BSS127_15 DIODES | Alldatasheet

Document overview

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  • PDF pages: 6

Technical content

Features

  • Low Input Capacitance
  • High BVDss rating for power application
  • Low Input/Output Leakage
  • Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • Qualified to AEC-Q101 Standards for High Reliability Mechanical Data
  • Case: SC59 / SOT23
  • Case Material: Molded Plastic “Green” Molding Compound. UL Flammability Classification Rating 94V-0
  • Moisture Sensitivity: Level 1 per J-STD-020
  • Terminals: Finish - Matte Ti n annealed over Copper leadframe Solderable per MIL-STD-202, Method 208
  • Terminal Connections: See Diagram
  • Weight: 0.008 grams (approximate) Ordering Information (Note 4) Part Number Case Packaging BSS127SSN-7 SC59 3000/Tape & Reel BSS127S-7 SOT23 3000/Tape & Reel Notes: 1. No purposely added lead. Fully EU Directiv e 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com for more in formation about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. For packaging details, go to our website at http://www.diodes.com. Marking Information Date Code Key Year 2009 2010 2011 2012 2013 2014 2015 Code W X Y Z A B C Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec Code 1 2 3 4 5 6 7 8 9 O N D SC59 Top View Equivalent Circuit Top View Source Gate Drain D G S SOT23 K28 = Product Type Marking Code YM = Date Code Marking Y = Year (ex: W = 2009) M = Month (ex: 9 = September) K28 YM K29 = Product Type Marking Code YM = Date Code Marking Y = Year (ex: W = 2009) M = Month (ex: 9 = September) SOT23 SC59 K29 YM

Document number: DS35476 Rev. 6 - 2 2 of 6 www.diodes.com January 2013 © Diodes Incorporated BSS127 Maximum Ratings (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Units Drain-Source Voltage VDSS 600 V Gate-Source Voltage VGSS ±20 V Continuous Drain Current (Note 5) VGS = 10V Steady State TA = +25°C TA = +70°C ID 50 40 mA Continuous Drain Current (Note 6) VGS = 10V Steady State TA = +25°C TA = +70°C ID 70 55 mA Continuous Drain Current (Note 5) VGS = 5V Steady State TA = +25°C TA = +70°C ID 45 35 mA Continuous Drain Current (Note 6) VGS = 5V Steady State TA = +25°C TA = +70°C ID 65 50 mA Pulsed Drain Current @ TSP = +25°C (Notes 7) I DM 0.16 A Thermal Characteristics Characteristic Symbol Value Units Power Dissipation, @TA = +25°C (Note 5) P D 0.61 W Thermal Resistance, Junction to Ambient @ TA = +25°C (Note 5) R θJA 204 °C/W Power Dissipation, @TA = +25°C (Note 6) P D 1.25 W Thermal Resistance, Junction to Ambient @ TA = +25°C (Note 6) R θJA 100 °C/W Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS (Note 8) Drain-Source Breakdown Voltage BVDSS 600 — — V VGS = 0V, ID = 250µA Zero Gate Voltage Drain Current TJ = +25°C I DSS — — 0.1 µA VDS = 600V, VGS = 0V Gate-Body Leakage IGSS — — ±100 nA VGS = ±20V, VDS = 0V ON CHARACTERISTICS (Note 8) Gate Threshold Voltage VGS(th) 3 — 4.5 V VDS = VGS, ID = 250µA Static Drain-Source On-Resistance RDS(ON) — 80 160 Ω VGS = 10V, ID = 16mA — 95 190 VGS = 5.0V, ID = 16mA Forward Transfer Admittance |Yfs| — 76 — mS VDS = 10V, ID = 16mA Diode Forward Voltage VSD — — 1.5 V VGS = 0V, IS = 16mA DYNAMIC CHARACTERISTICS (Note 9) Input Capacitance Ciss — 21.8 — pF VDS = 25V, VGS = 0V, f = 1.0MHz Output Capacitance Coss — 2.2 — Reverse Transfer Capacitance Crss — 0.3 — Total Gate Charge Qg — 1.08 — nC VGS = 10V, VDD = 300V, ID = 0.01A Gate-Source Charge Qgs — 0.08 — Gate-Drain Charge Qgd — 0.50 — Turn-On Delay Time tD(on) — 5.0 — ns VDD = 300V, VGS = 10V, RGEN = 6Ω, ID = 10mA Turn-On Rise Time tr — 7.2 — ns Turn-Off Delay Time tD(off) — 28.7 — ns Turn-Off Fall Time tf — 168 — ns Reverse Recovery Time Trr — 131 — ns VR =300 V, IF =0.016 A, di/dt = 100A/µs Reverse Recovery Charge Qrr — 32 — nC Notes: 5. Device mounted on FR-4 PCB with minimum recommended pad layout, single sided. 6. Device mounted on 1” x 1” FR-4 PCB with high coverage 2 oz. Copper, single sided. 7. Repetitive rating, pulse width limited by junction temperature, 10µs pulse, duty cycle = 1%. 8. Short duration pulse test used to minimize self-heating effect. 9. Guaranteed by design. Not subject to production testing.

Document number: DS35476 Rev. 6 - 2 5 of 6 www.diodes.com January 2013 © Diodes Incorporated BSS127 Package Outline Dimensions Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version. SC59 SOT23 Suggested Pad Layout Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. SC59 SC59 Dim Min Max Typ A 0.35 0.50 0.38 B 1.50 1.70 1.60 C 2.70 3.00 2.80 D - - 0.95 G - - 1.90 H 2.90 3.10 3.00 J 0.013 0.10 0.05 K 1.00 1.30 1.10 L 0.35 0.55 0.40 M 0.10 0.20 0.15 N 0.70 0.80 0.75 α 0° 8° - All Dimensions in mm SOT23 Dim Min Max Typ A 0.37 0.51 0.40 B 1.20 1.40 1.30 C 2.30 2.50 2.40 D 0.89 1.03 0.915 F 0.45 0.60 0.535 G 1.78 2.05 1.83 H 2.80 3.00 2.90 J 0.013 0.10 0.05 K 0.903 1.10 1.00 K1 - - 0.400 L 0.45 0.61 0.55 M 0.085 0.18 0.11 α 0° 8° - All Dimensions in mm Dimensions Value (in mm) Z 3.4 X 0.8 Y 1.0 C 2.4 E 1.35 A M J LD B C H K G N A M J L D F B C H K G X E Y CZ

Document number: DS35476 Rev. 6 - 2 6 of 6 www.diodes.com January 2013 © Diodes Incorporated BSS127 Suggested Pad Layout (cont.) SOT23 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries rese rve the right to make modifications, enhanc ements, improvements, corrections or ot her changes without further notice to this document and any product descri bed herein. Diodes Incorporated does not assume any liability ari sing out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applica tions shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Inco rporated products for any unintended or una uthorized application, Customers shall i ndemnify and hold Diodes Incorporated and its representativ es harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of t his document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical com ponents in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when proper ly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifi cations of their life support dev ices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or s ystems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporate d and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2013, Diodes Incorporated www.diodes.com Dimensions Value (in mm) Z 2.9 X 0.8 Y 0.9 C 2.0 E 1.35 X E Y CZ