BYG10D LUGUANG | Alldatasheet

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FEATURES

Ideal for automated placement Controlled avalanche characteristics Glass passivated junction Low reverse current High surge current capability Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C Solder dip 260 °C, 40 s Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC MECHANICAL DATA Case: DO-214AC (SMA) Epoxy meets UL 94 V-0 flammability rating Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 E3 suffix for consumer grade, meets JESD 201 class 1A whisker test, HE3 suffix for high reliability grade (AEC-Q101 qualified), meets JESD 201 class 2 whisker test MAXIMUM RATINGS (T A = 25 °C unless otherwise noted) PARAMETER SYMBOL BYG10D BYG10G BYG10J BYG10K BYG10M BYG10Y UNIT Device marking code BYG10D BYG10G BYG10J BYG10K BYG10M BYG10Y Maximum repetitive peak reverse voltage V RRM 200 400 600 800 1000 1600 V Average forward current I F(AV) 1.5 A Peak forward surge current 10 ms single half sine-wave superimposed on rated load I FSM 30 A Pulse energy in avalanche mode, non repetitive (inductive load switch off) I (BR)R = 1 A, T J = 25 °C (for BYG10D-BYG10M) E R 20 mJ Operating junction and storage temperature range T J , T STG - 55 to + 150 °C SMA/DO-214AC 0. 181 ( 4. 60) 0. 161 ( 4. 10) 0. 209 ( 5. 30) 0. 193 ( 4. 90) 0. 063(1.60) 0. 051(1.30) 0.108 (2.75) 0.096 (2.45) Dimensions in inches and(millimeters) 0. 059 ( 1. 50) 0. 035 ( 0. 90) 0.012(0.30) 0.006(0.15) 0.002(0.05) 0.078 (2.00) 0.096(2.45) 0.008(0.20) /cuspopen /cuspopen /cuspopen /cuspopen /cuspopen /cuspopen /cuspopen /cuspopen /cuspopen /cuspopen /cuspopen /cuspopen http://www.lgesemi .com mail:lge@lgesemi.comRevision:20170701-P1

Note: (1) Pulse test: 300 µs pulse width, 1 % duty cycle Notes: (1) Mounted on epoxy-glass hard tissue (2) Mounted on epoxy-glass hard tissue, 50 mm 35 µm Cu (3) Mounted on Al-oxide-ceramic (Al O ), 50 mm 35 µm Cu Note: (1) AEC-Q101 qualified ELECTRICAL CHARACTERISTICS (T A = 25 °C unless otherwise noted) PARAMETER TEST CONDITIONS SYMBOL BYG10D BYG10G BYG10J BYG10K BYG10M BYG10Y UNIT Maximum instantaneous forward voltage (1) I F = 1 A I F = 1.5 A T J = 25 °C V F 1.1 1.15 V Maximum DC reverse current V R = V RRM T J = 25 °C T J = 100 °C I R 10 µA Maximum reverse recovery time I F = 0.5 A, I R = 1.0 A, I rr = 0.25 A t rr 4µ s THERMAL CHARACTERISTICS (T A = 25 °C unless otherwise noted) PARAMETER SYMBOL BYG10D BYG10G BYG10J BYG10K BYG10M BYG10Y UNIT Typical thermal resistance, junction to lead R θJL 25 °C/W Typical thermal resistance, junction to ambient R θJA 150 (1) 125 (2) 100 (3) °C/W ORDERING INFORMATION (Example) PREFERRED P/N UNIT WEIGHT (g) PACKAGE CODE BASE QUANTITY DELIVERY MODE BYG10D-E3/TR 0.064 TR 1800 7" diameter plastic tape and reel BYG10D-E3/TR3 0.064 TR3 7500 13" diameter plastic tape and reel BYG10DHE3/TR (1)

0.064 TR 1800 7" diameter plastic tape and reel

(1)

0.064 TR3 7500 13" diameter plastic tape and reel

http://www.lgesemi .com mail:lge@lgesemi.comRevision:20170701-P1

Figure 1. Forward Current vs. Forward Voltage Figure 2. Max. Average Forward Current vs. Ambient Temperature Figure 3. Reverse Current vs. Junction Temperature

125 K/W

150 K/W

25 K/W

Figure 4. Max. Reverse Power Dissipation vs. Junction Temperature Figure 5. Diode Capacitance vs. Reverse Voltage Figure 6. Reverse Recovery Time vs. Forward Current

Figure 7. Reverse Recovery Charge vs. Forward Current