BTM430 LSTD | Alldatasheet
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Version 5.4 Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 wireless.support@lairdtech.com www.lairdtech.com/bluetooth
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REVISION HISTORY
Revision Date Description Approved By 1.0 3 Jan 2012 Initial Release Jonathan Kaye 2.0 20 Mar 2012 Updates to firmware v11.28.1.0 Jonathan Kaye 3.0 11 May 2012 Formatting and general editing Jonathan Kaye 4.0 7 Jan2013 Updated FCC Statement, new mech. drawings, general editing / formatting Jonathan Kaye 4.1 15 Mar 2013 Converted to Laird formatting Sue White 5.0 04 Feb 2014 Separated into two separate docs (Hardware Integration Guide and User Guide). Added a Related Documents section. Sue White 5.1 06 Feb 2014 Updated the Bluetooth SIG Qualification section. Jonathan Kaye 5.2 15 Aug 2014 Updated shipping tray image and added module package dimension image. Jonathan Kaye 5.3 3 Sept 2014 Updated EU Declaration of Conformity Jonathan Kaye 5.4 30 Nov 2016 Updated to Datasheet from Hardware Integration Guide Sue White
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1 OVERVIEW AND KEY FEATURES
The BTM430 and BTM431 Bluetooth® modules from Laird Technologies have been designed to meet the needs of developers who wish to add robust, short range Bluetooth data connectivity to their products. They are based on the market leading Cambridge Silicon Radio BC04 chipset, providing exce ptionally low power consumption with outstanding range. With physical sizes as small as 12.5 x 18.0mm and best of class, low-power operation, these modules are the ideal choice for applications where designers need both performance and minimum size. For m aximum flexibility in systems integration, the modules are designed to support a separate power supply for I/O. To aid product development and integration, Laird Technologies has integrated a complete Bluetooth protocol stack within the modules, including support for the Bluetooth Serial Port Profile. The modules are fully qualified as Bluetooth End Products, allowing designers to integrate them within their own products with no further Bluetooth Qualification. They can then list and promote their products on the Bluetooth website free of charge. A comprehensive AT command interface is included, which simplifies firmware integration. Combined with a low cost developer’s kit, this ensures that the choice of Laird Technologies Bluetooth modules guarantees the fastest route to market.
1.1 FEATURES AND BENEFITS
Bluetooth® v2.0+EDR Adaptive Frequency Hopping to cope with interference from other wireless devices External or internal antenna options Comprehensive AT interface for simple programming Bluetooth® END Product Qualified Compact size Class 2 output – 4dBm Low power operation UART interface PCM and SCO for external codec GPIO lines under AT control Support for multiple profiles Wi-Fi co-existence
1.2 APPLICATIONS
Embedded Devices Phone Accessories Security Devices Medical and Wellness Devices Automotive Applications Bluetooth Advertising ePOS
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2 SPECIFICATIONS
2.1 Detailed Specifications
Table 1: Detailed specifications Categories Feature Implementation Wireless Specification Bluetooth® Version 2.0+EDR Transmit Class Class 2 Frequency 2.402 – 2.480 GHz Channels 79 channels Frequency Hopping Adaptive Frequency Hopping Max Transmit Power +4 dBm at antenna pad – BTM430 +4 dBm from integrated antenna – BTM431 Min Transmit Power -27 dBm at antenna pad – BTM430 -27 dBm from integrated antenna – BTM431 Receive Sensitivity -84dBm Range 30m Data Transfer Rate Up to 300 kbps Antenna Modes External Antenna 50 Ohm matched SMT pad – BTM430 Integrated Antenna (option) +0dBi multilayer ceramic – BTM431 UART Interface Serial Interface RS-232 bi-directional for commands and data 16550 compatible Baud Rate Configurable from 1,200 to 921,600bps Non-standard baud rates supported Bits 8 Parity Odd, even, none Stop bits 1 Default Serial parameters 9600,n,8,1 Levels Set by VDD_USB input Modem Control DTR, DSR, DCD, RI, RTS, CTS General Purpose Interface I/O 8 general purpose I/O pins Audio Support 1 PCM channel @ 64kbps SCO Channels Support SCO and eSCO PCM Interface Configurable as master or slave 8 bit A-law 8 bit µ-law 13 bit linear PCM Clock available when in slave mode Protocols and Firmware Bluetooth Stack V2.0 compliant. Fully integrated. Profiles GAP Generic Access Profile SDP Service Discovery Profile
