BT245

SN54BCT245_07 TI | Alldatasheet

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SN54BCT245, SN74BCT245 OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCBS013H – SEPTEMBER 1998 – REVISED MAY 2002 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 /C0068 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers /C0068 ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A)

description

These octal bus transceivers are designed for asynchronous communication between data buses. The devices transmit data from the A bus to the B bus or from the B bus to the A bus, depending upon the level at the direction-control (DIR) input. The output-enable (OE ) input can be used to disable the device so the buses are effectively isolated.

ORDERING INFORMATION

TA PACKAGE † ORDERABLE PART NUMBER TOP-SIDE MARKING PDIP – N Tube SN74BCT245N SN74BCT245N SOIC DW Tube SN74BCT245DW BCT245 0°Ct o7 0°C SOIC – DW Tape and reel SN74BVT245DWR BCT245 0°C to 70°C SOP – NS Tape and reel SN74BCT245NSR BCT245 SSOP – DB Tape and reel SN74BCT245DBR BT245 TSSOP – PW Tape and reel SN74BCT245PWR BT245 CDIP – J Tube SNJ54BCT245J SNJ54BCT245J –55°C to 125°C CFP – W Tube SNJ54BCT245W SNJ54BCT245W LCCC – FK Tube SNJ54BCT245FK SNJ54BCT245FK † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DIR GND V CC OE SN54BCT245 ...J O R W PACKAGE SN74BCT245 . . . DB, DW, N, NS, OR PW PACKAGE (TOP VIEW) 3 2 1 20 19 91 0 1 1 1 2 1 3 SN54BCT245 . . . FK PACKAGE (TOP VIEW)A2 DIR B6 OE GND VCC Copyright  2002, Texas Instruments Incorporated Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters.

SN54BCT245, SN74BCT245 OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCBS013H – SEPTEMBER 1998 – REVISED MAY 2002

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logic diagram (positive logic) DIR OE To Seven Other Channels absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7.

SN54BCT245, SN74BCT245 OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCBS013H – SEPTEMBER 1998 – REVISED MAY 2002 3POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 recommended operating conditions (see Note 3) SN54BCT245 SN74BCT245 UNIT MIN NOM MAX MIN NOM MAX UNIT VCC Supply voltage 4.5 5 5.5 4.5 5 5.5 V VIH High-level input voltage 2 2 V VIL Low-level input voltage 0.8 0.8 V IIK Input clamp current –18 –18 mA IOH High level output current A port –3 –3 mAIOH High-level output current B port –12 –15 mA IOL Low level output current A port 20 24 mAIOL Low -level output current B port 48 64 mA TA Operating free-air temperature –55 125 0 70 °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS SN54BCT245 SN74BCT245 UNITPARAMETER TEST CONDITIONS MIN TYP † MAX MIN TYP † MAX UNIT VIK VCC = 4.5 V, II = –18 mA –1.2 –1.2 V A port VCC =45V IOH = –1 mA 2.5 3.4 2.5 3.4 A port VCC = 4.5 V IOH = –3 mA 2.4 3.3 2.4 3.3 VOH IOH = –3 mA 2.4 3.3 2.4 3.3 V B port VCC = 4.5 V IOH = –12 mA 2 3.2 IOH = –15 mA 2 3.1 A port VCC =45V IOL = 20 mA 0.3 0.5 VOL A port VCC = 4.5 V IOL = 24 mA 0.35 0.5 VVOL B port VCC =45V IOL = 48 mA 0.38 0.55 V B port VCC = 4.5 V IOL = 64 mA 0.42 0.55 I A or B port VCC =55V VI=55V 1 1 mAII Control input VCC = 5.5 V, VI = 5.5 V 0.1 0.1 mA I ‡ A or B port VCC =55V VI=27V 70 70 µAIIH‡ Control input VCC = 5.5 V, VI = 2.7 V 20 20 µA I ‡ A or B port VCC =55V VI=05V –0.65 –0.65 mAIIL‡ Control input VCC = 5.5 V, VI = 0.5 V –1.2 –1.2 mA I § A port VCC =55V VO =0 –60 –150 –60 –150 mAIOS § B port VCC = 5.5 V, VO = 0 –100 –225 –100 –225 mA ICCL A to B VCC = 5.5 V 57 90 57 90 mA ICCH A to B VCC = 5.5 V 36 57 36 57 mA ICCZ VCC = 5.5 V 10 15 10 15 mA C i Control input VCC = 5 V, VI = 2.5 V or 0.5 V 7 7 pF C i A to B VCC =5V VO =25Vo r05V 9 9 pFC io B to A VCC = 5 V, VO = 2.5 V or 0.5 V 12 12 pF † All typical values are at VCC = 5 V, TA = 25°C. ‡ For I/O ports, the parameters IIH and IIL include the off-state output current. § Not more than one output should be tested at a time, and the duration of the test should not exceed one second.

