BSV06WAGN BVLED | Alldatasheet

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SPECIFICATIONS FOR BRIGHT VIEW ELECTRONICS SIDE VIEW LED MODEL : BSV06WAGN Bright View Electronics Date: 2008/02/18 Version-A

■ Description The PLCC2 type BSV06WAGN SIDE VIEW LED, with its light weight , enables smaller board size, higher packing density, reduced storage space and miniature applications.

  • Dice Material ： InGaN
  • Light Color ： White
  • Colloid Color ： Yellow ■ Features
  • 1 chip package
  • Compatible with automatic placement equipment
  • Compatible with reflow soldering process
  • Long operating life
  • Low forward voltage operated
  • Instant light
  • Pb -free/ RoHS compliant ■ Applications
  • Amusement equipment
  • Lighting for small size device
  • LCD back light unit
  • Information boards
  • Key pads
  • Light bar
  • Decoration
  • Marker lights Bright View Electronics Preliminary Version BSV06WAGN Date: 2008/02/18 Page: 1 of 12 Version-A

■ Outline Dimensions ( mm ) Tolerance : ± 0.25 mm Tolerance：± 0.1 mm ■ Recommended Soldering Pad Design Unit：mm ■ Part Numbering System B SV 06 W A G N Zener Code Materials Code L/F Code Color Code Outline Package Code Product Code ■ Sub Part Numbering : Please also refer to the label on product bags and cartons. Bright View Electronics BSV06WAGN 2.02 3.50 3.80 0.64 0.64 0.26 0.60 1.20 Date: 2008/02/18 Page: 2 of 12 Version-A

■ Absolute Maximum Ratings at Ta = 25 ℃ symbol UNIT Power Dissipation PD 114 mW Continuous Forward Current IF 30 m A Peak Forward Current ( 1/10 Duty Cycle , 10ms Pulse Width ) IFP 80 m A Reverse Voltage VR 5V Operating Temperature Range Topr oC Storage Temperature Range Tstg oC LED Junction Temperature Tj 100 oC Reflow Soldering Condition 260 ℃ for 10 seconds Tsld 2 times MIN. TYP. MAX. 1-- Viewing Angle at 50％ Iv IF=20mA μA Deg.2θ 1/2 10VR= 5VIR 3.8 V PARAMETER---- SYMBOL TEST CONDITION 3.2 ■ Electro-Optical Characteristics Condition : IF = 20mA ,Ta = 25°C UNIT －30 to ＋ 85 －40 to ＋ 100 BSV06WAGN MAX.PARAMETER 105 Bright View Electronics VALUES Date: 2008/02/18 Page: 3 of 12 Version-A

■ Bin Grade Limits ( I F = 20 mA* ) Luminous Intensity / mcd Unit mcd mcd mcd mcd mcd mcd mcd mcd mcd mcd mcd mcd mcd mcd mcd mcd 1. Luminous Intensity measurement allowance is 10%. ■ Bin Grade Limits ( I F = 20 mA* ) Chromaticity Coordinates Bin Bin x 0.2880 0.2820 0.2910 0.2960 y 0.2620 0.2720 0.2870 0.2760 *.Color Coordinates Measurement allowance is ± 0.01 Rank B80 1800 1850 Rank B90 1900 1950 1700 1650 Rank B75 1750 1800 Rank B60 Rank B65 1600 1650 Item Luminous Intensity 1 Rank B20 1200 1700 1550 Rank B85 Rank B95 Min 1250 1250 1500 1550 1600Rank B55 1300 1350 1400 1450 Rank B35 Rank B40 1500 Rank B45 Rank B50 B3 E2 C1 E3 Color Ranks BSV06WAGN 1900 2000 1750 Max 1300 1350 1400 1850 1950 1450 Bright View Electronics Rank B70 Rank B25 Rank B30 A3 D2 Color Ranks Date: 2008/02/18 Page: 4 of 12 Version-A

■ Chromaticity Diagram CIE 1931 ■ Bin Grade Limits ( I F = 20 mA* ) Forward Voltage Please contact our sales department for more information. Bright View Electronics BSV06WAGN 0.21 0.23 0.25 0.27 0.29 0.31 0.33 x y 450 455460 465 470 475 480 485 490 495 500 505 510 515 520 525 530 535 540 545 550 555 560 565 570 575 580 585 590 595 600 605 610 620 630 640 0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 x y Date: 2008/02/18 Page: 5 of 12 Version-A

