BYQ28E PHILIPS | Alldatasheet

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Technical content

Philips Semiconductors Product specification Rectifier diodes BYQ28E, BYQ28EB, BYQ28ED series ultrafast, rugged FEATURES SYMBOL QUICK REFERENCE DATA

  • Low forward volt drop V R = 150 V/ 200 V
  • Fast switching
  • Soft recovery characteristic V F ≤ 0.895 V
  • Reverse surge capability
  • High thermal cycling performance I O(AV) = 10 A
  • Low thermal resistance IRRM = 0.2 A trr ≤ 25 ns GENERAL DESCRIPTION Dual, ultra-fast, epitaxial rectifier diodes intended for use as output rectifiers in high frequency switched mode power supplies. The BYQ28E series is supplied in the SOT78 conventional leaded package. The BYQ28EB series is supplied in the SOT404 surface mounting package. The BYQ28ED series is supplied in the SOT428 surface mounting package. PINNING SOT78 (TO220AB) SOT404 SOT428 PIN DESCRIPTION 1 anode 1 2 cathode 3 anode 2 tab cathode LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134) SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT BYQ28E/ BYQ28EB/ BYQ28ED -150 -200 VRRM Peak repetitive reverse - 150 200 V voltage V RWM Working peak reverse - 150 200 V voltage VR Continuous reverse voltage - 150 200 V IO(AV) Average rectified output square wave; δ = 0.5; Tmb ≤ 119 ˚C - 10 A current (both diodes conducting) I FRM Repetitive peak forward square wave; δ = 0.5; Tmb ≤ 119 ˚C - 10 A current per diode IFSM Non-repetitive peak forward t = 10 ms - 50 A current per diode t = 8.3 ms - 55 A sinusoidal; with reapplied VRRM(max) IRRM Peak repetitive reverse tp = 2 µs; δ = 0.001 - 0.2 A surge current per diode IRSM Peak non-repetitive reverse tp = 100 µs - 0.2 A surge current per diode Tj Operating junction - 150 ˚C temperature Tstg Storage temperature - 40 150 ˚C 1. It is not possible to make connection to pin 2 of the SOT428 or SOT404 packages. k a1 a2 tab tab 12 3 tab October 1998 1 Rev 1.300

Philips Semiconductors Product specification Rectifier diodes BYQ28E, BYQ28EB, BYQ28ED series ultrafast, rugged ESD LIMITING VALUE SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VC Electrostatic discharge Human body model; - 8 kV capacitor voltage C = 250 pF; R = 1.5 k Ω THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT R th j-mb Thermal resistance junction per diode - - 4.5 K/W to mounting base both diodes - - 3 K/W R th j-a Thermal resistance junction SOT78 package, in free air - 60 - K/W to ambient SOT404 and SOT428 packages, pcb - 50 - K/W mounted, minimum footprint, FR4 board

ELECTRICAL CHARACTERISTICS

All characteristics are per diode at Tj = 25 ˚C unless otherwise specified SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT V F Forward voltage I F = 5 A; Tj = 150˚C - 0.8 0.895 V IF = 5 A - 0.95 1.1 V IF = 10 A - 1.1 1.25 V IR Reverse current V R = VRWM -2 1 0 µA VR = VRWM ; Tj = 100˚C - 0.1 0.2 mA Q rr Reverse recovered charge IF = 2 A; VR ≥ 30 V; -dIF/dt = 20 A/µs- 4 9 n C trr1 Reverse recovery time I F = 1 A; VR ≥ 30 V; -dIF/dt = 100 A/µs1 5 2 5 n s trr2 Reverse recovery time I F = 0.5 A to IR = 1 A; Irec = 0.25 A - 10 20 ns Irrm Peak reverse recovery I F = 5 A; VR ≥ 30 V; -dIF/dt = 50 A/µs - 0.5 0.7 A current Vfr Forward recovery voltage IF = 1 A; dIF/dt = 10 A/µs- 1 - V October 1998 2 Rev 1.300

