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A A B C D DO-15 Dim Min Max A 25.40 /c190 B 5.50 7.62 C 0.686 0.889 D 2.60 3.60 All Dimensions in mm Maximum Ratings and Electrical Characteristics @ T A = 25/c176C unless otherwise specified /c183 /c183 /c183 /c183 /c183 /c183 Mechanical Data /c183 /c183 /c183 /c183 Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. High temperature metallurgically bonded construction Sintered glass cavity free junction Capability of meeting environmental standard of MIL-S-19500 High temperature soldering guaranteed 350°C /10sec/0.375”lead length at 5 lbs tension Operate at Ta =55°C with no thermal run away Typical Ir<0.1µA Terminal:Plated axial leads solderable per MIL-STD 202E, method 208C Case:Molded with UL-94 Class V-0 recognized Flame Retardant Epoxy Polarity:color band denotes cathode Mounting position:any SYMBOL BY448GP units Maximum Recurrent Peak Reverse Voltage Vrrm 1650 V Maximum RMS Voltage Vrms 1150 V Maximum DC blocking Voltage Vdc 1650 V Maximum Average Forward Rectified Current 3/8”lead length at Ta =55 If(av) 2.0 A Peak Forward Surge Current 8.3ms single Half sine-wave superimposed on rated load Ifsm 30.0 A Maximum Instantaneous Forward Voltage at 3.0A Vf 1.60 V Maximum full load reverse current full cycle Average at 55 Ir(av) 100.0 µ A Maximum DC Reverse Current Ta =25 at rated DC blocking voltage Ta =150 Ir 5.0 150.0 µ A µ A Typical Reverse Recovery Time (Note 1) Trr 1000 n S Typical Thermal Resistance (Note 2) Rth(ja) 100 K/W Storage and Operating Junction Temperature Tstg, Tj -65 to +175 Note: 1. Reverse Recovery Condition If =0.5A, Ir =1.0A, Irr =0.25A 2. Thermal Resistance from Junction to Ambient on PC board with spacing 25mm BY448GP 2.0A Axial Leaded Sintered Class Junction Plastic Rectifier