■ Characteristics Data TYPICAL ELECTRICAL / OPTICAL CHARACTERISTIC CURVES FIG. 1 Forward Current vs. Forward Voltage Fig. 2 Relative Intensity vs. Forward Current Fig. 3 Relative Voltage vs. Temperature Fig. 4 Relative Intensity vs. Temperature Fig. 5 Relative Intensity vs. Wavelength (λP) Fig. 6 Derating Curve BSV06WAGN Bright View Electronics Forword Voltage VF (V) Forward Current IF (mA) 0.0 0.3 0.5 0.8 1.0 1.3 1.5 1.8 2.0 2.3 0 5 10 15 20 25 30 35 40 45 50 55 Forwrad Current IF (mA) Relative Luminous Flux Intensity 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 350 400 450 500 550 600 650 700 750 800 Wavelength (nm) Relative Intensity Ta=25℃ Ta=25℃ Ta=25℃ IF=20mA 100 1000 -40 -20 0 20 40 60 80 100 Ambient Temperature (℃) Relative Luminous Intensity 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 Ambient Temperature (℃) Forward Voltage (V) 0 1 02 03 04 05 06 07 08 09 0 1 0 0 Ambient Temperature(℃) Forward Current IF (mA) Date: 2008/02/18 Page: 6 of 12 Version-A

■ Radiation Characteristic Bright View Electronics BSV06WAGN 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Relative Intensity (a.u.) x y 90° 60° 30° 0° 30° 60° 0.5 1.0 90° 10° 20° 40° 50° 70° 80° Date: 2008/02/18 Page: 7 of 12 Version-A

■ Packaging ■ Package Carrier Tape Dimensions ( mm ) ■ Package Reel Dimensions Bright View Electronics BSV06WAGN 1.40 4.10 0.75 4.00 4.00 2.00 12.00 0.23 ITEM NO. DEVICE: Q'TY PCS. N. W.: KGS. G. W.: KGS. RE Y UNIT : mm Electronics Co.,Ltd. ELECTROSTATIC SENSITIVE DEVICES DO NOT OPEN OR HANDLE EXCEPT AT A STATIC-FREE WORKSTATION PART NO.: GRADE: LOT NO.: Bright View Q'ty pcs QA Anti-electrostatic bag Label Label Label UNIT : mm Label Carton Reel Date: 2008/02/18 Page: 8 of 12 Version-A

■ Reliability Test Items and Conditions (1)TEST ITEMS AND RESULTS (2)CRITERIA FOR JUDGING DAMAGE 10μA Criteria for Judgement Tsd=260℃ , 10secs (Pre treatment 30℃, 70%, 168hrs) 2 times Note Thermal Shock Temperature Cycle High Temperature Storage Low Temperature Storage Steady State Operating Life Condition 1 Steady State Operating Life 100 cycles 100 cycles Ta=100℃ 1000 hrs. 30min. 5min. 30min. 5min. Ta=-40℃ Steady State Operating Life of High Temperature Steady State Operating Life 0℃ ~ 100℃ 5min. 5min. Standard Test Method Test Conditions BSV06WAGN Test Item Resistance to Soldering Heat (Reflow Soldering) JEITA ED-4701 300 301 Bright View Electronics Condition 2 JEITA ED-4701 JEITA ED-4701 300 307 100 105 IF=20mA L.S.L.**) x 0.7 Forward Voltage Reverse Current Luminous Intensity 0/22Ta=25℃, IF=30mA, DC IF=20mA ━ U.S.L.*) x 1.2 Test Conditions Min MaxSymbol VF of High Humidity Heat Number of Damaged I R VR=5V ━ IV － 60℃, RH=90%, IF=20mA, DC 500 hrs. Ta=85℃, IF=8.5mA, DC 1000 hrs. 500 hrs. Item 200 201 JEITA ED-4701 JEITA ED-4701 200 202 1000 hrs. 1000 hrs. Ta=25℃, IF=20mA, DC Date: 2008/02/18 Page: 9 of 12 Version-A