Philips Semiconductors Product specification Rectifier diodes BYQ28E, BYQ28EB, BYQ28ED series ultrafast, rugged Fig.1. Definition of trr1, Qs and Irrm Fig.2. Definition of Vfr Fig.3. Maximum forward dissipation PF = f(IF(AV)) per diode; square current waveform where IF(AV) =IF(RMS) x √D. Fig.4. Circuit schematic for trr2 Fig.5. Definition of trr2 Fig.6. Maximum forward dissipation PF = f(IF(AV)) per diode; sinusoidal current waveform where a = form factor = IF(RMS) / IF(AV). Q s 100%10% time dI dt F I R IF I rrm trr shunt Current to ’scope D.U.T. Voltage Pulse Source R time time V F V fr V F IF I = 1AR recI = 0.25A trr2 0.5A IF IR 0123456780 D = 1.0 0.5 0.2 0.1 BYQ28 IF(AV) / A PF / W Tmb(max) / C 150 145 140 135 130 125 120 115 110 D = tp tp T T t I Vo = 0.748 V Rs = 0.0293 Ohms 01234560 a = 1.57 1.9 2.2 2.8 BYQ28 IF(AV) / A PF / W Tmb(max) / C 150 145 140 135 130 125 120 Vo = 0.748 V Rs = 0.0293 Ohms October 1998 3 Rev 1.300

Philips Semiconductors Product specification Rectifier diodes BYQ28E, BYQ28EB, BYQ28ED series ultrafast, rugged Fig.7. Maximum trr at Tj = 25 ˚C; per diode Fig.8. Maximum Irrm at Tj = 25 ˚C; per diode Fig.9. Typical and maximum forward characteristic IF = f(VF); parameter Tj Fig.10. Maximum Qs at Tj = 25 ˚C; per diode Fig.11. Transient thermal impedance; per diode; Zth j-mb = f(tp). trr / ns 11 0 100 1000 100 dIF/dt (A/us) IF=1A IF=5A 0.1 1.0 100 Qs / nC 1.0 10 100 -dIF/dt (A/us) IF=5A IF=2A IF=1A 0.1 0.01 Irrm / A 1 10 100 -dIF/dt (A/us) IF=5A IF=1A 1us 10us 100us 1ms 10ms 100ms 1s 10s0.001 0.01 0.1 BYQ28Epulse width, tp (s) Transient thermal impedance, Zth j-mb (K/W) D = tp tp T TP t D 0.5 VF / V 1.5 IF / A typ max Tj=150C Tj=25C BYQ28 October 1998 4 Rev 1.300

Philips Semiconductors Product specification Rectifier diodes BYQ28E, BYQ28EB, BYQ28ED series ultrafast, rugged MECHANICAL DATA Dimensions in mm Net Mass: 2 g Fig.12. SOT78 (TO220AB); pin 2 connected to mounting base. Notes 1. Refer to mounting instructions for SOT78 (TO220) envelopes. 2. Epoxy meets UL94 V0 at 1/8". 10,3 max 3,7 2,8 3,03,0 max not tinned 1,3 max (2x) 123 2,4 0,6 4,5 max 5,9 min 15,8 max 1,3 2,54 2,54 0,9 max (3x) 13,5 min October 1998 5 Rev 1.300

Philips Semiconductors Product specification Rectifier diodes BYQ28E, BYQ28EB, BYQ28ED series ultrafast, rugged MECHANICAL DATA Dimensions in mm Net Mass: 1.4 g Fig.13. SOT404 : centre pin connected to mounting base. MOUNTING INSTRUCTIONS Dimensions in mm Fig.14. SOT404 : soldering pattern for surface mounting. Notes 1. Epoxy meets UL94 V0 at 1/8". 11 max 4.5 max 1.4 max 10.3 max 0.5 15.4 2.5 0.85 max (x2) 2.54 (x2) 17.5 11.5 9.0 5.08 3.8 2.0 October 1998 6 Rev 1.300

Philips Semiconductors Product specification Rectifier diodes BYQ28E, BYQ28EB, BYQ28ED series ultrafast, rugged MECHANICAL DATA Dimensions in mm Net Mass: 1.1 g Fig.15. SOT428 : centre pin connected to tab. MOUNTING INSTRUCTIONS Dimensions in mm Fig.16. SOT428 : minimum pad sizes for surface mounting. Notes 1. Plastic meets UL94 V0 at 1/8". 6.22 max 2.38 max 0.93 max 6.73 max 0.3 10.4 max 0.5 0.8 max (x2) 2.285 (x2) 0.5 seating plane 1.1 0.5 min 5.4 4 min 4.6 tab 7.0 7.0 2.15 2.5 4.57 1.5 October 1998 7 Rev 1.300

Philips Semiconductors Product specification Rectifier diodes BYQ28E, BYQ28EB, BYQ28ED series ultrafast, rugged DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.  Philips Electronics N.V. 1998 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. October 1998 8 Rev 1.300