BSS138BK MULTICOMP | Alldatasheet

Document overview

  • Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
  • PDF pages: 6

Technical content

Features

  • High density cell design for extremely low RDS(on)
  • Rugged and Reliable Application
  • Direct Logic-Level Interface: TTL/CMOS
  • Drivers: Relays, Solenoids, Lamps, Hammers, Display, Memories,Transistors, etc.
  • Battery Operated Systems
  • Solid-State Relays Absolute Maximum Ratings (Ta = 25°C Unless otherwise specified) Parameter Symbol Value Unit Drain-Source Voltage Vdss 60 V Gate-Source Voltage Vgss ±20 Continuous Drain Current Vgs =10V Id 0.36 AContinuous Drain Current Tamb = 100°C* Vgs =10V 0.23 Peak Drain Current Tamb = 25°C; single pulse; tp ≤ 10μs Idm 1.2 Total Power Dissipation** Ptot 350 mWTotal Power Dissipation* 420 Total Power Dissipation Tsp = 25°C 1140 Junction temperature Tj -55 to +150 °CAmbient temperature Tamb -55 to +150 Storage temperature Tstg -65 to +150 Source current Is 0.36 A Electrostatic discharge voltage HBM Vesd 1500 V Parameter Symbol Typ. Max. Unit Thermal resistance from junction to ambient* in free air Rth(j-a) 310 370 K/WThermal resistance from junction to ambient** - 300 Thermal resistance from junction to solder point Rth(j-sp) - 115 Thermal Resistance

Page <3> V1.003/01/23 N Channel MOSFET Newark.com/multicomp-pro Farnell.com/multicomp-pro sg.element14.com/b/multicomp-pro Reflow Profiles in Tabular Form Profile Feature Sn-Pb System Pb-Free System Average Ramp-Up Rate ~3°C/second ~3°C/second Preheat Temperature Range Time 150-170°C 60-180 seconds 150-200°C 60-180 seconds Time maintained above: Temperature Time 200°C 30-50 seconds 217°C 60-150 seconds Peak Temperature 235°C 260°C max. Time within +0 -5°C of actual Peak 10 seconds 40 seconds Ramp-Down Rate 3°C/second max. 6°C/second max. Recommended Wave Solder Profiles The Recommended solder Profile For Devices with Pb-free terminal plating where a Pb-free solder is used The Recommended solder Profile For Devices with Pb-free terminal plating used with leaded solder, or for devices with leaded terminal plating used with leaded solder

Page <4> V1.003/01/23 N Channel MOSFET Newark.com/multicomp-pro Farnell.com/multicomp-pro sg.element14.com/b/multicomp-pro Wave Profiles in Tabular Form Typical Characteristics Curves Profile Feature Sn-Pb System Pb-Free System Average Ramp-Up Rate ~200°C/second ~200°C/second Heating rate during preheat Typical 1-2, Max 4°C/sec Typical 1-2, Max 4°C/Sec Final preheat Temperature Within 125°C of Solder Temp. Within 125°C of Solder Temp. Peak Temperature 235°C 260°C max. Time within +0 -5°C of actual Peak 10 seconds 10 seconds Ramp-Down Rate 5°C/second max. 5°C/second max.

Page <5> V1.003/01/23 N Channel MOSFET Newark.com/multicomp-pro Farnell.com/multicomp-pro sg.element14.com/b/multicomp-pro

Page <6> V1.003/01/23 N Channel MOSFET Newark.com/multicomp-pro Farnell.com/multicomp-pro sg.element14.com/b/multicomp-pro Important Notice : This data sheet and its contents (the “Information”) belong to the members of the AVNET group of companies (the “Group”) or are licensed to it. No licence is granted for the use of it other than for information purposes in connection with the products to which it relates. No licence of any intellectual property rights is granted. The Information is subject to change without notice and replaces all data sheets previously supplied. The Information supplied is believed to be accurate but the Group assumes no responsibility for its accuracy or completeness, any error in or omission from it or for any use made of it. Users of this data sheet should check for themselves the Information and the suitability of the products for their purpose and not make any assumptions based on information included or omitted. Liability for loss or damage resulting from any reliance on the Information or use of it (including liability resulting from negligence or where the Group was aware of the possibility of such loss or damage arising) is excluded. This will not operate to limit or restrict the Group’s liability for death or personal injury resulting from its negligence. Multicomp Pro is the registered trademark of Premier Farnell Limited 2019. Part Number Table Description Part Number N Channel Plastic Encapsulate MOSFET, SOT 23 BSS138BK Diagram Suggested Pad Layout Pin configuration Dimensions : Millimetres 1. Gate 2. Source 3. Drain