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2.2 Pin Definitions
Table 2: Pin Definitions Pin Signal Description Voltage Specification
1 Unused
2 GND
3 UART_CTS Clear to Send I/P VUSB
4 UART_RXD Receive data I/P VUSB
5 UART_RTS Request to Send O/P VUSB
6 UART_TXD Transmit data O/P VUSB
7 GND
8 SPI_CSB SPI bus chip select I/P VIO
9 SPI_MISO SPI bus serial O/P VIO
10 SPI_MOSI SPI bus serial I/P VIO
11 SPI_CLK SPI bus clock I/P VIO
12 VDD_USB USB & UART supply voltage
13 VDD_IO I/O supply voltage
14 VDD_IN Main supply voltage
15 GND
16 PCM_IN PCM data I/P VIO
17 PCM_SYNC PCM sync I/P VIO
18 PCM_CLK PCM clock I/P VIO
19 PCM_OUT PCM Data O/P VIO
20 RESET Module reset I/P See note 2
21 GPIO4 BT_ACTIVE / BT_STATE VIO
22 GPIO2 / UART_DCD I/O for host VIO
23 GND
24 Unused
25 Unused See note 3
26 Unused See note 3
27 Unused See note 3
28 GND (BTM430 only) See note 3
29 ANT (BTM430 only) Antenna connection (50 ohm
matched) See note 3
30 GND (BTM430 only) See note 3
31 Unused See note 3
32 Unused See note 3
33 Unused See note 3
34 Unused See note 3
35 Unused See note 3
36 Unused See note 3
37 Unused See note 3
38 Unused
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39 Unused
40 Unused
41 GND
42 GPIO1/ UART_RI I/O for host VIO
43 GPIO7 UART_DTR VIO
44 GPIO8 UART_DSR VIO
45 GND
46 D- Not used for AT module variants VUSB
47 D+ Not used for AT module variants VUSB
48 GPIO6 RF_ACTIVE VIO
49 GPIO5 WLAN_ACTIVE VIO
50 GPIO3 BT_PRIORITY VIO
Note: 1. Unused pins may have internal connections and must not be connected. 2. Reset input is active low. Input is pulled up to VDD_IN via 22k. Minimum reset pulse width is 5 ms. 3. Pins 8 – 11 (SPI related) are only for Laird internal production purposes. 4. Pins 25-37 should be left not connected on modules with integrated antenna
2.3 Operating Parameters
Table 3: Operating Parameters Recommended Operating Conditions OPERATING CONDITION MIN MAX VDD_USB (USB compatibility not required) 1.7 3.6 VDD_USB (USB compatibility required) 3.1 3.6 VDD_IO 1.7 3.3 VDD_IN 3.0 3.3
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2.4 Voltage Specifications
Table 4: Voltage Specifications - VUSB Logic Levels (VUSB) INPUT VOLTAGE LEVELS MIN TYP MAX Vih 0.7VDD_USB Vil 2.7<VDD_USB<3.0 -0.4 +0.8 OUTPUT VOLTAGE LEVELS (1.7<VDD_USB<1.9) Voh (Iout = -4mA) VDD_USB – 0.4 Vol (Iout = 4mA) 0.4 OUTPUT VOLTAGE LEVELS (2.7<VDD_USB<3.0) Voh (Iout = -4mA) VDD_USB – 0.2 Vol (Iout = 4mA) 0.2 Note: VDD_USB must be connected to power the USB and UART interfaces. Table 5: Voltage Specifications - VIO Logic Levels (VIO) INPUT VOLTAGE LEVELS MIN TYP MAX Vih 0.7VDD_IO Vil 2.7<VDD_IO<3.0 -0.4 +0.8 OUTPUT VOLTAGE LEVELS (1.7<VDD_USB<1.9) Voh (Iout = -4mA) VDD_IO – 0.4 Vol (Iout = 4mA) 0.4 OUTPUT VOLTAGE LEVELS (2.7<VDD_USB<3.0) Voh (Iout = -4mA) VDD_IO – 0.2 Vol (Iout = 4mA) 0.2
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3 APPLICATION NOTE FOR SURFACE MOUNT MODULES
3.1 Introduction
Laird Technologies surface mount modules are designed to conform to all major manufacturing guidelines. This application note is intended to provide additional guidance beyond the information that i s presented in the User Manual. This Application Note is considered a living document and will be updated as new information is presented. The modules are designed to meet the needs of a number of commercial and industrial applications. The modules are designed to be easily manufactured and conform to current automated manufacturing processes.
3.2 Shipping
Modules are shipped in ESD (Electrostatic Discharge) safe trays that can be loaded into most manufacturers pick and place machines. Layouts of the trays are provided in Figure 1 and Figure 2. Figure 1: BTM430 and BTM431 Shipping Tray Details
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3.3 Reflow Parameters
Laird Technologies surface mount modules are designed to be easily manufactured including reflow soldering to a PCB. Ultimately it is the responsibility of the customer to choose the appropriate solder paste and to ensure oven temperatures during reflow meet the requirements of the solder paste. Laird Technologies’ surface mount modules conform to J-STD-020D1 standards for reflow temperatures. Important: During reflow, modules should not be above 260° and not for more than 30 seconds. Figure 2: Recommended Reflow Temperature Temperatures should not exceed the minimums or maximums presented in Table 6. Table 6: Recommended Maximum and minimum temperatures Recommended Max & Min's SPECIFICATION VALUE UNIT Temperature Inc./Dec. Rate (max) 3 °C / Sec Temperature Decrease rate (goal) 2-3 °C / Sec Soak Temp Increase rate (goal) .5 - 1 °C / Sec Flux Soak Period (Min) 60 Sec Flux Soak Period (Max) 90 Sec Flux Soak Temp (Min) 150 °C Flux Soak Temp (max) 190 °C Time Above Liquidous (max) 60 Sec Time Above Liquidous (min) 20 Sec Time In Target Reflow Range (goal) 30 Sec Time At Absolute Peak (max) 30 Sec Liquidous Temperature (SAC305) 217 °C Lower Target Reflow Temperature 225 °C Upper Target Reflow Temperature 250 °C Absolute Peak Temperature 260 °C
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4 FCC REGULATORY STATEMENTS
4.1 BTM430 FCC and Industry Canada Statements
The Final Equipment user manual must show the following statements: This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. To comply with the FCC RF exposure compliance requirements, this device and its antenna must no t be co-located or operating to conjunction with any other antenna or transmitter. Considerations for OEM integration: This module has a limited modular approval. Approval with any other antenna configuration or layout other than that approved will necessitate additional radiated emission testing to be performed. To inherit the modular approval, the antennas for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. This module was approved with the following antenna: RF Solutions: ANT-24G-WHJ-SMA 0dBi Operation of this module with any other antenna will require additional testing to be performed. Co-location with other radio transmitting devices operating concurrently in the same band will require additional testing and certification. Designers should note the distinction that the FCC makes regarding portable and mobile devices. Mobile devices are defined as products that are not used closer than 20cm to the human body, whereas portable devices can be used closer that 20cm to the body. A device may be used in portable exposure conditions with no restrictions on host platforms when the averaged output power is less than the low power threshold for an uncontrolled environment ≤ 60/f (GHz) i.e. 25 mW for a 2.4 GHz device. The maximum Power Exposure for the BTM430 has been evaluated and found to comply with the low power threshold for an uncontrolled environment. Refer to FCC document KDB 447498 for more information on RF exposure procedures and equipment authorization policies for mobile and portable devices. FCC Labeling requirement If the FCC ID is not visible when the module is installed inside another device, then th e outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: PI4410B” or “Contains FCC ID: PI4410B.” Any similar wording that expresses the same meaning may be used.
