BTD7520J3 CYSTEKEC | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 6

Technical content

Features

  • High BVCEO
  • Very high current gain
  • Pb-free package Symbol Outline BTD7520J3 TO-252 B C E B：Base C：Collector E：Emitter Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Limits Unit Collector-Base V oltage VCBO 150 V Collector-Emitter V oltage VCEO 150 V Emitter-Base V oltage VEBO 6 V Collector Current (DC) IC 10 Collector Current (Pulse) ICP 20 (Note 1) A Power Dissipation @ TA=25℃ PD 1.75 (Note 2) Power Dissipation @ TC=25℃ PD 20 W Thermal Resistance, Junction to Ambient RθJA 71.4 (Note 2) °C/W Thermal Resistance, Junction to Case RθJC 3.125 °C/W Junction Temperature Tj 150 °C Storage Temperature Tstg -55~+150 °C Note : 1. Single Pulse , Pw≦380μs,Duty≦2%. 2. When mounted on a PCB with the minimum pad size.

CYStech Electronics Corp. Spec. No. : C614J3 Issued Date : 2008.07.11 Revised Date : Page No. : 2/6 BTD7520J3 CYStek Product Specification Characteristics (Ta=25°C) Symbol Min. Typ. Max. Unit Test Conditions BVCBO 150 - - V IC=1mA, IE=0 BVCEO 150 - - V IC=10mA, IB=0 BVEBO 6 - - V IC=100μA, IC=0 ICBO - - 10 μA VCB=150V , IE=0 IEBO - - 10 μA VEB=6V , IC=0 *VCE(sat) - - 2.5 V IC=5A, IB=50mA *VBE(sat) - - 1.2 V IC=5A, IB=10mA *hFE 800 - - - VCE=5V , IC=1A *hFE 200 - - - VCE=5V , IC=5A Cob - 130 - pF VCB=10V , f=1MHz *Pulse Test : Pulse Width ≤380μs, Duty Cycle≤2%

Ordering Information

Device Package Shipping Marking BTD7520J3 TO-252 (Pb-free) 2500 pcs / Tape & Reel D7520

CYStech Electronics Corp. Spec. No. : C614J3 Issued Date : 2008.07.11 Revised Date : Page No. : 3/6 BTD7520J3 CYStek Product Specification Characteristic Curves Current Gain vs Collector Current 100 1000 10000 1 10 100 1000 10000 Collector Current---IC(mA) Current Gain---HFE VCE=10V VCE=5V Saturation Voltage vs Collector Current 100 1000 10000 1 10 100 1000 10000 Collector Current---IC(mA) Saturation Voltage---(mV) IC=100I IC=20IB IC=50IB VCESAT Saturation Voltage vs Collector Current 100 1000 10000 1 10 100 1000 10000 Collector Current---IC(mA) Saturation Voltage---(mV) VBE(SAT) IC=60IB IC=10IB Power Derating Curve 0.25 0.5 0.75 1.25 1.5 1.75 0 50 100 150 200 Ambient Temperature---TA(℃) Power Dissipation---PD(W) Power Derating Curve 0 50 100 150 200 Case Temperature---TC(℃) Power Dissipation---PD(W)

CYStech Electronics Corp. Spec. No. : C614J3 Issued Date : 2008.07.11 Revised Date : Page No. : 4/6 BTD7520J3 CYStek Product Specification Reel Dimension Carrier Tape Dimension

CYStech Electronics Corp. Spec. No. : C614J3 Issued Date : 2008.07.11 Revised Date : Page No. : 5/6 BTD7520J3 CYStek Product Specification Recommended wave soldering condition Soldering Time Product Peak Temperature Pb-free devices 260 +0/-5 °C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3°C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183°C 60-150 seconds 217°C 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5°C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6°C/second max. 6°C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface.

CYStech Electronics Corp. Spec. No. : C614J3 Issued Date : 2008.07.11 Revised Date : Page No. : 6/6 BTD7520J3 CYStek Product Specification TO-252 Dimension *: Typical B A C E H I J K D F GL D7520 Marking: Style: Pin 1.Base 2.Collector 3.Emitter 3-Lead TO-252 Plastic Surface Mount Package CYStek Package Code: J3 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material:

  • Lead: KFC; solder plating
  • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.