BYQ28_SER_E_ED

BYQ28_SER_E_ED_15 PHILIPS | Alldatasheet

Document overview

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Technical content

1.1 General description

SOT428 (DPAK) plastic package.

1.2 Features

1.3 Applications

1.4 Quick reference data

[1] It is not possible to connect to pin 2 of the SOT428 package. Table 1. Pinning

BYQ28_SER_E_ED_4 © NXP B.V. 2007. All rights reserved. Table 2. Ordering information Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).

BYQ28_SER_E_ED_4 © NXP B.V. 2007. All rights reserved. [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. Table 4. Thermal characteristics

BYQ28_SER_E_ED_4 © NXP B.V. 2007. All rights reserved. Table 5. Characteristics Tj = 25°C unless otherwise specified.

BYQ28_SER_E_ED_4 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 04 — 5 December 2007 5 of 10 NXP Semiconductors BYQ28 series E and ED Rectifier diodes ultrafast, rugged Fig 3. Reverse recovery definitions Fig 4. Forward recovery definitions 001aab911 trr time 100 % 10 % IF dlF dt IR IRM Q r 001aab912 time time VFR VF IF V F IF(AV)=IF(RMS) ×√ δ a = form factor = IF(RMS) /IF(AV) Fig 5. Forward power dissipation as a function of average forward current; square waveform; maximum values Fig 6. Forward power dissipation as a function of average forward current; sinusoidal waveform; maximum values IF(AV) (A) 08 624 001aag976 Ptot (W) d = 1 0.2 0.1 0.5 001aag977 IF(AV) (A) 06 42 P tot (W) a = 1.57 2.2 2.8 4.0 1.9

BYQ28_SER_E_ED_4 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 04 — 5 December 2007 6 of 10 NXP Semiconductors BYQ28 series E and ED Rectifier diodes ultrafast, rugged 7. Package outline Fig 7. Package outline SOT78 (TO-220AB) REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT78 SC-46 3-lead TO-220AB D D 1 q p L 123 e e b 0 5 10 mm scale Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB SOT78 DIMENSIONS (mm are the original dimensions) AE c Q UNIT A 1 b1 D 1 e p mm 2.54 qQA b Dc L2 max. 3.0 3.8 3.5 15.0 12.8 3.30 2.79 3.0 2.7 2.6 2.2 0.7 0.4 16.0 15.2 0.9 0.6 1.45 1.00 4.7 4.1 1.40 1.25 6.6 5.9 10.3 9.7 L1E L 05-03-22 05-10-25 mounting base

BYQ28_SER_E_ED_4 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 04 — 5 December 2007 7 of 10 NXP Semiconductors BYQ28 series E and ED Rectifier diodes ultrafast, rugged Fig 8. Package outline SOT428 (TO-252) REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT428 SC-63 TO-252 SOT428 06-02-14 06-03-16 DIMENSIONS (mm are the original dimensions) Plastic single-ended surface-mounted package (DPAK); 3 leads (one lead cropped) A D 2 D 1 H D L e mounting base wAMb E b1 c y 0 5 10 mm scale UNIT mm 0.93 0.46 5.46 5.00 0.56 0.20 6.22 5.98 6.73 6.47 10.4 9.6 2.95 2.55 A 1 2.38 2.22 Ab 2 1.1 0.9 b1 e1 0.89 0.71 bc D 1 0.9 0.5 L2Ee 2.285 4.574.0 D 2 min 4.45 E 1 min 0.5 minH D Lw 0.2 y max 0.2 A

BYQ28_SER_E_ED_4 © NXP B.V. 2007. All rights reserved. Table 6. Revision history

• The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
• Limiting values table: some parameter descriptions amended to conform to latest standards; I FRM conditions amended; VESD row added.
• Characteristics: Qrr changed to Qr ‘recovered charge’; trr1 and trr2 changed to trr with ‘ramp recovery’ and ‘step recovery’ added to conditions. BYQ28E_SERIES_3 19981001 Product specification - BYQ28E_SERIES_2 BYQ28E_SERIES_2 19980701 Product specification - BYQ28E_SERIES_1; BYQ28EB_SERIES_1 BYQ28E_SERIES_1; BYQ28EB_SERIES_1

19960801 Product specification - -

BYQ28_SER_E_ED_4 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 04 — 5 December 2007 9 of 10 NXP Semiconductors BYQ28 series E and ED Rectifier diodes ultrafast, rugged 9. Legal information

9.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

9.2 Definitions

Draft —The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet —A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

9.3 Disclaimers

General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes —NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use —NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications —Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values —Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale —NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license —Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

9.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 10. Contact information For additional information, please visit:http://www.nxp.com For sales office addresses, send an email to:salesaddresses@nxp.com Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.

NXP Semiconductors BYQ28 series E and ED Rectifier diodes ultrafast, rugged © NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 5 December 2007 Document identifier: BYQ28_SER_E_ED_4 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 11. Contents