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4.2 BTM431 FCC and Industry Canada Statements
The user manual must show the following statements: This device complies with part 15 of the FCC Rules. Operation is subject to the following two co nditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. To comply with the FCC RF exposure compliance requirements, this device and its antenna must not be co-located or operating to conjunction with any other antenna or transmitter. Considerations for OEM integration: To inherit the modular approval, the antennas for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. Co-location with other radio transmitting devices operating concurrently in the same band will require additional testing and certification. Designers should note the distinction that the FCC makes regarding portable and mobile devices. Mobile devices are defined as products that are not used closer than 20cm to the human body, whereas portable devices can be used closer that 20cm to the body. A device may be used in portable exposure conditions with no restrictions on host platforms when the averaged output power is less than the low power threshold for an uncontrolled environment ≤ 60/f (GHz) i.e. 25 mW for a 2.4 GHz device. The Maximum Power Exposure for the BTM431 has been evaluated and found to comply with the low power threshold for an uncontrolled environment. Refer to FCC document KDB 447498 for more information on RF exposure procedures and equipment authorization policies for mobile and portable devices. FCC Labelling requirement If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: PI4411B” or “Contains FCC ID: PI4411B.” Any similar wording that expresses the same meaning may be used.
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5 EU DECLARATION OF CONFORMITY – BTM430 / BTM431
Manufacturer: Laird Product: BTM410 / BTM411 / BTM420 / BTM421 / BTM430 / BTM431 / BTM441 / BTM443 / BTM461 EU Directive: RTTE 1995/5/EC Conformity Assessment: Annex IV
1.1 Reference Standards used for Presumption of Conformity
Article Number Requirement Reference standard(s) 3.1a Health and Safety EN 60950-1:2005 (2nd Ed); +Am1:2009 +Am2:2013 EN 60950-1:2006+A11+a1:2010+A12:2011+A2:2013 3.1a RF Exposure EN 62479:2010 3.1b Protection requirements with respect to electromagnetic compatibility EN 301 489-1 V1.9.2 (2011-09) EN 301 489-17 V2.2.1 (2012-09) Emissions: EN55022:2010 /AC:2011 (ClassB) Immunity: EN61000-4-2:2009 EN61000-4-3:2006 /A1:2008 /A2:2010
3.2 Means of the efficient use of
EN 300 328 V1.8.1 (2012-06)
1.2 Declaration:
We, Laird, declare under our sole responsibility that the essential radio test suites have been carried out and that the above product to which this declaration relates is in conformity with all the applicable essential requirements of Article 3 of the EU Directive 1995/5/EC, when used for its intended purpose. Place of Issue: Laird 11160 Thompson Ave. Lenexa, KS 66219 Date of Issue: October 2009 Name of Authorized Person: Daniel Waters / Certifications Specialist
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6 MECHANICAL DETAILS
6.1 BTM430 Mechanical Details
Module Keep-Out Area: An area of 1.5mm around the module should be reserved as a keep-out area. No other components should be placed in this area.
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6.2 BTM430 Mechanical Details
Module Keep-Out Area: An area of 1.5mm around the module should be reserved as a keep-out area. No other components should be placed in this area. The Development Kit Schematics for this product can be accessed from the following link: Development Kit Schematics – BTM430 / BTM431
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6.3 BTM430 Mechanical Details
WARNING: Test point dimensions are for reference only. DO NOT make electrical connections to these test points, this will void the warranty. Laird does not recommend routing on the top layer underneath the module.
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6.4 BTM431 Mechanical Details
Module Keep-Out Area: An area of 1.5mm around the module should be reserved as a keep-out area. No other components should be placed in this area. The Development Kit Schematics for this product can be accessed from the following link: Development Kit Schematics – BTM430 / BTM431
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6.5 BTM431 Mechanical Details
Module Keep-Out Area: An area of 1.5mm around the module should be reserved as a keep-out area. No other components should be placed in this area. The Development Kit Schematics for this product can be accessed from the following link: Development Kit Schematics – BTM430 / BTM431
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6.6 BTM431 Mechanical Details
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6.7 BTM431 Mechanical Details
WARNING: Test point dimensions are for reference only. DO NOT make electrical connections to these test points, this will void the warranty. Laird does not recommend routing on the top layer underneath the module.
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7 ORDERING INFORMATION
BTM430 Bluetooth AT Data Module (external antenna) BTM431 Bluetooth AT Data Module (with integrated antenna) DVK – BTM430 Development board with BTM430 module soldered in place DVK – BTM431 Development board with BTM431 module soldered in place
7.1 General Comments
This is a preliminary datasheet. Please check with Laird Technologies for the latest information before commencing a design. If in doubt, ask. Refer to the schematic BTDMD-R-001.pdf for the Development Kit on the following two pages for examples of typical pin connections. A pdf of the schematic can be downloaded from the product web page.
8 BLUETOOTH SIG QUALIFICATION
The BTM430 and BTM431 modules are listed on the Bluetooth SIG website as qualified End Products. Design Name Owner Declaration ID Link to listing on the SIG website BTM430, BTM431 Laird Technologie s B016510 https://www.bluetooth.org/tpg/QLI_viewQDL.cfm?qid=16510 It is a mandatory requirement of the Bluetooth Special Interest Group (SIG) that every product implementing Bluetooth technology has a Declaration ID. Every Bluetooth design is required to go through the qualification process, even when referencing a Bluetooth Design that already has its own Declaration ID. The Qualification Process requires each company to registered as a member of the Bluetooth SIG – www.bluetooth.org The following link provides a link to the Bluetooth Registration page: https://www.bluetooth.org/login/register/ For each Bluetooth Design it is necessary to purchase a Declaration ID. This can be done before starting the new qualification, either through invoicing or credit card payment. The fees for the Declaration ID will depend on your membership status, please refer to the following webpage: https://www.bluetooth.org/en-us/test-qualification/qualification-overview/fees For a detailed procedure of how to obtain a new Declaration ID for your design, please refer to the following SIG document: https://www.bluetooth.org/DocMan/handlers/DownloadDoc.ashx?doc_id=283698 &vId=317486 To start the listing, go to: https://www.bluetooth.org/tpg/QLI_SDoc.cfm In step 1, select the option, Reference a Qualified Design and enter 16510 in the End Product table entry. You can then select your pre-paid Declaration ID from the drop down menu or go to the Purchase Declaration ID page, (please note that unless the Declaration ID is pre-paid or purchased with a credit card, it will not be possible to proceed until the SIG invoice is paid.
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8.1 Additional Assistance
Please contact your local sales representative or our support team for further assistance: Laird Technologies Connectivity Products Business Unit Support Centre: http://ews-support.lairdtech.com Email: wireless.support@lairdtech.com Phone: Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Web: http://www.lairdtech.com/bluetooth
9 RELATED DOCUMENTS
The following additional BTM430/431 technical documents are also available from the Laird BTM430/431 product page under the Documentation tab: Product Brief User Guide Firmware Release Notes – Version 11.28.1.0 Development Kit Schematics
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Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Laird Technologies is the world leader in the design and manufacture of customized, performance -critical products for wireless and other advanced electronics applications. Laird Technologies partners with its customers to find solutions for applications in various industries such as: Network Equipment Telecommunications Data Communications Automotive Electronics Computers Aerospace Military Medical Equipment Consumer Electronics Laird Technologies offers its customers unique product solutions, dedication to research and development, as well as a seamless network of manufacturing and customer support facilities across the globe. CONN-HIG-BTM430-431 Copyright © 2014 Laird Technologies, Inc. All rights reserved. The information contained in this manual and the accompanying software programs are copyrighted and all rights are reserved by Laird Technologies, Inc. Laird Technologies, Inc. reserves the right to make periodic modifications of this product without obligation to notify any person or entity of such revision. Copying, duplicating, selling, or otherwise distributing any part of this product or accompanying documentation/software without the prior consent of an authorized representative of Laird Technologies, Inc. is strictly prohibited. All brands and product names in this publication are registered trademarks or trademarks of their respective holders. This material is preliminary. Information furnished by Laird Technologies in this specification is believed to be accurate. Devices sold by Laird Technologies are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. Laird Technologies makes no warranty, express, statutory, and implied or by description, regarding the information set forth herein. Laird Technologies reserves the right to change specifications at any time and without notice. Laird Technologies’ products are intended for use in normal commercial and industrial applications. Applications requiring unusual environmental requirements such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional testing for such application. Limited Warranty, Disclaimer, Limitation of Liability