BXEN-27E-11L-3A-00-0-0

SMD2835 BRIDGELUX | Alldatasheet

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SMD 2835 0.2W 3V Product Data Sheet DS55 BXEN-27x | 30x | 35x | 40x | 50x | 57x | 65x

The Bridgelux SMD 2835 low power LED is hot-color targeted which ensures that the LEDs fall within their specified color bin at the typical application conditions of 85°C. With its broad lumen coverage and wide range of CCT options, the SMD 2835 provides unparalleled design-in flexibility for indoor and outdoor lighting applications. The SMD 2835 is ideal as a drop in replacement for emitters with an industry standard 2.8mm x 3.5mm footprint.

Features

• Industry-standard 2835 footprint
• 9 bin color control enables tight color control
• Hot-color targeting ensures that color is within the ANSI bin at the typical application conditions of 85°C
• Enables 3- and 5-step MacAdam ellipse custom binning kits
• RoHS compliant and lead free
• Multiple CCT configurations for a wide range of lighting applications Benefits
• Lower operating and manufacturing cost
• Ease of design and rapid go-to-market
• Uniform consistent white light
• Reliable and constant white point
• Environmentally friendly, complies with standards
• Design flexibility SMD 2835

Emitting Surface (LES) Product Nomenclature The part number designation for Bridgelux SMD 2835 is explained as follows: Product Test Conditions Bridgelux SMD 2835 LEDs are tested and binned with a 10ms pulse of 60mA at Tj (junction temperature)=Tsp (solder point temperature) =25°C. Forward voltage and luminous flux are binned at a Tj=Tsp=25°C, while color is hot targeted at a Tsp of 85°C. 1 2 3 4 5 6 7 8 9 10 11 12 1314 15 16 Product Family Color Bin Options Flux Bins Minimum CRI E = 80 CRI Forward Voltage BinsNominal CCT 27 = 2,700K 30 = 3,000K 35 = 3,500K 40 = 4,000K 50 = 5,000K 57 = 5,700K 65 = 6,500K BXEN – 30 E – 1 1 L – 3 A – 00 – 0 – 0 Product Version Low Power Die count in parallel Typical Forward Voltage Die count in series Bridgelux SMD LED products come in industry standard package sizes and follow ANSI binning standards. These LEDs are optimized for cost and performance, helping to ensure highly competitive system lumen per dollar performance while addressing the stringent efficacy and reliability standards required for modern lighting applications.

The following product configurations are available: Part Number1,6 Nominal CCT2 (K) CRI3, 5 Nominal Drive Current (mA) Forward Voltage4, 5 (V) Typical Pulsed Flux (lm)4, 5 Typical Power (W) Typical Efficacy (lm/W) Min Typical Max BXEN-27E-11L-3A-00-0-0 2700 80 60 2.8 3.1 3.4 24 0.2 129 BXEN-30E-11L-3A-00-0-0 3000 80 60 2.8 3.1 3.4 25 0.2 134 BXEN-35E-11L-3A-00-0-0 3500 80 60 2.8 3.1 3.4 25 0.2 134 BXEN-40E-11L-3A-00-0-0 4000 80 60 2.8 3.1 3.4 26 0.2 140 BXEN-50E-11L-3A-00-0-0 5000 80 60 2.8 3.1 3.4 26 0.2 140 BXEN-57E-11L-3A-00-0-0 5700 80 60 2.8 3.1 3.4 26 0.2 140 BXEN-65E-11L-3A-00-0-0 6500 80 60 2.8 3.1 3.4 25 0.2 134 Notes for Table 1 & 2: 1. The last 6 characters (including hyphens ‘-’) refer to flux bins, forward voltage bins, and color bin options, respectively. “00-0-00” denotes the full distribution of flux, forward voltage, and 7 SDCM color. Example: BXEN-30E-11L-3A-00-0-0 refers to the full distribution of flux, forward voltage, and color within a 3000K 7-step ANSI standard chromaticity region with a minimum of 80CRI, 1x1 die configuration, low power, 3.1V typical forward voltage. 2. Product CCT is hot targeted at Tsp = 85°C. Nominal CCT as defined by ANSI C78.377-2011. 3. Listed CRIs are minimum values and include test tolerance. 4. Products tested under pulsed condition (10ms pulse width) at nominal drive current where T j=T sp=25°C. 5. Bridgelux maintains a ±7.5% tolerance on luminous flux measurements, ±0.1V tolerance on forward voltage measurements, and ±2 tolerance on CRI measurements for the SMD 2835. 6. Refer to Table 6 and Table 7 for Bridgelux SMD 2835 Luminous Flux Binning and Forward Voltage Binning information. 7. Typical stabilized DC performance values are provided as reference only and are not a guarantee of performance. 8. Typical performance is estimated based on operation under DC (direct current) with LED emitter mounted onto a heat sink with thermal interface material and the solder point temperature maintained at 85°C. Based on Bridgelux test setup, values may vary depending on the thermal design of the luminaire and/or the exposed environment to which the product is subjected. Table 2: Selection Guide, Stabilized DC Performance (T sp = 85°C)7,8 Part Number1,6 Nominal CCT2 (K) CRI3, 5 Nominal Drive Current (mA) Forward Voltage5 (V) Typical DC Flux (lm)5 Typical Power (W) Typical Efficacy (lm/W) Min Typical Max BXEN-27E-11L-3A-00-0-0 2700 80 60 2.7 3.0 3.3 21 0.2 118 BXEN-30E-11L-3A-00-0-0 3000 80 60 2.7 3.0 3.3 22 0.2 125 BXEN-35E-11L-3A-00-0-0 3500 80 60 2.7 3.0 3.3 22 0.2 125 BXEN-40E-11L-3A-00-0-0 4000 80 60 2.7 3.0 3.3 23 0.2 129 BXEN-50E-11L-3A-00-0-0 5000 80 60 2.7 3.0 3.3 23 0.2 129 BXEN-57E-11L-3A-00-0-0 5700 80 60 2.7 3.0 3.3 23 0.2 129 BXEN-65E-11L-3A-00-0-0 6500 80 60 2.7 3.0 3.3 22 0.2 124 Table 1: Selection Guide, Pulsed Measurement Data at 60mA (Tj=Tsp=25°C)

Performance at Commonly Used Drive Currents Table 3: Performance at Commonly Used Drive Currents Part Number CRI Drive Current1 (mA) Typical Vf Tsp = 25°C (V) Typical Power Tsp = 25°C (W) Typical Pulsed Flux2 Tsp = 25°C (lm) Typical DC Flux3 Tsp = 85°C (lm) Typical Efficacy Tsp = 25°C (lm/W) BXEN-27E-11L-3A-00-0-0 80 20 2.8 0.1 9 8 158 30 2.9 0.1 13 11 150 40 2.9 0.1 17 15 143 60 3.1 0.2 24 21 129 80 3.2 0.3 31 27 122 BXEN-30E-11L-3A-00-0-0 80 20 2.8 0.1 9 8 165 30 2.9 0.1 13 12 156 40 2.9 0.1 18 15 149 60 3.1 0.2 25 22 134 80 3.2 0.3 33 28 127 BXEN-35E-11L-3A-00-0-0 80 20 2.8 0.1 9 8 165 30 2.9 0.1 13 12 156 40 2.9 0.1 18 15 149 60 3.1 0.2 25 22 134 80 3.2 0.3 33 28 127 BXEN-40E-11L-3A-00-0-0 81 20 2.8 0.1 10 8 171 30 2.9 0.1 14 12 163 40 2.9 0.1 18 16 155 60 3.1 0.2 26 23 140 80 3.2 0.3 34 29 132 BXEN-50E-11L-3A-00-0-0 82 20 2.8 0.1 10 8 171 30 2.9 0.1 14 12 163 40 2.9 0.1 18 16 155 60 3.1 0.2 26 23 140 80 3.2 0.3 34 29 132 BXEN-57E-11L-3A-00-0-0 83 20 2.8 0.1 10 8 171 30 2.9 0.1 14 12 163 40 2.9 0.1 18 16 155 60 3.1 0.2 26 23 140 80 3.2 0.3 34 29 132 BXEN-65E-11L-3A-00-0-0 84 20 2.8 0.1 9 8 165 30 2.9 0.1 13 12 156 40 2.9 0.1 18 15 149 60 3.1 0.2 25 22 134 80 3.2 0.3 33 28 127 SMD 2835 LEDs are tested to the specifications shown using the nominal drive currents in Table 1. SMD 2835 may also be driven at other drive currents dependent on specific application design requirements. The performance at any drive current can be derived from the current vs. voltage characteristics shown in Figure 2 and the relative luminous flux vs. current characteristics shown in Figure 3. The performance at commonly used drive currents is summarized in Table 3. Notes for Table 3: 1. Alternate drive currents in Table 3 are provided for reference only and are not a guarantee of performance. 2. Bridgelux maintains a ± 7.5% tolerance on flux measurements. 3. Typical stabilized DC performance values are provided as reference only and are not a guarantee of performance.

Electrical Characteristics

Notes for Table 4: 1. The last 6 characters (including hyphens ‘-’) refer to flux bins, forward voltage bins, and color bin options, respectively. “00-0-00” denotes the full distribution of flux, forward voltage, and 7 SDCM color. Example: BXEN-30E-11L-3A-00-0-0 refers to the full distribution of flux, forward voltage, and color within a 3000K 7-step ANSI standard chromaticity region with a minimum of 80CRI, 1x1 die configuration, low power, 3.1V typical forward voltage. 2. Bridgelux maintains a tolerance of ± 0.1V on forward voltage measurements. Voltage minimum and maximum values at the nominal drive current are guaranteed by 100% test. 3. Products tested under pulsed condition (10ms pulse width) at nominal drive current where Tsp = 25°C. 4. Thermal resistance value was calculated using total electrical input power; optical power was not subtracted from input power. Table 4: Electrical Characteristics Part Number 1 Drive Current (mA) Forward Voltage (V) 2,3 Typical Temperature Coefficient of Forward Voltage ∆Vf/∆T (mV/ºC) Typical Thermal Resistance Junction to Solder Point4 R j-sp (ºC/W) Minimum Typical Maximum BXEN-xxE-11L-3A-00-0-0 60 2.8 3.1 3.4 -1.9 29

Notes for Table 5: 1. Bridgelux recommends a maximum duty cycle of 10% and pulse width of 10 ms when operating LED SMD at maximum peak pulsed current specified. Maximum peak pulsed current indicate values where LED SMD can be driven without catastrophic failures. 2. Light emitting diodes are not designed to be driven in reverse voltage and will not produce light under this condition. Maximum rating provided for reference only. 3. The maximum drive current for LM80 test results is based on the nominal drive current listed. Parameter Maximum Rating LED Junction Temperature (Tj) 125°C Storage Temperature -40°C to +105°C Operating Solder Point Temperature (TSp) -40°C to +105°C Soldering Temperature 260°C or lower for a maximum of 10 seconds Maximum Drive Current3 80mA Maximum Peak Pulsed Forward Current1 120mA Maximum Reverse Voltage2 -5V Moisture Sensitivity Rating MSL 3 Electrostatic Discharge 2kV HBM. JEDEC-JS-001-HBM and JEDEC-JS-001-2012 Table 5: Maximum Ratings

Table 6: Luminous Flux Bin Definitions at 60mA, Tsp=25°C Bin Code Minimum Maximum Unit Condition 1A 22 24 lm IF=60mA 1B 24 26 1C 26 28 1D 28 30 1E 30 32 Table 6 lists the standard photometric luminous flux bins for Bridgelux SMD 2835 LEDs. Although several bins are listed, product availability in a particular bin varies by production run and by product performance. Not all bins are available in all CCTs. Table 7: Forward Voltage Bin Definition at 60mA, Tsp=25°C Bin Code Minimum Maximum Unit Condition A 2.8 2.9 V IF=60mA B 2.9 3.0 C 3.0 3.1 D 3.1 3.2 E 3.2 3.3 F 3.3 3.4 Note for Table 7: 1. Bridgelux maintains a tolerance of ± 0.1V on forward voltage measurements. Note for Table 6: 1. Bridgelux maintains a tolerance of ± 7.5% on luminous flux measurements.

Table 8: 3- and 5-step MacAdam Ellipse Color Bin Definitions Notes for Table 8: 1. Color binning at Tsp=85°C 2. Bridgelux maintains a tolerance of ± 0.007 on x and y color coordinates in the CIE 1931 color space. CCT Color Space Center Point Major Axis Minor Axis Ellipse Rotation Angle Color Bin X Y 2700K 3000K 3500K 4000K 5000K 5700K 6500K

Figure 1: C.I.E. 1931 Chromaticity Diagram (9 Color Bin Structure, hot-color targeted at Tsp=85°C)

Notes for Figure 6: 1. Characteristics shown for warm white based on 3000K and 80 CRI. 2. Characteristics shown for neutral white based on 4000K and 80 CRI. 3. Characteristics shown for cool white based on 6500K and 80 CRI. 4. For other color SKUs, the shift in color will vary. Please contact your Bridgelux Sales Representative for more information. Figure 6: Typical DC ccx Shift vs. Solder Point Temperature -0.010 -0.008 -0.006 -0.004 -0.002 0.000 0 25 50 75 100 125 ccx Shift Solder Point Temperature (°C) Warm White Neutral White Cool White 25°C Pulsed

Figure 9: Typical Color Spectrum Notes for Figure 9: 1. Color spectra measured at nominal current for Tsp = 25°C 2. Color spectra shown for warm white is 2700K and 80 CRI. 3. Color spectra shown for warm white is 3000K and 80 CRI. 4. Color spectra shown for neutral white is 4000K and 80 CRI. 5 Color spectra shown for cool white is 6500K and 80 CRI. 0.0000 0.2000 0.4000 0.6000 0.8000 1.0000 400 450 500 550 600 650 700 750 800 Relative Spectral Power Distribution Wavelength (nm) 2700K 3000K 4000K 6500K

Figure 10: Drawing for SMD 2835 Notes for Figure 10: 1. Drawings are not to scale. 2. Drawing dimensions are in millimeters. 3. Unless otherwise specified, tolerances are ± 0.10mm. Recommended PCB Soldering Pad Pattern Cathode Mark

No . Items R而而而eference Standard Test Conditions Drive Current Test Duration Units Failed/Tested

1 Moisture/Reflow Sensitivity J-STD-020E Tsld = 260°C, 10sec,

Precondition: 60°C, 60%RH, 168hr - 3 reflows 0/22

2 Low Temperature Storage JESD22-A119 Ta=-40°C - 1000 hours 0/22

3 High Temperature Storage JESD22-A103D Ta= 100°C - 1000 hours 0/22

4 Low Temperature Operating Life JESD22-A108D Ta=-40°C 60mA 1000 hours 0/22

5 Temperature Humidity Operating Life JESD22-A101C Tsp=85°C℃, RH=85% 60mA 1000 hours 0/22

6 High Temperature Operating Life JESD22-A108D Tsp=105°C 80mA 1000 hours 0/22

7 Power switching IEC62717:2014 Tsp= 105°C

30 sec on, 30 sec off 80mA 30000 cycles 0/22

8 Thermal Shock JESD22-A106B Ta=-40°C ~100°C;

Dwell : 15min; Transfer: 10sec - 200 cycles 0/22

9 Temperature Cycle JESD22-A104E

Ta=-40°C ~100°C; Dwell at extreme temperature: 15min; Ramp rate < 105°C/min - 200 cycles 0/22 10 Electrostatic Discharge JS-001-2012 HBM, 2KV, 1.5kΩ, 100pF, Alternately positive or negative - - 0/22 Table 9: Reliability Test Items and Conditions Notes for Table 9: 1. Measurements are performed after allowing the LEDs to return to room temperature 2. Tsld : reflow soldering temperature; Ta : ambient temperature Item Symbol Test Condition Passing Criteria Forward Voltage Vf 60mA Δ℃Vf<10% Luminous Flux Fv 60mA ℃ΔFv<30% Chromaticity Coordinates (x, y) 60mA ℃Δu’v’<0.007 Passing Criteria

Figure 15: Emitter Reel Packaging Drawings Note for Figure 15: 1. Drawings are not to scale.

Please contact your Bridgelux sales representative for assistance. MINOR PRODUCT CHANGE POLICY The rigorous qualification testing on products offered by Bridgelux provides performance assurance. Slight cosmetic changes that do not affect form, fit, or function may occur as Bridgelux continues product optimization. CAUTION: CHEMICAL EXPOSURE HAZARD Exposure to some chemicals commonly used in luminaire manufacturing and assembly can cause damage to the LED emitter. Please consult Bridgelux CAUTION: EYE SAFETY Eye safety classification for the use of Bridgelux SMD LED emitter is in accordance with IEC specification EN62471: Photobiological Safety of Lamps and Lamp Systems. SMD LED emitters are classified as Risk Group 1 when operated at or below the maximum drive current. Please use appropriate precautions. It is important that employees working with LEDs are trained to use them safely. CAUTION: RISK OF BURN Do not touch the SMD LED emitter during operation. Allow the emitter to cool for a sufficient period of time before handling. The SMD LED emitter may reach elevated temperatures such that could burn skin when touched. CAUTION CONTACT WITH LIGHT EMITTING SURFACE (LES) Avoid any contact with the LES. Do not touch the LES of the emitter or apply stress to the LES (yellow phosphor resin area). Contact may cause damage to the emitter Optics and reflectors must not be mounted in contact with the LES (yellow phosphor resin area). STANDARD TEST CONDITIONS Unless otherwise stated, LED emitter testing is performed at the nominal drive current.

About Bridgelux: We Build Light That Transforms © 2016 Bridgelux, Inc. All rights reserved 2016. Product specifications are subject to change without notice. Bridgelux and the Bridgelux stylized logo design are registered trademarks of Bridgelux, Inc. All other trademarks are the property of their respective owners. Bridgelux SMD 2835 （（（0.2W 3V Product Data Sheet DS55 Rev. B (07/2016)

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