BYV32-200 ONSEMI | Alldatasheet

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Technical content

© Semiconductor Components Industries, LLC, 2006 August, 2006 − Rev. 2

1 Publication Order Number:

BYV32−200/D BYV32−200 SWITCHMODE/C0116 Power Rectifier Features and Benefits

  • Low Forward V oltage
  • Low Power Loss/High Efficiency
  • High Surge Capacity
  • 175°C Operating Junction Temperature
  • 16 A Total (8 A Per Diode Leg)
  • Pb−Free Packages are Available*

Applications

  • Power Supply − Output Rectification
  • Power Management
  • Instrumentation Mechanical Characteristics
  • Case: Epoxy, Molded
  • Epoxy Meets UL 94 V−0 @ 0.125 in
  • Weight: 1.9 Grams (Approximately)
  • Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable
  • Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds
  • ESD Rating: Human Body Model 3B Machine Model C *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Device Package Shipping

ORDERING INFORMATION

BYV32−200 TO−220 TO−220AB CASE 221A PLASTIC

50 Units / Rail

16 AMPERES, 200 VOLTS

trr = 35 ns 2, 4 MARKING DIAGRAM AYWW BYV32−200G AKA A = Assembly Location Y = Year WW = Work Week BYV32−200 = Device Code G = Pb−Free Package AKA = Diode Polarity http://onsemi.com BYV32−200G TO−220 (Pb−Free)

BYV32−200 http://onsemi.com MAXIMUM RATINGS Rating Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 200 V Average Rectified Forward Current, TC = 156°C Per Leg Total Device IF(AV) 8.0 A Peak Rectified Forward Current (Square Wave, 20 kHz), T C = 154°C − Per Diode Leg IFM 16 A Nonrepetitive Peak Surge Current (Surge applied at rated load conditions halfwave, single phase, 60 Hz) IFSM 100 A Operating Junction Temperature and Storage Temperature TJ, Tstg −65 to +175 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above t he Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. THERMAL CHARACTERISTICS Characteristic Conditions Symbol Value Unit Maximum Thermal Resistance, Junction−to−Case Min. Pad R/C0113JC 3.0 °C/W Maximum Thermal Resistance, Junction−to−Ambient Min. Pad R/C0113JA 60

ELECTRICAL CHARACTERISTICS

Characteristic Symbol Min Typical Max Unit Instantaneous Forward Voltage (Note 1) (iF = 5.0 A, Tj = 100°C) (iF = 20 A, Tj = 25°C) vF 0.74 1.01 0.85 1.15 V Instantaneous Reverse Current (Note 1) (Rated dc Voltage, T j = 100°C) (Rated dc Voltage, Tj = 25°C) iR 3.5 600 /C0109A Maximum Reverse Recovery Time (IF = 1.0 A, di/dt = 50 A//C0109s) (IF = 0.5 A, IR = 1.0 A, IREC = 0.25 A) trr ns 1. Pulse Test: Pulse Width = 300 s, Duty Cycle ≤ 2.0%

Figure 1. Typical Forward Voltage, Per Leg

80 TJ = 175°C

Figure 2. Maximum Forward Voltage Figure 3. Typical Reverse Current, Per Leg* Figure 4. Current Derating, Case, Per Leg Figure 5. Current Derating, Ambient, Per Leg

BYV32−200 http://onsemi.com PACKAGE DIMENSIONS TO−220 THREE−LEAD TO−220AB CASE 221A−09 ISSUE AD NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND LEAD IRREGULARITIES ARE ALLOWED. DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.570 0.620 14.48 15.75 B 0.380 0.405 9.66 10.28 C 0.160 0.190 4.07 4.82 D 0.025 0.035 0.64 0.88 F 0.142 0.147 3.61 3.73 G 0.095 0.105 2.42 2.66 H 0.110 0.155 2.80 3.93 J 0.018 0.025 0.46 0.64 K 0.500 0.562 12.70 14.27 L 0.045 0.060 1.15 1.52 N 0.190 0.210 4.83 5.33 Q 0.100 0.120 2.54 3.04 R 0.080 0.110 2.04 2.79 S 0.045 0.055 1.15 1.39 T 0.235 0.255 5.97 6.47 U 0.000 0.050 0.00 1.27 B Q H Z L V G N A K F 12 3 D SEATING PLANE−T− C ST U R J STYLE 6: PIN 1. ANODE 2. CATHODE 3. ANODE 4. CATHODE ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 BYV32−200/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative