BTW67-1000 STMICROELECTRONICS | Alldatasheet

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Table 1: Main Features

DESCRIPTION

Available in high power packages, the BTW67 / BTW69 Series is suitable in applications where power handling and power dissipation are critical, such as solid state relays, welding equipment, high power motor control. Based on a clip assembly technology, they offer a superior performance in surge current handling capabilities. Thanks to their internal ceramic pad, they provide high voltage insulation (2500V RMS), complying with UL standards (file ref: E81734). Symbol Value Unit IT(RMS) 50 A VDRM/VRRM 600 to 1200 V IGT 80 mA BTW67 and BTW69 Series 50A SCRS REV. 5February 2006 STANDARD Table 2: Order Codes Part Numbers Marking BTW67-xxx BTW67xxx BTW69-xxxRG BTW69xxx A K G K AG A K G RD91 (BTW67) TOP3 Ins. (BTW69) Table 3: Absolute Ratings (limiting values) Symbol Parameter Value Unit IT(RMS) RMS on-state current (180° conduction angle) RD91 Tc = 70°C 50 A TOP3 Ins. Tc = 75°C IT(AV) Average on-state current (180° conduction angle) RD91 Tc = 70°C 32 A TOP3 Ins. Tc = 75°C ITSM Non repetitive surge peak on-state current tp = 8.3 ms Tj = 25°C 610 Atp = 10 ms 580 I²tI ²t Value for fusing Tj = 25°C 1680 A2S dI/dt Critical rate of rise of on-state current IG = 2 x IGT , tr ≤ 100 ns F = 60 Hz Tj = 125°C 50 A/µs IGM Peak gate current tp = 20 µs T j = 125°C 8A PG(AV) Average gate power dissipation Tj = 125°C 1W Tstg Tj Storage junction temperature range Operating junction temperature range - 40 to + 150 - 40 to + 125 °C VRGM Maximum peak reverse gate voltage 5 V

Figure 8: Ordering Information Scheme Table 6: Product Selector Figure 9: RD91 Package Mechanical Data BTW 69 - 600 RG Standard SCR series Voltage Packing mode Type 67 = 50A in RD91 69 = 50A in TOP3 600 = 600V 800 = 800V 1200 = 1200V RG = Tube Blanck = Bulk Part Numbers Voltage (xxx) Sensitivity Package

600 V 800 V 1200 V

BTW67-xxx X X X 80 mA RD91 BTW69-xxx X X X 80 mA TOP3 Ins. A N2 N1 B F I C C2 C1 REF. DIMENSIONS Millimeters Inches Min. Max. Min. Max. A 40.00 1.575 A1 29.90 30.30 1.177 1.193 A2 22.00 0.867 B 27.00 1.063 B1 13.50 16.50 0.531 0.650 B2 24.00 0.945 C 14.00 0.551 C1 3.50 0.138 C2 1.95 3.00 0.077 0.118 E3 0.70 0.90 0.027 0.035 F 4.00 4.50 0.157 0.177 I 11.20 13.60 0.441 0.535 L1 3.10 3.50 0.122 0.138 L2 1.70 1.90 0.067 0.075 N1 33° 43° 33° 43° N2 28° 38° 28° 38°

Figure 10: TOP3 Insulated Package Mechanical Data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com R H K GF E D B A C JJ P ØL Table 7: Ordering Information Ordering type Marking Package Weight Base qty Delivery mode BTW67-xxx BTW67xxx RD91 20 g 25 Bulk BTW69-xxxRG BTW69xxx TOP3 Ins. 4.5 g 30 Tube Note: xxx = voltage Table 8: Revision History Date Revision Description of Changes Apr-2001 4A Last update. 13-Feb-2006 5 TOP3 Insulated delivery mode changed from bulk to tube. ECOPACK statement added. REF. DIMENSIONS Millimeters Inches A 4.4 4.6 0.173 0.181 B 1.45 1.55 0.057 0.061 C 14.35 15.60 0.565 0.614 D 0.5 0.7 0.020 0.028 E 2.7 2.9 0.106 0.114 F 15.8 16.5 0.622 0.650 G 20.4 21.1 0.815 0.831 H 15.1 15.5 0.594 0.610 J 5.4 5.65 0.213 0.222 K 3.4 3.65 0.134 0.144 ØL 4.08 4.17 0.161 0.164 P 1.20 1.40 0.047 0.055 R 4.60 0.181

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publicati on are subject to change without notice. This publication supersedes and replac es all information previously supplied. STMicroelectronics prod ucts are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectro nics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners © 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Ital y - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America