SN54BCT245, SN74BCT245 OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCBS013H – SEPTEMBER 1998 – REVISED MAY 2002

4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

switching characteristics (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) VCC = 5 V, C L = 50 pF, R1 = 500 Ω , R2 = 500 Ω , TA = 25°C VCC = 4.5 V to 5.5 V, C L = 50 pF, R1 = 500 Ω , R2 = 500 Ω , TA = MIN to MAX† UNIT ′BCT245 SN54BCT245 SN74BCT245 MIN TYP MAX MIN MAX MIN MAX tPLH Ao rB Bo rA 1 4.4 6 1 7.2 1 7 ns tPHL A or B B or A ns tPZH OE Ao rB ns tPZL OE A or B ns tPHZ OE Ao rB ns tPLZ OE A or B ns † For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.

NOTES: A. C L includes probe and jig capacitance. B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, tr = tf ≤ 2.5 ns, duty cycle = 50%. C. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. D. The outputs are measured one at a time with one transition per measurement. E. When measuring propagation delay times of 3-state outputs, switch S1 is open. Figure 1. Load Circuit and Voltage Waveforms

SN54BCT245, SN74BCT245 OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCBS013H – SEPTEMBER 1998 – REVISED MAY 2002

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TYPICAL CHARACTERISTICS † Figures 2 through 5 show the typical power dissipation for an SN74BCT245 over variations in outputs switching, output frequency, and capacitive load. VCC = 5.5 V TA = 70°C R L = 500 Ω Air Flow = 0 C L = 15 pF VCC = 5.5 V TA = 70°C R L = 500 Ω Air Flow = 0 C L = 100 pF VCC = 5.5 V TA = 70°C R L = 500 Ω Air Flow = 0 C L = 150 pF VCC = 5.5 V TA = 70°C R L = 500 Ω Air Flow = 0 C L = 50 pF f – Frequency – MHz f – Frequency – MHz f – Frequency – MHz f – Frequency – MHz 10 20 30 40 750 600 450 300 150 900 Four Switching 10 20 30 40 1250 1000 750 500 250 1500 1250 1000 750 500 250 1500 10 20 30 40 10 20 30 40 Four Switching One Switching Four Switching Eight Switching Eight Switching 1000 800 600 400 200 1200 1050 05 0 1400 500 POWER DISSIPATION vs FREQUENCY POWER DISSIPATION vs FREQUENCY POWER DISSIPATION vs FREQUENCY POWER DISSIPATION vs FREQUENCY 1750 05 0 1750 05 0 P – Power Dissipation – mWD One Switching Figure 2 Figure 3 Figure 4 Figure 5 P – Power Dissipation – mWD P – Power Dissipation – mWD P – Power Dissipation – mWD Eight Switching Four Switching One Switching One Switching Eight Switching † The dashed lines are for the DB package only.

