BYV52HR STMICROELECTRONICS | Alldatasheet

Document overview

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Technical content

Features

■ Very small conduction losses ■ Negligible switching losses ■ High surge current capability ■ High avalanche energy capability ■ Hermetic package ■ Target radiation qualification: – 150 krad (Si) low dose rate – 3 Mrad high dose rate ■ Package mass: 10 g ■ ESCC qualified

Description

Packaged in an hermetic TO-254 this device is intended for use in medium voltage, high frequency switching mode power supplies, high frequency DC to DC converters, and other aerospace applications. The complete ESCC specification for this device is available from the European space agency web site. ST guarantees full compliance of qualified parts with such ESCC detailed specifications. Figure 1. Device configuration Table 1. Device summary (1)

  1. Contact ST sales office for information about the specif ic conditions for products in die form and QML-Q versions.

1 Characteristics

Table 2. Absolute maximum ratings

  1. Sinusoidal pulse of 10 ms duration
  2. Pulsed, duration 5 ms, F = 50 Hz
  3. For T case ≥ +120°C, derate linearly to 0 A at +150°C.
  4. For devices with hot solder dip l ead finish all testing performed at Tamb > +125 °C are carried out in a 100%
  5. Duration 10 seconds maximum at a distance of not less than 1.5 mm from the device body and the same

lead shall not be resoldered until 3 minutes have elapsed. Table 3. Thermal resistance

  1. Package mounted on infinite heatsink.

Table 4. Electrical measurements at ambiant temperature (per diode), T amb = 22 ±3 °C

  1. Pulse width ≤ 300µs, duty cycle ≤ 2%
  2. Performed only during screening tests parameter drift values (initial measurements for HTRB), go-no-go.
  3. The limits for ΔVF shall be defined by the manufacturer on every lot in accordance with MIL-STD-750 Method 3101 and

shall guarantee the Rth(j-c) limits specified in maximum ratings. Table 5. Electrical measurements at high and low temperatures (per diode)

  1. Read and record measurements shall be performed on a sample of 5 components with 0 failures allowed. Alternatively a

100% inspection may be performed.

  1. Pulse width ≤ 300µs, duty cycle ≤ 2%

2 Package information

specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 2. Metal flange mount package (TO-254 (a)), 3 lead dimension definitions

Table 6. Metal flange mount package (TO-254), 3-lead dimension values

  1. Radius of heatsink flange corner - 4 locations
  2. Radius of body corner - 4 locations

3 Ordering information

Table 7. Ordering information (1)

  1. Contact ST sales office for information about the specif ic conditions for products in die form and QML-Q versions.

4 Revision history

Table 8. Document revision history