyCandCtheCIC’sCpowerCsupplyC terminals.C C (3)CPowerCsupplyClinesC DesignCtheCPCBClayoutCpatternCtoCprovideClowCimpedanceCgroundCandCsupplyClines.CSeparateCtheCgroundCandCsupplyClinesC ofCtheCdigitalCandCanalogCblocksCtoCpreventCnoiseCinCtheCgroundCandCsupplyClinesCofCtheCdigitalCblockCfromCaffectingCtheC analogCblock.CFurthermore,CconnectCaCcapacitorCtoCgroundCatCallCpowerCsupplyCpins.CConsiderCtheCeffectCofCtemperatureC andCagingConCtheCcapacitanceCvalueCwhenCusingCelectrolyticCcapacitors.C C (4)CGroundCVoltageC TheCvoltageCofCtheCgroundCpinCmustCbeCtheClowestCvoltageCofCallCpinsCofCtheCICCatCallCoperatingCconditions.CEnsureCthatCnoC pinsCareCatCaCvoltageCbelowCtheCgroundCpinCatCanyCtime,CevenCduringCtransientCcondition.C C (5)CThermalCconsiderationC UseCaCthermalCdesignCthatCallowsCforCaCsufficientCmarginCbyCtakingCintoCaccountCtheCpermissibleCpowerCdissipationC(Pd)CinC actualCoperatingCconditions.CConsiderCPcCthatCdoesCnotCexceedCPdCinCactualCoperatingCconditionsC(Pc≥Pd).C C PackageCPowerCdissipationC:CPdC(W)=(Tjmax－Ta)/θjaC PowerCdissipationCCCC:CPcC(W)=(Vcc－Vo)×Io+Vcc×IbC C TjmaxC:CMaximumCjunctionCtemperature=150℃,CTaC:CPeripheralCtemperature[℃]C,CC θjaC:CThermalCresistanceCofCpackagekambience[℃/W],CPdC:CPackageCPowerCdissipationC[W],C PcC:CPowerCdissipationC[W],CVccC:CInputCVoltage,CVoC:COutputCVoltage,CIoC:CLoad,CIbC:CBiasCCurrentC C (6)CShortCbetweenCpinsCandCmountingCerrorsC BeCcarefulCwhenCmountingCtheCICConCprintedCcircuitCboards.CTheCICCmayCbeCdamagedCifCitCisCmountedCinCaCwrongCorientationC orCifCpinsCareCshortedCtogether.CShortCcircuitCmayCbeCcausedCbyCconductiveCparticlesCcaughtCbetweenCtheCpins.C C (7)COperationCunderCstrongCelectromagneticCfieldC OperatingCtheCICCinCtheCpresenceCofCaCstrongCelectromagneticCfieldCmayCcauseCtheCICCtoCmalfunction.C C (8)CAreaCofCSafeCOperationC(ASO)C OperateCtheCICCsuchCthatCtheCoutputCvoltage,CoutputCcurrent,CandCpowerCdissipationCareCallCwithinCtheCAreaCofCSafeC OperationC(ASO).C C (9)CThermalCshutdownCcircuitC(TSD)C TheCICCincorporatesCaCbuiltkinCthermalCshutdownCcircuit,CwhichCisCdesignedCtoCturnCoffCtheCICCwhenCtheCinternalCtemperatureC ofCtheCICCreachesCaCspecifiedCvalue.CItCisCnotCdesignedCtoCprotectCtheCICCfromCdamageCorCguaranteeCitsCoperation.CDoCnotC continueCtoCoperateCtheCICCafterCthisCfunctionCisCactivated.CDoCnotCuseCtheCICCinCconditionsCwhereCthisCfunctionCwillCalwaysC beCactivated.C C C TSDCONCTemperature[□]CC(typ.)C HysteresisCTemperatureC[□]CC(typ.) C BZ1A5001GMC 185C 15C CC (10)CTestingConCapplicationCboardsCC WhenCtestingCtheCICConCanCapplicationCboard,CconnectingCaCcapacitorCdirectlyCtoCaClowkimpedanceCoutputCpinCmayCsubjectC theCICCtoCstress.CAlwaysCdischargeCcapacitorsCcompletelyCafterCeachCprocessCorCstep.CTheCIC’sCpowerCsupplyCshouldCalwaysC beCturnedCoffCcompletelyCbeforeCconnectingCorCremovingCitCfromCtheCtestCsetupCduringCtheCinspectionCprocess.CToCpreventC damageCfromCstaticCdischarge,CgroundCtheCICCduringCassemblyCandCuseCsimilarCprecautionsCduringCtransportCandCstorage.