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) 5962-9051401M2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type 5962-9051401MRA ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type 5962-9051401MSA ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type SN74BCT245DBLE OBSOLETE SSOP DB 20 TBD Call TI Call TI SN74BCT245DBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74BCT245DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74BCT245DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74BCT245DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74BCT245DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74BCT245DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74BCT245DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74BCT245DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74BCT245DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74BCT245N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74BCT245NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74BCT245NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74BCT245NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74BCT245PW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74BCT245PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74BCT245PWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74BCT245PWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74BCT245PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74BCT245PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54BCT245FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54BCT245J ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type SNJ54BCT245W ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. PACKAGE OPTION ADDENDUM www.ti.com 28-May-2007 Addendum-Page 1

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 28-May-2007 Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 19-May-2007 Pack Materials-Page 1

Device Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W (mm) Pin1 Quadrant SN74BCT245DBR DB 20 MLA 330 16 8.2 7.5 2.5 12 16 Q1 SN74BCT245DWR DW 20 MLA 330 24 10.8 13.0 2.7 12 24 Q1 SN74BCT245NSR NS 20 MLA 330 24 8.2 13.0 2.5 12 24 Q1 SN74BCT245PWR PW 20 MLA 330 16 6.95 7.1 1.6 8 16 Q1 TAPE AND REEL BOX INFORMATION Device Package Pins Site Length (mm) Width (mm) Height (mm) SN74BCT245DBR DB 20 MLA 342.9 336.6 28.58 SN74BCT245DWR DW 20 MLA 333.2 333.2 31.75 SN74BCT245NSR NS 20 MLA 333.2 333.2 31.75 SN74BCT245PWR PW 20 MLA 342.9 336.6 28.58 PACKAGE MATERIALS INFORMATION www.ti.com 19-May-2007 Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 19-May-2007 Pack Materials-Page 3

MLCC006B – OCTOBER 1996 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 4040140/D 10/96

28 TERMINAL SHOWN

B 0.358 (9,09) MAX (11,63) 0.560 (14,22) 0.560 0.458 0.858 (21,8) 1.063 (27,0) (14,22) ANO. OF MINMAX 0.358 0.660 0.761 0.458 0.342 (8,69) MIN (11,23) (16,26) 0.640 0.739 0.442 (9,09) (11,63) (16,76) 0.962 1.165 (23,83) 0.938 (28,99) 1.141 (24,43) (29,59) (19,32)(18,78) 0.020 (0,51) TERMINALS 0.080 (2,03) 0.064 (1,63) (7,80) 0.307 (10,31) 0.406 (12,58) 0.495 (12,58) 0.495 (21,6) 0.850 (26,6) 1.047 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.035 (0,89) 0.010 (0,25) 121314151618 17 432 0.020 (0,51) 0.010 (0,25) 12826 27 B SQ A SQ 0.055 (1,40) 0.045 (1,14) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. This package can be hermetically sealed with a metal lid. D. The terminals are gold plated. E. Falls within JEDEC MS-004

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 4040065 /E 12/01

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8,20 7,40 0,55 0,95 0,25 12,90 12,30 10,50 8,50 Seating Plane 9,907,90 10,50 9,90 0,38 5,60 5,00 0,22 A 2016 6,506,50 0,05 MIN 5,905,90 DIM A MAX A MIN PINS ** 2,00 MAX 6,90 7,50 0,65 M0,15 0°–/C02578° 0,10 0,09 0,25 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-150

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,65 M0,10 0,10 0,25 0,50 0,75 0,15 NOM Gage Plane 9,80 9,60 7,90 7,70 2016 6,60 6,40 4040064/F 01/97 0,30 6,60 6,20 0,19 4,30 4,50 0,15 A 1,20 MAX 5,10 4,90 3,10 2,90 A MAX A MIN DIM PINS ** 0,05 4,90 5,10 Seating Plane 0°–8° NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-153

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