BY229F PHILIPS | Alldatasheet

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Philips Semiconductors Product specification Rectifier diodes BY229F, BY229X series fast, soft-recovery FEATURES SYMBOL QUICK REFERENCE DATA

  • Low forward volt drop V R = 200 V/ 400 V/ 600 V/800 V
  • Fast switching
  • Soft recovery characteristic I F(AV) = 8 A
  • High thermal cycling performance
  • Isolated mounting tab I FSM ≤ 60 A trr ≤ 135 ns GENERAL DESCRIPTION Glass-passivated double diffused rectifier diodes featuring low forward voltage drop, fast reverse recovery and soft recovery characteristic. The devices are intended for use in TV receivers, monitors and switched mode power supplies. The BY229F series is supplied in the conventional leaded SOD100 package. The BY229X series is supplied in the conventional leaded SOD113 package. PINNING SOD100 SOD113 PIN DESCRIPTION 1 cathode 2 anode tab isolated LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT BY229F- / BY229X- 200 400 600 800 VRSM Peak non-repetitive reverse - 200 400 600 800 V voltage VRRM Peak repetitive reverse voltage - 200 400 600 800 V VRWM Crest working reverse voltage - 150 300 500 600 V VR Continuous reverse voltage - 150 300 500 600 V IF(AV) Average forward current1 square wave; δ = 0.5; - 8 A Ths ≤ 83 ˚C sinusoidal; a = 1.57; - 7 A T hs ≤ 90 ˚C IF(RMS) RMS forward current - 11 A IFRM Peak repetitive forward current t = 25 µs; δ = 0.5; - 16 A Ths ≤ 83 ˚C IFSM Peak non-repetitive forward t = 10 ms - 60 A current t = 8.3 ms - 66 A sinusoidal; Tj = 150 ˚C prior to surge; with reapplied VRWM(max) I2tI 2t for fusing t = 10 ms - 18 A 2s Tstg Storage temperature -40 150 ˚C Tj Operating junction temperature - 150 ˚C 1. Neglecting switching and reverse current losses. k a case case September 1998 1 Rev 1.200

Philips Semiconductors Product specification Rectifier diodes BY229F, BY229X series fast, soft-recovery ISOLATION LIMITING VALUE & CHARACTERISTIC Ths = 25 ˚C unless otherwise specified SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT V isol Peak isolation voltage from SOD100 package; R.H. ≤ 65%; clean and - - 1500 V both terminals to external dustfree heatsink Visol R.M.S. isolation voltage from SOD113 package; f = 50-60 Hz; - - 2500 V both terminals to external sinusoidal waveform; R.H. ≤ 65%; clean heatsink and dustfree C isol Capacitance from pin 1 to f = 1 MHz - 10 - pF external heatsink THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT R th j-hs Thermal resistance junction to with heatsink compound - - 4.8 K/W heatsink without heatsink compound - - 7.2 K/W R th j-a Thermal resistance junction to in free air. - 55 - K/W ambient STATIC CHARACTERISTICS Tj = 25 ˚C unless otherwise stated SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT V F Forward voltage I F = 20 A - 1.5 1.85 V IR Reverse current V R = VRWM ; Tj = 125 ˚C - 0.1 0.4 mA DYNAMIC CHARACTERISTICS Tj = 25 ˚C unless otherwise stated SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT t rr Reverse recovery time I F = 1 A; VR > 30 V; -dIF/dt = 50 A/µs - 100 135 ns Q s Reverse recovery charge I F = 2 A; VR > 30 V; -dIF/dt = 20 A/µs - 0.5 0.7 µC dIR /dt Maximum slope of the reverse I F = 2 A; -dIF/dt = 20 A/µs - 50 60 A/ µs recovery current September 1998 2 Rev 1.200

