BYG10Y GULFSEMI | Alldatasheet
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Technical content
For surface mounted application High temperature metallurgic ally bonded Sintered glass junction Capability of meeting environmental standard of MIL-S-19500 High temperature soldering guaranteed 450 ℃/10sec/at terminal ／complete device Submersible temperature of 265 ℃ for 10sec MECHANICAL DATA Terminal ：Plated Terminal, solderable per MIL-STD 202, method 208C Case ：Molded with UL-94 class V-0 recognized Flame Retardant Epoxy over Glass Polarity ：color band denotes cathode end Dimensions in inches and (millimeters) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (single —phase, half —wave, 60HZ, resistive or inductive load rating at 25 ℃, unless otherwise stated, for capacitive load, derate current by 20 ％) SYMBOL BYG10Y units Maximum Recurrent Peak Reverse Voltage Vrrm 1600 V Maximum RMS Voltage Vrms 1120 V Maximum DC blocking Voltage Vdc 1600 V Maximum Average Forward Rectified Current If(av) 1.5 A Peak Forward Surge Current 8.3ms single half sine-wave superimposed on rated load Ifsm 50.0 A Maximum Forward Voltage at rated Forward current Ta =25 ℃ Vf 1.15 V Maximum full load reverse current full cycle average at 75 ambient℃ Ir(av) 30.0 µA Maximum DC Reverse Current Ta =25℃ at rated DC blocking voltage Ta =125℃ Ir 5.0 50.0 µA Typical Junction Capacitance (Note 1) Cj 15.0 pF Typical Thermal Resistance (Note 2) Rth(ja) 80.0 /W℃ Operating and Storage Temperature Range Tstg, Tj -65 to +175 ℃ Note ： 1. Measured at 1.0 MHz and applied reverse voltage of 4.0Vdc 2. Thermal Resistance from Junction to Ambient 6.0mm 2 copper pad to each terminal Rev.A1 www.gulfsemi.com
RATINGS AND CHARACTERISTIC CURVES BYG10Y Rev.A1 www.gulfsemi.com