BT151-1000RT NXP | Alldatasheet
Document overview
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Technical content
1.1 General description
Passivated thyristor in a SOT78 plastic package.
1.2 Features
1.3 Applications
1.4 Quick reference data
12 A thyristor high blocking voltage high operating
Table 1. Pinning
BT151-1000RT_1 © NXP B.V. 2007. All rights reserved.
12 A thyristor high blocking voltage high operating temperature
Table 2. Ordering information Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).
BT151-1000RT_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 6 August 2007 3 of 12 NXP Semiconductors BT151-1000RT Form factor a = IT(RMS) / IT(AV) Fig 1. Total power dissipation as a function of average on-state current; maximum values f = 50 Hz Fig 2. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum values IT(AV) (A) 0 8642 003aab830 P tot (W) 2.8 2.2 1.9 conduction angle (degrees) form factor a 120 180 2.8 2.2 1.9 1.57 α a = 1.57 003aab829 120 160 ITSM (A) n (number of cycles)1 10310210 tp Tj initial = 25 °C max IT ITSM t
BT151-1000RT_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 6 August 2007 4 of 12 NXP Semiconductors BT151-1000RT tp ≤ 10 ms Fig 3. Non-repetitive peak on-state current as a function of pulse width for sinusoidal currents; maximum values f = 50 Hz; Tmb ≤ 134 °C Fig 4. RMS on-state current as a function of surge duration for sinusoidal currents Fig 5. RMS on-state current as a function of mounting base temperature; maximum values 001aaa956 tp (s) 10−5 10−210−310−4 102 103 ITSM (A) dlT/dt limit tp Tj initial = 25 °C max IT ITSM t surge duration (s) 10−2 10110−1 001aaa954 IT(RMS) (A) Tmb (°C) −50 150 10005 0 003aab828 IT(RMS) (A)
BT151-1000RT_1 © NXP B.V. 2007. All rights reserved. Table 4. Thermal characteristics
BT151-1000RT_1 © NXP B.V. 2007. All rights reserved. Table 5. Characteristics Tj = 25°C unless otherwise stated.
BT151-1000RT_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 6 August 2007 7 of 12 NXP Semiconductors BT151-1000RT Fig 7. Normalized gate trigger voltage as a function of junction temperature Fig 8. Normalized gate trigger current as a function of junction temperature Vo = 1.06 V R s = 0.0304Ω (1) Tj = 150°C; typical values (2) Tj = 150°C; maximum values (3) Tj = 25°C; maximum values Fig 9. On-state current as a function of on-state voltage Fig 10. Normalized latching current as a function of junction temperature Tj (°C) −50 150 10005 0 003aab823 0.8 1.2 1.6 0.4 V GT VGT(25°C) Tj (°C) −50 150 10005 0 003aab824 IGT IGT(25°C) VT (V) 02 1.50.5 1 001aaa959 I T (A) (3)(2)(1) Tj (°C) −50 150 10005 0 003aab825 IL IL(25°C)
BT151-1000RT_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 6 August 2007 8 of 12 NXP Semiconductors BT151-1000RT Fig 11. Normalized holding current as a function of junction temperature Fig 12. Critical rate of rise of off-state voltage as a function of junction temperature; typical values Tj (°C) −50 150 10005 0 003aab826 I H IH(25°C) 003aab827 103 102 104 dVD /dt (V/ms) Tj (°C) 0 150 10050
BT151-1000RT_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 6 August 2007 9 of 12 NXP Semiconductors BT151-1000RT
- Package outline Fig 13. Package outline SOT78 (3-lead TO-220AB) REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT78 SC-46 3-lead TO-220AB D D 1 q p L 123 e e b 0 5 10 mm scale Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB SOT78 DIMENSIONS (mm are the original dimensions) AE c Q UNIT A 1 b1 D 1 e p mm 2.54 qQA b Dc L2 max. 3.0 3.8 3.5 15.0 12.8 3.30 2.79 3.0 2.7 2.6 2.2 0.7 0.4 16.0 15.2 0.9 0.6 1.45 1.00 4.7 4.1 1.40 1.25 6.6 5.9 10.3 9.7 L1E L 05-03-22 05-10-25 mounting base
BT151-1000RT_1 © NXP B.V. 2007. All rights reserved. Table 6. Revision history
BT151-1000RT_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 6 August 2007 11 of 12 NXP Semiconductors BT151-1000RT
- Legal information
9.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
9.2 Definitions
Draft —The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet —A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
9.3 Disclaimers
General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes —NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use —NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications —Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values —Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale —NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license —Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
9.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 10. Contact information For additional information, please visit:http://www.nxp.com For sales office addresses, send an email to:salesaddresses@nxp.com Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.
NXP Semiconductors BT151-1000RT © NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 6 August 2007 Document identifier: BT151-1000RT_1 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 11. Contents