Philips Semiconductors Product specification Rectifier diodes BY229F, BY229X series fast, soft-recovery Fig.1. Definition of trr, Qs and Irrm Fig.2. Maximum forward dissipation, PF = f(IF(AV)); square wave current waveform; parameter D = duty cycle = tp/T. Fig.3. Maximum forward dissipation, PF = f(IF(AV)); sinusoidal current waveform; parameter a = form factor = IF(RMS) /IF(AV). Fig.4. Maximum non-repetitive rms forward current. IF = f(tp); sinusoidal current waveform; Tj = 150˚C prior to surge with reapplied VRWM . Fig.5. Typical and maximum forward characteristic; IF = f(VF); parameter Tj Fig.6. Maximum Qs at Tj = 25˚C and 150˚C 100% time dI dt F I R IF I rrm trr 25%Qs 1ms 10ms 0.1s 1s 10s tp / s IFS(RMS) / A BY229 IFSM 0 1 BY229F VF / V IF / A 20.5 1.5 maxtyp Tj = 150 C Tj = 25 C 0 2 4 6 8 10 12 BY329 IF(AV) / A PF / W Ths(max) / C 150 102 126 0.5 0.2 0.1 D = 1.0 D = tp tp T T I t Vo = 1.25 V Rs = 0.03 Ohms 1 100 BY329 -dIF/dt (A/us) Qs / uC10 0.1 10 2 A IF = 10 A 10 A 1 A 1 A 2 A Tj = 150 C Tj = 25 C 0 2 4 6 8 BY329 IF(AV) / A PF / W15 2.8 2.2 1.9 a = 1.57 Ths(max) / C 150 102 126 Vo = 1.25 V Rs = 0.03 Ohms September 1998 3 Rev 1.200

Philips Semiconductors Product specification Rectifier diodes BY229F, BY229X series fast, soft-recovery Fig.7. Maximum trr measured to 25% of Irrm; Tj = 25˚C and 150˚C Fig.8. Typical junction capacitance Cd at f = 1 MHz; Tj = 25˚C Fig.9. Transient thermal impedance Zth = f(tp) 1 10 100 BY329 -dIF/dt (A/us) trr / ns1000 100 1 A IF = 10 A Tj = 150 C Tj = 25 C 10A 1us 10us 100us 1ms 10ms 100ms 1s 10s0.001 0.01 0.1 BY229Fpulse width, tp (s) Transient thermal impedance, Zth j-hs (K/W) D = tp tp T TP t D 1 100 100 1 10 1000 BY329Cd / pF VR / V September 1998 4 Rev 1.200

Philips Semiconductors Product specification Rectifier diodes BY229F, BY229X series fast, soft-recovery MECHANICAL DATA Dimensions in mm Net Mass: 2 g Fig.10. SOD100; The seating plane is electrically isolated from all terminals. Notes 1. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8". 10.2 max 5.7 max 3.2 3.0 0.9 0.5 4.4 max 2.9 max 4.4 4.0 seating plane 7.9 7.5 max 0.55 max 1.3 13.5 min 5.08 0.9 0.7M0.4 top view 3.5 max not tinned 4.4 ka September 1998 5 Rev 1.200

Philips Semiconductors Product specification Rectifier diodes BY229F, BY229X series fast, soft-recovery MECHANICAL DATA Dimensions in mm Net Mass: 2 g Fig.11. SOD113; The seating plane is electrically isolated from all terminals. Notes 1. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8". 10.3 max 3.2 3.0 4.6 max 2.9 max 2.8 seating plane 6.4 15.8 max 0.6 2.5 2.54 5.08 3 max. not tinned 0.5 2.5 0.9 0.7 M0.4 15.8 max. max. 13.5 min. Recesses (2x) 2.5 0.8 max. depth 1.0 (2x) September 1998 6 Rev 1.200

Philips Semiconductors Product specification Rectifier diodes BY229F, BY229X series fast, soft-recovery DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.  Philips Electronics N.V. 1998 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. September 1998 7 Rev 1.200