C C 9/11C DatasheetBZ1A5001GM C TSZ02201-0RGR0A100010-1- 2©C2013CROHMCCo.,CLtd.CAllCrightsCreserved.C 2013.02.15 Rev.002 www.rohm.comC TSZ22111・15・001C C (11)CRegardingCinputCpinCofCtheCICC ThisCmonolithicCICCcontainsCP+CisolationCandCPCsubstrateClayersCbetweenCadjacentCelementsCinCorderCtoCkeepCthemCisolated.C PkNCjunctionsCareCformedCatCtheCintersectionCofCtheCPClayersCwithCtheCNClayersCofCotherCelements,CcreatingCaCparasiticCdiodeC orCtransistor.CForCexampleC(referCtoCfigureCbelow):C C CWhenCGNDC>CPinCACandCGNDC>CPinCB,CtheCPkNCjunctionCoperatesCasCaCparasiticCdiode.C CWhenCGNDC>CPinCB,CtheCPkNCjunctionCoperatesCasCaCparasiticCtransistor.C C ParasiticCdiodesCinevitablyCoccurCinCtheCstructureCofCtheCIC.CTheCoperationCofCparasiticCdiodesCcanCresultCinCmutualC interferenceCamongCcircuits,CoperationalCfaults,CorCphysicalCdamage.CTherefore,CconditionsCthatCcauseCtheseCdiodesCtoC operate,CsuchCasCapplyingCaCvoltageClowerCthanCtheCGNDCvoltageCtoCanCinputCpinC(andCthusCtoCtheCPCsubstrate)CshouldCbeC avoided.C C C C C C C C C C C C C C C C C (12)CGNDCwiringCpatternC WhenCusingCbothCsmallksignalCandClargekcurrentCGNDCtraces,CtheCtwoCgroundCtracesCshouldCbeCroutedCseparatelyCbutC connectedCtoCaCsingleCgroundCatCtheCreferenceCpointCofCtheCapplicationCboardCtoCavoidCfluctuationsCinCtheCsmallksignalC groundCcausedCbyClargeCcurrents.CAlsoCensureCthatCtheCGNDCtracesCofCexternalCcomponentsCdoCnotCcauseCvariationsConCtheC GNDCvoltage.CTheCpowerCsupplyCandCgroundClinesCmustCbeCasCshortCandCthickCasCpossibleCtoCreduceClineCimpedance.C C C Resistor Transistor (NPN) N N N P+ P+ P P substrate GND Parasitic element Pin A N N P+ P+ P P substrate GND Parasitic element Pin B C B E N GND Pin A Pin B Other adjacent elements E B C GND Parasitic Parasitic Example of monolithic IC structure

C C 10/11C DatasheetBZ1A5001GM C TSZ02201-0RGR0A100010-1- 2©C2013CROHMCCo.,CLtd.CAllCrightsCreserved.C 2013.02.15 Rev.002 www.rohm.comC TSZ22111・15・001C

• ● ●●発注発注 発注発注形名形名 形名形名情報情報 情報情報 C B Z 1 A 5 0 0 1 G M - E1 PartC NumberC FrequencyC 1AC:C1MHzC OutputC VoltageC 50C:C5.0VC OutputC CurrentC 01C:C0.15A C PackageC GM:CBGAkMDC C PackagingCandCformingCspecificationC TR:CEmbossedCtapeCandCreelC C
• ● ●●Package and forming specificationPackage and forming specificationPackage and forming specificationPackage and forming specification C C C ← PinC1C(lowerCright)C C C C 包装形態 包装数量 包装方向 引き出したときに、製品の1番ピンが エンボステーピング 9,000pcs （リールを左手に持ち、右手でテープを DirectionCofCfeedC EmbossedCcareerCtapeCTapeC QuantityC DirectionCC ofCCfeedC TheClocationCofCpinC1CofCtheCproductCisCatCtheC lowerCrightCwhenCyouCholdCtheCreelConCtheCleftC handCandCyouCpullCoutCtheCtapeConCtheCrightC hand.CCC

C C 11/11C DatasheetBZ1A5001GM C TSZ02201-0RGR0A100010-1- 2©C2013CROHMCCo.,CLtd.CAllCrightsCreserved.C 2013.02.15 Rev.002 www.rohm.comC TSZ22111・15・001C

• ● ●●Revision historyC DateC RevisionC ChangesC 18.Jan.2013C 001C NewCReleaseC 15.Feb.2013C 002C PinCConfigurationC(Figk1)C C

Notice - GE Rev.002 © 2014 ROHM Co., Ltd. All rights reserved. Notice Precaution on using ROHM Products 1. Our Products are designed and manufac tured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring ex tremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sale s representative in advance. Unless otherwise agreed in writing by ROHM in advance, RO HM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅣ CLASS Ⅲ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. Accordin gly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products ar e exposed to sea wind or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subjec t to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temper ature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperat ure is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlori ne, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification

Notice - GE Rev.002 © 2014 ROHM Co., Ltd. All rights reserved. Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the Products and external components, including transient characteri stics, as well as static characteristics. 2. You agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for Products use. Theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding t he Products maximum rating will not be applied to Products. Please take special care under dry condit ion (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriora te if the Products are stored in the places where: [a] the Products are exposed to sea winds or corros ive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to di rect sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm sol derability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a hum idity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contain ed in this document is for reference only. ROHM does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whol e or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any wa y whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties.

Notice – WE Rev.001 © 2014 ROHM Co., Ltd. All rights reserved. General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for failure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information.