■ Cautions (1) Moisture Proof Package ＊ The moisture proof package, a plastic bag with a zipper, is used to keep moisture to a minimum in the package. ＊ A package of a moisture absorbent material (silica gel) is also inserted into the plastic moisture proof bag and the silica gel changes its color from blue to pink as it absorbs moisture. ＊ The absorbed moisture in the SMT package may vaporize and expand during soldering. This may cause exfoliation of the contacts and damage to the optical characteristics of the LEDs. (2) Storage Conditions ＊ Before opening the package： The LEDs should be kept at 30℃ or less and 45~60% RH or less and should be used within a year. When storing the LEDs, moisture proof package with absorbent material (silica gel) is recommended. ＊ After opening the package： The LEDs should be kept at 30℃ or less and 55% RH or less and should be soldered within 168 hours (7days) after opening the package. The unused LEDs should be stored in moisture proof packages. ＊ It’s also recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again. ＊ If the moisture absorbent material (silica gel) has faded away or the SMD LEDs have exceeded the storage time, baking treatment ( more than 24 hours at 65+/-5℃) should be performed before soldering. (3) Heat Generation ＊ The thermal design of the end product is very important. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. ＊ The operating current should be decided after considering the ambient maximum temperature of LEDs. (4) Cleaning ＊ Isopropyl alcohol is recommended to be used as a solvent for cleaning the LEDs. ＊ Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur. BSV06WAGN Bright View Electronics Date: 2008/02/18 Page: 10 of 12 Version-A

(5) Soldering Reflow Soldering ( recommended )： ＊ To prevent from cracking, please bake ( 65℃, 24hrs )before soldering. ＊ When soldering, do not load stress on the LEDs during heating. ＊ Never take next process until the component is cooled down to room temperature after reflow. ＊ After soldering, do not warp the circuit board. ＊ The recommended reflow soldering profile ( measuring on the surface of the LED resin ) is the following: (a) Lead-Free Solder (b) Lead Solder Manual Soldering ( not recommended )： ＊ To prevent from cracking, please bake ( 65℃, 24hrs ) before soldering. ＊ Temperature at tip of iron: 250℃ Max. ( 25W ). ＊ It's banned to load any stress on the resin during soldering. ＊ Soldering time: 3 sec. Max. (for one time only) BSV06WAGN Bright View Electronics 1~5℃/sec TIME TEMPERATURE 255±5℃ Max. 10sec. Max. 120 sec. MAX. 60sec. MAX. Above 220℃ 1~5℃/sec Pre-heating 180~200℃ 2.5~5℃/sec TIME TEMPERATURE 240±5℃ Max. 10sec. Max. 120 sec. MAX. 60sec. MAX. Above 200℃ 2.5~5℃/sec Pre-heating 120~150℃ Date: 2008/02/18 Page: 11 of 12 Version-A

(6) ESD ( eletrostatic discharge ) protection ( base on machine mode ) ＊ The product is Gallium Nitride ( GaN ) based light emitting diode ( LED ) and is extremely sensitive to ESD. Users are strongly recommended to take necessary meter to test the static electricty and avoid ESD when handling this product. ＊ Proper grounding of machines ( via 1MΩ ), using static disspative mats, containers, working uniforms and shoes are considered to be effective against ESD. ＊ An ionizer is recommended in the facility or environment where ESD may be generated easily, and soldering iron with a grounded tip is also recommended. ＊ When inspecting the final products in which LEDs are assembled, it is recommended to check whether the assembled LEDs are damaged by ESD or not. It is simple to find dama ged LEDs by light-on or VF test at lower current ( below 1mA is recommended ). ＊ ESD damaged LEDs will show some unusual characteristics such as the remarkable increasing of leak current, the decreasing of forward voltage, or the LEDs do not light on at the low current. (7) Other ＊ Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum rating when using the LEDs with matrix drive. ＊ The LED light output is strong enough to injure human eyes. Precaution must be taken to prevent looking directly at the LEDs with unaided eyes for more than a few seconds. ＊ The LEDs described here are intended to be used for ordinary electronic equipment, please consult Bright View's sales department in advance for information on applications. ＊ Installing a protection device in the LED driving circuit to avoid surge current exceeding the max rating during on/off switching. ＊ The appearance and specifications of the product may be modified for improvement without notice. ＊ Please use the product within 168 hours after opening the seal and keep under 30 ℃ and 70% humidity. ＊ Bright View will not be responsible for any claim for damage if the user use the product without following the caution or instruction of the specification. BSV06WAGN Bright View Electronics Date: 2008/02/18 Page: 12 of 12 Version-A